DE69932456D1 - VERFAHREN UND VORRICHTUNG ZUR KüHLUNG VON INTEGRIERTEN SCHALTUNGEN, DIE RüCKSEITIG OPTISCH GEPRüFT WERDEN - Google Patents

VERFAHREN UND VORRICHTUNG ZUR KüHLUNG VON INTEGRIERTEN SCHALTUNGEN, DIE RüCKSEITIG OPTISCH GEPRüFT WERDEN

Info

Publication number
DE69932456D1
DE69932456D1 DE69932456T DE69932456T DE69932456D1 DE 69932456 D1 DE69932456 D1 DE 69932456D1 DE 69932456 T DE69932456 T DE 69932456T DE 69932456 T DE69932456 T DE 69932456T DE 69932456 D1 DE69932456 D1 DE 69932456D1
Authority
DE
Germany
Prior art keywords
chlusing
ready
integrated circuits
optically tested
optically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69932456T
Other languages
English (en)
Inventor
L Davidson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Application granted granted Critical
Publication of DE69932456D1 publication Critical patent/DE69932456D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69932456T 1998-12-23 1999-12-15 VERFAHREN UND VORRICHTUNG ZUR KüHLUNG VON INTEGRIERTEN SCHALTUNGEN, DIE RüCKSEITIG OPTISCH GEPRüFT WERDEN Expired - Lifetime DE69932456D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/221,284 US6140141A (en) 1998-12-23 1998-12-23 Method for cooling backside optically probed integrated circuits
PCT/US1999/029710 WO2000039851A1 (en) 1998-12-23 1999-12-15 Method and apparatus for cooling backside optically probed integrated circuits

Publications (1)

Publication Number Publication Date
DE69932456D1 true DE69932456D1 (de) 2006-08-31

Family

ID=22827156

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69932456T Expired - Lifetime DE69932456D1 (de) 1998-12-23 1999-12-15 VERFAHREN UND VORRICHTUNG ZUR KüHLUNG VON INTEGRIERTEN SCHALTUNGEN, DIE RüCKSEITIG OPTISCH GEPRüFT WERDEN

Country Status (4)

Country Link
US (1) US6140141A (de)
EP (1) EP1153431B1 (de)
DE (1) DE69932456D1 (de)
WO (1) WO2000039851A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6480515B1 (en) 2000-12-15 2002-11-12 Xerox Corporation Optically transparent, heat conductive fluid heat sink
US6621275B2 (en) * 2001-11-28 2003-09-16 Optonics Inc. Time resolved non-invasive diagnostics system
US6836131B2 (en) 2002-08-16 2004-12-28 Credence Systems Corp. Spray cooling and transparent cooling plate thermal management system
US7102374B2 (en) * 2002-08-16 2006-09-05 Credence Systems Corporation Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
US6771500B1 (en) 2003-03-27 2004-08-03 Stmicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
US6995980B2 (en) * 2003-08-21 2006-02-07 Unisys Corporation Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module
US20050094706A1 (en) * 2003-10-30 2005-05-05 International Business Machines Corporation Transparent cooling duct
US20070291361A1 (en) * 2006-06-19 2007-12-20 Credence Systems Corporation Lens housing with integrated thermal management
US20070290702A1 (en) * 2006-06-19 2007-12-20 Credence Systems Corporation System and method for thermal management and gradient reduction
US7956625B1 (en) * 2006-10-31 2011-06-07 Dcg Systems, Inc. Undoped silicon heat spreader window
US8424594B2 (en) * 2007-12-10 2013-04-23 Presto Engineering, Inc. Apparatus for thermal control in the analysis of electronic devices
US20150214127A1 (en) * 2014-01-24 2015-07-30 Qualcomm Incorporated Integrated device comprising a substrate with aligning trench and/or cooling cavity
JP6736651B2 (ja) 2018-12-27 2020-08-05 浜松ホトニクス株式会社 冷却ユニット、対物レンズモジュール、半導体検査装置、半導体検査方法
US11640930B2 (en) 2019-09-05 2023-05-02 Mediatek Inc. Semiconductor package having liquid-cooling lid
US20220130734A1 (en) * 2020-10-26 2022-04-28 Mediatek Inc. Lidded semiconductor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143466A (ja) * 1988-11-25 1990-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
FR2671230B1 (fr) * 1990-12-28 1993-04-16 Telecommunications Sa Doigt de refroidissement d'un circuit semi-conducteur et dispositif cryogenique pourvu d'un tel doigt.
US5396068A (en) * 1993-03-30 1995-03-07 At&T Corp. Method of making a semiconductor device including infrared imaging, and apparatus for use in the imaging
NL9400766A (nl) * 1994-05-09 1995-12-01 Euratec Bv Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling.
US5895972A (en) * 1996-12-31 1999-04-20 Intel Corporation Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug

Also Published As

Publication number Publication date
EP1153431B1 (de) 2006-07-19
US6140141A (en) 2000-10-31
EP1153431A1 (de) 2001-11-14
WO2000039851A1 (en) 2000-07-06

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Legal Events

Date Code Title Description
8332 No legal effect for de