DE69842125D1 - Scheibenprozesssystem und Scheibenprozessverfahren - Google Patents

Scheibenprozesssystem und Scheibenprozessverfahren

Info

Publication number
DE69842125D1
DE69842125D1 DE69842125T DE69842125T DE69842125D1 DE 69842125 D1 DE69842125 D1 DE 69842125D1 DE 69842125 T DE69842125 T DE 69842125T DE 69842125 T DE69842125 T DE 69842125T DE 69842125 D1 DE69842125 D1 DE 69842125D1
Authority
DE
Germany
Prior art keywords
disc process
disc
process system
process method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69842125T
Other languages
English (en)
Inventor
Osamu Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP09099803A external-priority patent/JP3128643B2/ja
Priority claimed from JP11878497A external-priority patent/JP3336225B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE69842125D1 publication Critical patent/DE69842125D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69842125T 1997-04-02 1998-03-27 Scheibenprozesssystem und Scheibenprozessverfahren Expired - Lifetime DE69842125D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP09099803A JP3128643B2 (ja) 1997-04-02 1997-04-02 洗浄・乾燥処理装置
JP11878497A JP3336225B2 (ja) 1997-04-21 1997-04-21 基板の処理システム及び処理方法

Publications (1)

Publication Number Publication Date
DE69842125D1 true DE69842125D1 (de) 2011-03-17

Family

ID=26440909

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69833832T Expired - Lifetime DE69833832T2 (de) 1997-04-02 1998-03-27 Vorrichtung zum Reinigen und Trocknen, Scheibenprozesssystem und Scheibenprozessverfahren
DE69842125T Expired - Lifetime DE69842125D1 (de) 1997-04-02 1998-03-27 Scheibenprozesssystem und Scheibenprozessverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69833832T Expired - Lifetime DE69833832T2 (de) 1997-04-02 1998-03-27 Vorrichtung zum Reinigen und Trocknen, Scheibenprozesssystem und Scheibenprozessverfahren

Country Status (5)

Country Link
US (2) US6068002A (de)
EP (2) EP0869542B1 (de)
KR (1) KR100395997B1 (de)
DE (2) DE69833832T2 (de)
TW (1) TW434671B (de)

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JP3171807B2 (ja) * 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
US6273100B1 (en) * 1998-08-27 2001-08-14 Micron Technology, Inc. Surface cleaning apparatus and method
US6219936B1 (en) * 1998-11-24 2001-04-24 Toho Kasei Co., Ltd. Wafer drying device and method
US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6575177B1 (en) * 1999-04-27 2003-06-10 Applied Materials Inc. Semiconductor substrate cleaning system
US6508259B1 (en) * 1999-08-05 2003-01-21 S.C. Fluids, Inc. Inverted pressure vessel with horizontal through loading
US6532975B1 (en) * 1999-08-13 2003-03-18 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6712081B1 (en) * 1999-08-31 2004-03-30 Kobe Steel, Ltd. Pressure processing device
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
US6352623B1 (en) * 1999-12-17 2002-03-05 Nutool, Inc. Vertically configured chamber used for multiple processes
US6776173B2 (en) * 2000-06-30 2004-08-17 Tokyo Electron Limited Liquid processing apparatus
KR100691241B1 (ko) * 2000-08-24 2007-03-12 삼성전자주식회사 습식 세정 장치의 건조 장치 및 건조 방법
KR100440891B1 (ko) * 2001-02-01 2004-07-19 에이펫(주) 웨이퍼 건조 방법
EP1446827A2 (de) * 2001-11-02 2004-08-18 Applied Materials, Inc. Einzelscheibe-trockner und trocknungsverfahren
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
US6845779B2 (en) * 2001-11-13 2005-01-25 Fsi International, Inc. Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
KR20030048682A (ko) * 2001-12-12 2003-06-25 삼성전자주식회사 반도체 웨이퍼 가이드 및 이를 구비한 반도체 습식세정장치
KR100672634B1 (ko) * 2001-12-19 2007-02-09 엘지.필립스 엘시디 주식회사 액정표시소자의 기판 반송 장치 및 방법
KR100447285B1 (ko) * 2002-09-05 2004-09-07 삼성전자주식회사 기판 건조 장치
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US6875289B2 (en) * 2002-09-13 2005-04-05 Fsi International, Inc. Semiconductor wafer cleaning systems and methods
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KR100497999B1 (ko) * 2002-11-08 2005-07-01 (주)케이.씨.텍 웨이퍼 건조 방법 및 장치
KR100568103B1 (ko) * 2003-08-19 2006-04-05 삼성전자주식회사 반도체 기판 세정 장치 및 세정 방법
KR100696379B1 (ko) * 2005-04-26 2007-03-19 삼성전자주식회사 세정 장치 및 이를 이용한 세정 방법
KR100666352B1 (ko) 2005-05-26 2007-01-11 세메스 주식회사 기판 세정 건조 장치 및 방법
KR101133394B1 (ko) * 2005-06-22 2012-04-09 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법과 컴퓨터 판독 가능한 기억 매체
KR100631928B1 (ko) * 2005-12-02 2006-10-04 삼성전자주식회사 웨이퍼 세정장치에서의 웨이퍼 가이드
KR100809592B1 (ko) * 2006-09-12 2008-03-04 세메스 주식회사 기판 처리 장치 및 방법
JP4891730B2 (ja) 2006-10-18 2012-03-07 東京エレクトロン株式会社 液処理装置及び液処理方法並びに液処理プログラム
KR100841995B1 (ko) * 2006-12-27 2008-06-27 주식회사 실트론 매엽식 웨이퍼 세정 장치 및 세정 방법
JP4744425B2 (ja) * 2006-12-27 2011-08-10 大日本スクリーン製造株式会社 基板処理装置
JP4744426B2 (ja) 2006-12-27 2011-08-10 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US8388762B2 (en) * 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
KR100872995B1 (ko) * 2007-09-07 2008-12-09 주식회사 케이씨텍 기판처리장치 및 이를 이용한 기판처리방법
JP5122265B2 (ja) 2007-10-01 2013-01-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
TWI372444B (en) * 2007-10-10 2012-09-11 Semes Co Ltd Substrate support unit, and substrate treating apparatus and method using the same
US20110020096A1 (en) * 2009-07-27 2011-01-27 Lotus Systems Gmbh Batch processing system in an in-line facility
CN102029273B (zh) * 2009-10-05 2015-09-16 东京毅力科创株式会社 超声波清洗装置、超声波清洗方法
TWI490931B (zh) * 2009-10-05 2015-07-01 Tokyo Electron Ltd 超音波清洗裝置、超音波清洗方法、及記錄有用來執行此超音波清洗方法之電腦程式的記錄媒體
CN101972751A (zh) * 2010-06-30 2011-02-16 张家港市超声电气有限公司 慢提拉机构
JP2012119522A (ja) * 2010-12-01 2012-06-21 Sumitomo Electric Ind Ltd 回折格子を有する半導体レーザ素子の製造方法
JP5254308B2 (ja) * 2010-12-27 2013-08-07 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
JP6077886B2 (ja) 2013-03-04 2017-02-08 株式会社荏原製作所 めっき装置
DE102013012577A1 (de) 2013-07-30 2015-02-05 Steven Keiner Verbindungselement eines Verbindungssystems, Werkzeug zum Verbinden, Lösen und Prüfen des Verbindungselementes, Verfahren zum Versehen eines Verbindungssystems mit einer Verschlussversiegelung
US9829249B2 (en) * 2015-03-10 2017-11-28 Mei, Llc Wafer dryer apparatus and method
JP6612206B2 (ja) * 2016-12-19 2019-11-27 Ｔｏｗａ株式会社 切断装置
JP7382790B2 (ja) * 2018-10-31 2023-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN111336792B (zh) * 2018-12-19 2022-03-11 江苏鲁汶仪器有限公司 一种干燥微水珠的腔体
KR102484015B1 (ko) 2021-07-23 2023-01-03 주식회사 유닉 기판 세정 및 건조 장치, 및 방법
TWI778786B (zh) * 2021-09-11 2022-09-21 辛耘企業股份有限公司 晶圓加工方法及載台
CN114914182B (zh) * 2022-07-18 2022-10-25 浙江晶睿电子科技有限公司 一种半导体封装加工用硅片处理装置

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Also Published As

Publication number Publication date
DE69833832D1 (de) 2006-05-11
EP1635380A1 (de) 2006-03-15
US6068002A (en) 2000-05-30
US6171403B1 (en) 2001-01-09
KR19980081033A (ko) 1998-11-25
EP0869542A3 (de) 2001-03-28
EP0869542B1 (de) 2006-03-15
TW434671B (en) 2001-05-16
KR100395997B1 (ko) 2003-12-01
DE69833832T2 (de) 2006-08-31
EP0869542A2 (de) 1998-10-07
EP1635380B1 (de) 2011-02-02

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