DE69908745D1 - Laserbearbeitungskopf - Google Patents

Laserbearbeitungskopf

Info

Publication number
DE69908745D1
DE69908745D1 DE69908745T DE69908745T DE69908745D1 DE 69908745 D1 DE69908745 D1 DE 69908745D1 DE 69908745 T DE69908745 T DE 69908745T DE 69908745 T DE69908745 T DE 69908745T DE 69908745 D1 DE69908745 D1 DE 69908745D1
Authority
DE
Germany
Prior art keywords
laser processing
processing head
head
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69908745T
Other languages
English (en)
Other versions
DE69908745T2 (de
Inventor
Yasumi Nagura
Michisuke Nayama
Takashi Ishide
Yoshio Hashimoto
Yukio Michishita
Koji Okimura
Tadashi Nagashima
Masao Watanabe
Takashi Akaba
Katsusuke Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Application granted granted Critical
Publication of DE69908745D1 publication Critical patent/DE69908745D1/de
Publication of DE69908745T2 publication Critical patent/DE69908745T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1438—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for directional control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
    • B23K26/348—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding in combination with arc heating, e.g. TIG [tungsten inert gas], MIG [metal inert gas] or plasma welding

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE69908745T 1999-01-14 1999-10-27 Laserbearbeitungskopf Expired - Lifetime DE69908745T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP00799999A JP3664904B2 (ja) 1999-01-14 1999-01-14 レーザ加工ヘッド
JP799999 1999-01-14

Publications (2)

Publication Number Publication Date
DE69908745D1 true DE69908745D1 (de) 2003-07-17
DE69908745T2 DE69908745T2 (de) 2004-04-22

Family

ID=11681103

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69908745T Expired - Lifetime DE69908745T2 (de) 1999-01-14 1999-10-27 Laserbearbeitungskopf

Country Status (4)

Country Link
US (2) US6294754B1 (de)
EP (1) EP1020249B1 (de)
JP (1) JP3664904B2 (de)
DE (1) DE69908745T2 (de)

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JP2001276988A (ja) * 2000-03-30 2001-10-09 Mitsubishi Heavy Ind Ltd レーザ加工装置
WO2001076806A1 (fr) * 2000-04-10 2001-10-18 Mitsubishi Heavy Industries, Ltd. Systeme de soudage
JP3686317B2 (ja) * 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
FR2813031B1 (fr) * 2000-08-21 2003-01-24 Air Liquide Procede et installation de soudage hybride laser-arc utilisant un laser a diodes de puissance
FR2817782B1 (fr) 2000-12-13 2003-02-28 Air Liquide Procede et installation de coupage laser avec tete de decoupe a double flux et double foyer
DE10113471B4 (de) * 2001-03-19 2005-02-17 Highyag Lasertechnologie Gmbh Verfahren zum Hybridschweißen mittels eines Laserdoppelfokus
US6777645B2 (en) * 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
FR2823688B1 (fr) * 2001-04-24 2003-06-20 Commissariat Energie Atomique Dispositif de fusion de matiere par faisceau laser
JP2002331377A (ja) * 2001-05-08 2002-11-19 Koike Sanso Kogyo Co Ltd レーザピアシング方法
DE10130199B4 (de) * 2001-06-22 2005-01-27 Lödige Automation GmbH Scannervorrichtung für einen Leistungslaser
US20030062126A1 (en) * 2001-10-03 2003-04-03 Scaggs Michael J. Method and apparatus for assisting laser material processing
US7012216B2 (en) * 2002-02-08 2006-03-14 Honeywell International Hand-held laser welding wand having internal coolant and gas delivery conduits
WO2003082511A1 (fr) * 2002-04-01 2003-10-09 Honda Giken Kogyo Kabushiki Kaisha Procede de soudage a l'arc de composite avec fil d'apport induit par laser yag et equipement de soudage
US20040094526A1 (en) * 2002-11-15 2004-05-20 Mccoy Edward D. Cutting laser beam nozzle assembly
US7379483B2 (en) * 2003-03-18 2008-05-27 Loma Linda University Medical Center Method and apparatus for material processing
US7057134B2 (en) * 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
US7038166B2 (en) * 2003-03-18 2006-05-02 Loma Linda University Medical Center Containment plenum for laser irradiation and removal of material from a surface of a structure
US7286223B2 (en) * 2003-03-18 2007-10-23 Loma Linda University Medical Center Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
US7880116B2 (en) * 2003-03-18 2011-02-01 Loma Linda University Medical Center Laser head for irradiation and removal of material from a surface of a structure
US7060932B2 (en) * 2003-03-18 2006-06-13 Loma Linda University Medical Center Method and apparatus for material processing
US7754999B2 (en) * 2003-05-13 2010-07-13 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same
US7038162B2 (en) 2003-11-13 2006-05-02 Honeywell International, Inc. Hand-held laser welding wand filler media delivery systems and methods
EP1568435B1 (de) * 2004-02-28 2009-04-15 Trumpf Laser- und Systemtechnik GmbH Laserbearbeitungsmaschine
WO2005104308A1 (ja) * 2004-04-21 2005-11-03 Mitsubishi Denki Kabushiki Kaisha ガスレーザ発振器およびガスレーザ加工機
DE102004025873A1 (de) * 2004-05-27 2005-12-22 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg Vorrichtung zum Schweißen oder Löten vermittels Laserstrahlung
EP1632305A1 (de) * 2004-09-04 2006-03-08 Trumpf Werkzeugmaschinen GmbH + Co. KG Verfahren zur Ermittlung und Verfahren zur Einstellung der gegenseitigen Lage der Achse eines Laserbearbeitungsstrahls und der Achse eines Prozessgasstrahls an einer Laserbearbeitungsmaschine sowie Laserbearbeitungsmaschine mit Einrichtungen zur Umsetzung der Verfahren
DE102005000631A1 (de) * 2005-01-03 2006-07-13 Siemens Ag Vorrichtung zum Laserstrahlschweißen an Mantelflächen von rotationssymmetrischen Bauteilen
CN100409993C (zh) * 2006-04-06 2008-08-13 龙岩理尚精密机械有限公司 数控激光切割头及其制造方法
US7851984B2 (en) * 2006-08-08 2010-12-14 Federal-Mogul World Wide, Inc. Ignition device having a reflowed firing tip and method of construction
FR2908677B1 (fr) * 2006-11-17 2009-02-20 Air Liquide Procede de soudage par faisceau laser a penetration amelioree
DE102007018400B4 (de) 2007-04-17 2009-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches System für einen Lasermaterialbearbeitungskopf
DE102007059987B4 (de) * 2007-12-11 2015-03-05 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum keyhole-freien Laserschmelzschneiden mittels vor- und nachlaufender Laserstrahlen
JP5398165B2 (ja) * 2008-04-24 2014-01-29 三菱重工業株式会社 レーザ・アーク複合溶接ヘッド及びその方法
KR101213309B1 (ko) * 2008-08-08 2012-12-18 파나소닉 주식회사 밀폐형 이차 전지 및 그 제조 방법
FR2936177B1 (fr) * 2008-09-24 2011-08-26 Air Liquide Procede de soudage laser de type co2 avec buse a jet dynamique.
DE102008053729C5 (de) * 2008-10-29 2013-03-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserbearbeitungsdüse zum Bearbeiten von Blechen
JP5358216B2 (ja) * 2009-02-23 2013-12-04 小池酸素工業株式会社 レーザ切断装置
CN102203983A (zh) * 2009-08-05 2011-09-28 松下电器产业株式会社 密闭型电池及其制造方法
KR101420950B1 (ko) * 2009-12-16 2014-07-18 이에스에이비 아베 용접 방법 및 용접 장치
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DE102010018686B4 (de) * 2010-04-22 2017-08-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Laser-Auftragschweißen mit pulverförmigem Zusatzwerkstoff
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JP2012035313A (ja) * 2010-08-10 2012-02-23 Ihi Corp レーザ切断方法
EP2667998B1 (de) 2011-01-27 2020-11-18 Bystronic Laser AG Laserbearbeitungsmaschine sowie verfahren zum zentrieren eines fokussierten laserstrahles
US9289852B2 (en) 2011-01-27 2016-03-22 Bystronic Laser Ag Laser processing machine, laser cutting machine, and method for adjusting a focused laser beam
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WO2013174449A1 (en) 2012-05-25 2013-11-28 European Space Agency Multi-wire feeder method and system for alloy sample formation and additive manufacturing
KR102096048B1 (ko) * 2012-10-10 2020-04-02 삼성디스플레이 주식회사 레이저 가공장치
JP6053598B2 (ja) * 2013-04-18 2016-12-27 株式会社アマダミヤチ レーザ切断方法、レーザ出射ユニット及びレーザ切断装置
EP2883647B1 (de) 2013-12-12 2019-05-29 Bystronic Laser AG Verfahren zur Konfiguration einer Laserbearbeitungsvorrichtung
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JP6807334B2 (ja) * 2015-05-13 2021-01-06 ルミレッズ ホールディング ベーフェー ダイレベルのリフトオフの最中におけるメカニカルダメージを低減するためのサファイアコレクタ
JP6190855B2 (ja) * 2015-09-08 2017-08-30 株式会社アマダホールディングス レーザ加工方法およびレーザ加工装置
JP6802550B2 (ja) * 2016-02-25 2020-12-16 国立研究開発法人日本原子力研究開発機構 二重管構造部の切断装置及び切断方法
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CN107363357A (zh) * 2017-09-20 2017-11-21 苏州大学 激光溶覆装置
KR101994996B1 (ko) * 2017-11-20 2019-07-02 한국생산기술연구원 전자빔을 이용한 미세홀 가공장치
JP6725605B2 (ja) 2018-08-24 2020-07-22 ファナック株式会社 レーザ加工システム、及びレーザ加工方法
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Also Published As

Publication number Publication date
US6294754B1 (en) 2001-09-25
EP1020249A2 (de) 2000-07-19
US6417487B2 (en) 2002-07-09
DE69908745T2 (de) 2004-04-22
JP2000202672A (ja) 2000-07-25
EP1020249A3 (de) 2001-08-22
JP3664904B2 (ja) 2005-06-29
US20020017513A1 (en) 2002-02-14
EP1020249B1 (de) 2003-06-11

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