DE69932456D1 - VERFAHREN UND VORRICHTUNG ZUR KüHLUNG VON INTEGRIERTEN SCHALTUNGEN, DIE RüCKSEITIG OPTISCH GEPRüFT WERDEN - Google Patents
VERFAHREN UND VORRICHTUNG ZUR KüHLUNG VON INTEGRIERTEN SCHALTUNGEN, DIE RüCKSEITIG OPTISCH GEPRüFT WERDENInfo
- Publication number
- DE69932456D1 DE69932456D1 DE69932456T DE69932456T DE69932456D1 DE 69932456 D1 DE69932456 D1 DE 69932456D1 DE 69932456 T DE69932456 T DE 69932456T DE 69932456 T DE69932456 T DE 69932456T DE 69932456 D1 DE69932456 D1 DE 69932456D1
- Authority
- DE
- Germany
- Prior art keywords
- chlusing
- ready
- integrated circuits
- optically tested
- optically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/221,284 US6140141A (en) | 1998-12-23 | 1998-12-23 | Method for cooling backside optically probed integrated circuits |
PCT/US1999/029710 WO2000039851A1 (en) | 1998-12-23 | 1999-12-15 | Method and apparatus for cooling backside optically probed integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69932456D1 true DE69932456D1 (de) | 2006-08-31 |
Family
ID=22827156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69932456T Expired - Lifetime DE69932456D1 (de) | 1998-12-23 | 1999-12-15 | VERFAHREN UND VORRICHTUNG ZUR KüHLUNG VON INTEGRIERTEN SCHALTUNGEN, DIE RüCKSEITIG OPTISCH GEPRüFT WERDEN |
Country Status (4)
Country | Link |
---|---|
US (1) | US6140141A (de) |
EP (1) | EP1153431B1 (de) |
DE (1) | DE69932456D1 (de) |
WO (1) | WO2000039851A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6480515B1 (en) | 2000-12-15 | 2002-11-12 | Xerox Corporation | Optically transparent, heat conductive fluid heat sink |
US6621275B2 (en) * | 2001-11-28 | 2003-09-16 | Optonics Inc. | Time resolved non-invasive diagnostics system |
US6836131B2 (en) | 2002-08-16 | 2004-12-28 | Credence Systems Corp. | Spray cooling and transparent cooling plate thermal management system |
US7102374B2 (en) * | 2002-08-16 | 2006-09-05 | Credence Systems Corporation | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis |
US6771500B1 (en) | 2003-03-27 | 2004-08-03 | Stmicroelectronics, Inc. | System and method for direct convective cooling of an exposed integrated circuit die surface |
US6995980B2 (en) * | 2003-08-21 | 2006-02-07 | Unisys Corporation | Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module |
US20050094706A1 (en) * | 2003-10-30 | 2005-05-05 | International Business Machines Corporation | Transparent cooling duct |
US20070291361A1 (en) * | 2006-06-19 | 2007-12-20 | Credence Systems Corporation | Lens housing with integrated thermal management |
US20070290702A1 (en) * | 2006-06-19 | 2007-12-20 | Credence Systems Corporation | System and method for thermal management and gradient reduction |
US7956625B1 (en) * | 2006-10-31 | 2011-06-07 | Dcg Systems, Inc. | Undoped silicon heat spreader window |
US8424594B2 (en) * | 2007-12-10 | 2013-04-23 | Presto Engineering, Inc. | Apparatus for thermal control in the analysis of electronic devices |
US20150214127A1 (en) * | 2014-01-24 | 2015-07-30 | Qualcomm Incorporated | Integrated device comprising a substrate with aligning trench and/or cooling cavity |
JP6736651B2 (ja) | 2018-12-27 | 2020-08-05 | 浜松ホトニクス株式会社 | 冷却ユニット、対物レンズモジュール、半導体検査装置、半導体検査方法 |
US11640930B2 (en) | 2019-09-05 | 2023-05-02 | Mediatek Inc. | Semiconductor package having liquid-cooling lid |
US20220130734A1 (en) * | 2020-10-26 | 2022-04-28 | Mediatek Inc. | Lidded semiconductor package |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02143466A (ja) * | 1988-11-25 | 1990-06-01 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
FR2671230B1 (fr) * | 1990-12-28 | 1993-04-16 | Telecommunications Sa | Doigt de refroidissement d'un circuit semi-conducteur et dispositif cryogenique pourvu d'un tel doigt. |
US5396068A (en) * | 1993-03-30 | 1995-03-07 | At&T Corp. | Method of making a semiconductor device including infrared imaging, and apparatus for use in the imaging |
NL9400766A (nl) * | 1994-05-09 | 1995-12-01 | Euratec Bv | Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling. |
US5895972A (en) * | 1996-12-31 | 1999-04-20 | Intel Corporation | Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug |
-
1998
- 1998-12-23 US US09/221,284 patent/US6140141A/en not_active Expired - Lifetime
-
1999
- 1999-12-15 WO PCT/US1999/029710 patent/WO2000039851A1/en active IP Right Grant
- 1999-12-15 EP EP99966246A patent/EP1153431B1/de not_active Expired - Lifetime
- 1999-12-15 DE DE69932456T patent/DE69932456D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1153431B1 (de) | 2006-07-19 |
US6140141A (en) | 2000-10-31 |
EP1153431A1 (de) | 2001-11-14 |
WO2000039851A1 (en) | 2000-07-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |