DE69840784D1 - Akustisches Volumenwellenfilter - Google Patents

Akustisches Volumenwellenfilter

Info

Publication number
DE69840784D1
DE69840784D1 DE69840784T DE69840784T DE69840784D1 DE 69840784 D1 DE69840784 D1 DE 69840784D1 DE 69840784 T DE69840784 T DE 69840784T DE 69840784 T DE69840784 T DE 69840784T DE 69840784 D1 DE69840784 D1 DE 69840784D1
Authority
DE
Germany
Prior art keywords
wave filter
bulk wave
acoustic bulk
acoustic
filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69840784T
Other languages
English (en)
Inventor
Juha Ella
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Wireless IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Wireless IP Singapore Pte Ltd filed Critical Avago Technologies Wireless IP Singapore Pte Ltd
Application granted granted Critical
Publication of DE69840784D1 publication Critical patent/DE69840784D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/582—Multiple crystal filters implemented with thin-film techniques
    • H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/589—Acoustic mirrors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0523—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0528—Holders; Supports for bulk acoustic wave devices consisting of clips
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/582—Multiple crystal filters implemented with thin-film techniques
    • H03H9/583—Multiple crystal filters implemented with thin-film techniques comprising a plurality of piezoelectric layers acoustically coupled
    • H03H9/585—Stacked Crystal Filters [SCF]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/60—Electric coupling means therefor
    • H03H9/605—Electric coupling means therefor consisting of a ladder configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Transducers For Ultrasonic Waves (AREA)
DE69840784T 1997-03-13 1998-03-13 Akustisches Volumenwellenfilter Expired - Fee Related DE69840784D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/816,702 US5872493A (en) 1997-03-13 1997-03-13 Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror

Publications (1)

Publication Number Publication Date
DE69840784D1 true DE69840784D1 (de) 2009-06-10

Family

ID=25221393

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69840784T Expired - Fee Related DE69840784D1 (de) 1997-03-13 1998-03-13 Akustisches Volumenwellenfilter

Country Status (4)

Country Link
US (1) US5872493A (de)
EP (1) EP0865157B1 (de)
JP (1) JP4212137B2 (de)
DE (1) DE69840784D1 (de)

Families Citing this family (215)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6087198A (en) * 1998-02-12 2000-07-11 Texas Instruments Incorporated Low cost packaging for thin-film resonators and thin-film resonator-based filters
US6081171A (en) * 1998-04-08 2000-06-27 Nokia Mobile Phones Limited Monolithic filters utilizing thin film bulk acoustic wave devices and minimum passive components for controlling the shape and width of a passband response
FI108583B (fi) 1998-06-02 2002-02-15 Nokia Corp Resonaattorirakenteita
FI106894B (fi) 1998-06-02 2001-04-30 Nokia Mobile Phones Ltd Resonaattorirakenteita
US5942958A (en) * 1998-07-27 1999-08-24 Tfr Technologies, Inc. Symmetrical piezoelectric resonator filter
JP2000209063A (ja) * 1998-11-12 2000-07-28 Mitsubishi Electric Corp 薄膜圧電素子
FI113211B (fi) * 1998-12-30 2004-03-15 Nokia Corp Balansoitu suodatinrakenne ja matkaviestinlaite
US6262637B1 (en) * 1999-06-02 2001-07-17 Agilent Technologies, Inc. Duplexer incorporating thin-film bulk acoustic resonators (FBARs)
DE19931297A1 (de) * 1999-07-07 2001-01-11 Philips Corp Intellectual Pty Volumenwellen-Filter
DE19947081A1 (de) * 1999-09-30 2001-04-05 Infineon Technologies Ag Akustischer Spiegel und Verfahren zu dessen Herstellung
US6339276B1 (en) * 1999-11-01 2002-01-15 Agere Systems Guardian Corp. Incremental tuning process for electrical resonators based on mechanical motion
FI107661B (fi) 1999-11-29 2001-09-14 Nokia Mobile Phones Ltd Menetelmä balansoidun suotimen keskitaajuuden säätämiseksi ja joukko balansoituja suotimia
US6466107B2 (en) * 1999-12-14 2002-10-15 Murata Manufacturing Co., Ltd. Ladder filter comprising stacked piezoelectric resonators
US6746577B1 (en) 1999-12-16 2004-06-08 Agere Systems, Inc. Method and apparatus for thickness control and reproducibility of dielectric film deposition
US6524971B1 (en) 1999-12-17 2003-02-25 Agere Systems, Inc. Method of deposition of films
US6441703B1 (en) * 2000-01-18 2002-08-27 Texas Instruments Incorporated Multiple frequency acoustic reflector array and monolithic cover for resonators and method
US6437667B1 (en) 2000-02-04 2002-08-20 Agere Systems Guardian Corp. Method of tuning thin film resonator filters by removing or adding piezoelectric material
US6377136B1 (en) * 2000-02-04 2002-04-23 Agere Systems Guardian Corporation Thin film resonator filter having at least one component with different resonant frequency sets or electrode capacitance
US7296329B1 (en) 2000-02-04 2007-11-20 Agere Systems Inc. Method of isolation for acoustic resonator device
US6323744B1 (en) * 2000-02-04 2001-11-27 Agere Systems Guardian Corp. Grounding of TFR ladder filters
US6306313B1 (en) 2000-02-04 2001-10-23 Agere Systems Guardian Corp. Selective etching of thin films
US6392257B1 (en) * 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
US6693033B2 (en) 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
DE10007577C1 (de) * 2000-02-18 2001-09-13 Infineon Technologies Ag Piezoresonator
EP1177623B1 (de) * 2000-02-22 2009-08-05 Nxp B.V. Verfahren zur herstellung eines auf einem trägersubstrat geformten piezoelektrischen filters mit einem akustischen resonator auf einer akustischen reflektorschicht
WO2001078230A1 (en) * 2000-04-06 2001-10-18 Koninklijke Philips Electronics N.V. Tunable filter arrangement
WO2001078229A1 (en) * 2000-04-06 2001-10-18 Koninklijke Philips Electronics N.V. Tunable filter arrangement comprising resonators.
US6603241B1 (en) * 2000-05-23 2003-08-05 Agere Systems, Inc. Acoustic mirror materials for acoustic devices
KR20030011083A (ko) * 2000-05-31 2003-02-06 모토로라 인코포레이티드 반도체 디바이스 및 이를 제조하기 위한 방법
GB0014963D0 (en) * 2000-06-20 2000-08-09 Koninkl Philips Electronics Nv A bulk acoustic wave device
US6590236B1 (en) 2000-07-24 2003-07-08 Motorola, Inc. Semiconductor structure for use with high-frequency signals
US6555946B1 (en) * 2000-07-24 2003-04-29 Motorola, Inc. Acoustic wave device and process for forming the same
AU2001277001A1 (en) * 2000-07-24 2002-02-05 Motorola, Inc. Heterojunction tunneling diodes and process for fabricating same
US6355498B1 (en) 2000-08-11 2002-03-12 Agere Systems Guartian Corp. Thin film resonators fabricated on membranes created by front side releasing
JP4049239B2 (ja) * 2000-08-30 2008-02-20 Ｔｄｋ株式会社 表面弾性波素子を含む高周波モジュール部品の製造方法
US6377137B1 (en) * 2000-09-11 2002-04-23 Agilent Technologies, Inc. Acoustic resonator filter with reduced electromagnetic influence due to die substrate thickness
US6486751B1 (en) 2000-09-26 2002-11-26 Agere Systems Inc. Increased bandwidth thin film resonator having a columnar structure
US6493497B1 (en) 2000-09-26 2002-12-10 Motorola, Inc. Electro-optic structure and process for fabricating same
US6638838B1 (en) 2000-10-02 2003-10-28 Motorola, Inc. Semiconductor structure including a partially annealed layer and method of forming the same
US6674291B1 (en) 2000-10-30 2004-01-06 Agere Systems Guardian Corp. Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom
US6587212B1 (en) 2000-10-31 2003-07-01 Agere Systems Inc. Method and apparatus for studying vibrational modes of an electro-acoustic device
US6501121B1 (en) 2000-11-15 2002-12-31 Motorola, Inc. Semiconductor structure
US6743731B1 (en) 2000-11-17 2004-06-01 Agere Systems Inc. Method for making a radio frequency component and component produced thereby
CN1322670C (zh) * 2000-11-27 2007-06-20 株式会社村田制作所 组合振动装置
GB0029090D0 (en) 2000-11-29 2001-01-10 Univ Cranfield Improvements in or relating to filters
US6559471B2 (en) 2000-12-08 2003-05-06 Motorola, Inc. Quantum well infrared photodetector and method for fabricating same
US6550664B2 (en) * 2000-12-09 2003-04-22 Agilent Technologies, Inc. Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology
US6496085B2 (en) * 2001-01-02 2002-12-17 Nokia Mobile Phones Ltd Solidly mounted multi-resonator bulk acoustic wave filter with a patterned acoustic mirror
US6518860B2 (en) * 2001-01-05 2003-02-11 Nokia Mobile Phones Ltd BAW filters having different center frequencies on a single substrate and a method for providing same
US6424238B1 (en) 2001-01-08 2002-07-23 Motorola, Inc. Acoustic wave filter and method of forming the same
US6509813B2 (en) * 2001-01-16 2003-01-21 Nokia Mobile Phones Ltd. Bulk acoustic wave resonator with a conductive mirror
US20020096683A1 (en) * 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
US6515402B2 (en) * 2001-01-24 2003-02-04 Koninklijke Philips Electronics N.V. Array of ultrasound transducers
US7435613B2 (en) 2001-02-12 2008-10-14 Agere Systems Inc. Methods of fabricating a membrane with improved mechanical integrity
US6673646B2 (en) 2001-02-28 2004-01-06 Motorola, Inc. Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
US6483229B2 (en) * 2001-03-05 2002-11-19 Agilent Technologies, Inc. Method of providing differential frequency adjusts in a thin film bulk acoustic resonator (FBAR) filter and apparatus embodying the method
WO2002093740A1 (fr) * 2001-05-11 2002-11-21 Ube Electronics, Ltd. Resonateur d'onde acoustique en volume a couche mince
JP2002368571A (ja) * 2001-06-11 2002-12-20 Matsushita Electric Ind Co Ltd 圧電振動素子及びそれを用いたフィルタ
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US20030010992A1 (en) * 2001-07-16 2003-01-16 Motorola, Inc. Semiconductor structure and method for implementing cross-point switch functionality
US6531740B2 (en) 2001-07-17 2003-03-11 Motorola, Inc. Integrated impedance matching and stability network
US6646293B2 (en) 2001-07-18 2003-11-11 Motorola, Inc. Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US6855992B2 (en) * 2001-07-24 2005-02-15 Motorola Inc. Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same
US6585424B2 (en) 2001-07-25 2003-07-01 Motorola, Inc. Structure and method for fabricating an electro-rheological lens
US6667196B2 (en) 2001-07-25 2003-12-23 Motorola, Inc. Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
US6594414B2 (en) 2001-07-25 2003-07-15 Motorola, Inc. Structure and method of fabrication for an optical switch
US6639249B2 (en) 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US6589856B2 (en) 2001-08-06 2003-07-08 Motorola, Inc. Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
US6673667B2 (en) 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US20030036217A1 (en) * 2001-08-16 2003-02-20 Motorola, Inc. Microcavity semiconductor laser coupled to a waveguide
DE10147075A1 (de) * 2001-09-25 2003-04-30 Infineon Technologies Ag Piezoelektrisches Bauelement und Verfahren zu dessen Herstellung
US6778038B2 (en) * 2001-10-05 2004-08-17 Tdk Corporation Piezoelectric resonant filter, duplexer, and method of manufacturing same
DE10149542A1 (de) * 2001-10-08 2003-04-17 Infineon Technologies Ag BAW-Resonator
DE10150253A1 (de) * 2001-10-11 2003-04-30 Infineon Technologies Ag Piezoelektrisches Bauelement
US20030071327A1 (en) * 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
KR20030032401A (ko) * 2001-10-18 2003-04-26 한국쌍신전기주식회사 압전박막형 공진기 및 그 제조방법
DE60140319D1 (de) * 2001-11-06 2009-12-10 Avago Technologies Wireless Ip Filtereinrichtung und verfahren zur herstellung einer filtereinrichtung
DE10155927A1 (de) * 2001-11-14 2003-06-05 Infineon Technologies Ag Passivierter BAW-Resonator und BAW-Filter
DE10163462A1 (de) * 2001-12-21 2003-07-03 Epcos Ag Symmetrisch arbeitendes Reaktanzfilter
TW525284B (en) * 2002-03-01 2003-03-21 Advanced Semiconductor Eng Bump process
JP3830843B2 (ja) * 2002-03-28 2006-10-11 株式会社東芝 薄膜圧電共振子
JP2003298392A (ja) * 2002-03-29 2003-10-17 Fujitsu Media Device Kk フィルタチップ及びフィルタ装置
US6774729B2 (en) 2002-05-21 2004-08-10 Murata Manufacturing Co., Ltd. Composite-material vibrating device
DE10321701B4 (de) * 2002-05-24 2009-06-10 Murata Manufacturing Co., Ltd., Nagaokakyo Längsgekoppelte piezoelektrische Multi-Mode-Volumenwellenfiltervorrichtung, längsgekoppelter piezoelektrischer Multi-Mode-Volumenwellenfilter und elektronische Komponente
DE20221966U1 (de) * 2002-06-06 2010-02-25 Epcos Ag Mit akustischen Wellen arbeitendes Bauelement mit einem Anpaßnetzwerk
US20040012037A1 (en) * 2002-07-18 2004-01-22 Motorola, Inc. Hetero-integration of semiconductor materials on silicon
US20040021529A1 (en) * 2002-07-30 2004-02-05 Bradley Paul D. Resonator with protective layer
US6828713B2 (en) * 2002-07-30 2004-12-07 Agilent Technologies, Inc Resonator with seed layer
US6894360B2 (en) * 2002-07-30 2005-05-17 Agilent Technologies, Inc. Electrostatic discharge protection of thin-film resonators
US7154206B2 (en) 2002-07-31 2006-12-26 Kyocera Corporation Surface acoustic wave device and method for manufacturing same
US20040027030A1 (en) * 2002-08-08 2004-02-12 Li-Peng Wang Manufacturing film bulk acoustic resonator filters
US6944922B2 (en) * 2002-08-13 2005-09-20 Trikon Technologies Limited Method of forming an acoustic resonator
DE10239317A1 (de) * 2002-08-27 2004-03-11 Epcos Ag Resonator und Bauelement mit hermetischer Verkapselung
JP2004120016A (ja) * 2002-09-20 2004-04-15 Fujitsu Media Device Kk フィルタ装置
US7034387B2 (en) * 2003-04-04 2006-04-25 Chippac, Inc. Semiconductor multipackage module including processor and memory package assemblies
US20040069991A1 (en) * 2002-10-10 2004-04-15 Motorola, Inc. Perovskite cuprate electronic device structure and process
US20040070312A1 (en) * 2002-10-10 2004-04-15 Motorola, Inc. Integrated circuit and process for fabricating the same
DE10256116B4 (de) * 2002-11-29 2005-12-22 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zur Herstellung desselben
DE10301261B4 (de) * 2003-01-15 2018-03-22 Snaptrack, Inc. Mit akustischen Volumenwellen arbeitendes Bauelement und Verfahren zur Herstellung
DE10301934A1 (de) * 2003-01-20 2004-07-29 Epcos Ag Elektrisches Bauelement mit verringerter Substratfläche
US6965128B2 (en) * 2003-02-03 2005-11-15 Freescale Semiconductor, Inc. Structure and method for fabricating semiconductor microresonator devices
US7020374B2 (en) * 2003-02-03 2006-03-28 Freescale Semiconductor, Inc. Optical waveguide structure and method for fabricating the same
US20040164315A1 (en) * 2003-02-25 2004-08-26 Motorola, Inc. Structure and device including a tunneling piezoelectric switch and method of forming same
US7275292B2 (en) * 2003-03-07 2007-10-02 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Method for fabricating an acoustical resonator on a substrate
US20040227578A1 (en) * 2003-05-14 2004-11-18 Miikka Hamalainen Acoustic resonance-based frequency synthesizer using at least one bulk acoustic wave (BAW) or thin film bulk acoustic wave (FBAR) device
US6954121B2 (en) * 2003-06-09 2005-10-11 Agilent Technologies, Inc. Method for controlling piezoelectric coupling coefficient in film bulk acoustic resonators and apparatus embodying the method
KR100646135B1 (ko) * 2003-07-21 2006-11-23 쌍신전자통신주식회사 실리콘 체적탄성파 소자 및 그 제조방법
KR100558439B1 (ko) 2003-09-15 2006-03-10 삼성전기주식회사 웨이퍼 레벨 패키지의 ｆｂａｒ 소자 및 그 제조 방법
JP2005117641A (ja) 2003-09-17 2005-04-28 Matsushita Electric Ind Co Ltd 圧電体共振器、それを用いたフィルタ及び共用器
KR100616511B1 (ko) * 2003-09-24 2006-08-29 삼성전기주식회사 Ｆｂａｒ 소자 및 그 제조 방법
KR100662865B1 (ko) * 2003-10-08 2007-01-02 삼성전자주식회사 박막 벌크 음향 공진기 및 그 제조방법
JP2005129610A (ja) * 2003-10-22 2005-05-19 Tdk Corp 電子部品
JP2005136534A (ja) * 2003-10-29 2005-05-26 Tdk Corp 薄膜バルク波共振器
JP2005136683A (ja) * 2003-10-30 2005-05-26 Tdk Corp 電子部品
EP1528677B1 (de) * 2003-10-30 2006-05-10 Agilent Technologies, Inc. Akustisch gekoppelter Dünnschicht-Transformator mit zwei piezoelektrischen Elementen, welche entgegengesetzte C-Axen Orientierung besitzten
US6946928B2 (en) * 2003-10-30 2005-09-20 Agilent Technologies, Inc. Thin-film acoustically-coupled transformer
US7391285B2 (en) * 2003-10-30 2008-06-24 Avago Technologies Wireless Ip Pte Ltd Film acoustically-coupled transformer
US7358831B2 (en) 2003-10-30 2008-04-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator (FBAR) devices with simplified packaging
US7019605B2 (en) * 2003-10-30 2006-03-28 Larson Iii John D Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth
US7242270B2 (en) * 2003-10-30 2007-07-10 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Decoupled stacked bulk acoustic resonator-based band-pass filter
FR2863789B1 (fr) * 2003-12-12 2006-09-29 St Microelectronics Sa Dispositif de resonateur acoustique
JP2005197983A (ja) 2004-01-07 2005-07-21 Tdk Corp 薄膜バルク波共振器
JP2005311567A (ja) * 2004-04-20 2005-11-04 Sony Corp フィルタ装置及び送受信機
US7615833B2 (en) 2004-07-13 2009-11-10 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator package and method of fabricating same
US7388454B2 (en) 2004-10-01 2008-06-17 Avago Technologies Wireless Ip Pte Ltd Acoustic resonator performance enhancement using alternating frame structure
US8981876B2 (en) * 2004-11-15 2015-03-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Piezoelectric resonator structures and electrical filters having frame elements
US7202560B2 (en) 2004-12-15 2007-04-10 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Wafer bonding of micro-electro mechanical systems to active circuitry
US7791434B2 (en) 2004-12-22 2010-09-07 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric
US7427819B2 (en) * 2005-03-04 2008-09-23 Avago Wireless Ip Pte Ltd Film-bulk acoustic wave resonator with motion plate and method
US7369013B2 (en) * 2005-04-06 2008-05-06 Avago Technologies Wireless Ip Pte Ltd Acoustic resonator performance enhancement using filled recessed region
US7436269B2 (en) * 2005-04-18 2008-10-14 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustically coupled resonators and method of making the same
JP4550658B2 (ja) * 2005-04-28 2010-09-22 富士通メディアデバイス株式会社 圧電薄膜共振器およびフィルタ
US7443269B2 (en) 2005-07-27 2008-10-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and apparatus for selectively blocking radio frequency (RF) signals in a radio frequency (RF) switching circuit
US7868522B2 (en) 2005-09-09 2011-01-11 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Adjusted frequency temperature coefficient resonator
US7362035B2 (en) * 2005-09-22 2008-04-22 The Penn State Research Foundation Polymer bulk acoustic resonator
US7391286B2 (en) * 2005-10-06 2008-06-24 Avago Wireless Ip Pte Ltd Impedance matching and parasitic capacitor resonance of FBAR resonators and coupled filters
US7425787B2 (en) 2005-10-18 2008-09-16 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating single insulated decoupled stacked bulk acoustic resonator with acoustically-resonant electrical insulator
US7423503B2 (en) * 2005-10-18 2008-09-09 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating film acoustically-coupled transformer
US7525398B2 (en) * 2005-10-18 2009-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustically communicating data signals across an electrical isolation barrier
US7737807B2 (en) 2005-10-18 2010-06-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating series-connected decoupled stacked bulk acoustic resonators
US7675390B2 (en) * 2005-10-18 2010-03-09 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating single decoupled stacked bulk acoustic resonator
US7463499B2 (en) * 2005-10-31 2008-12-09 Avago Technologies General Ip (Singapore) Pte Ltd. AC-DC power converter
JP2007129391A (ja) * 2005-11-02 2007-05-24 Matsushita Electric Ind Co Ltd 音響共振器及びフィルタ
US7561009B2 (en) * 2005-11-30 2009-07-14 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator (FBAR) devices with temperature compensation
US7612636B2 (en) * 2006-01-30 2009-11-03 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Impedance transforming bulk acoustic wave baluns
US7746677B2 (en) 2006-03-09 2010-06-29 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. AC-DC converter circuit and power supply
US20070210724A1 (en) * 2006-03-09 2007-09-13 Mark Unkrich Power adapter and DC-DC converter having acoustic transformer
US7479685B2 (en) * 2006-03-10 2009-01-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Electronic device on substrate with cavity and mitigated parasitic leakage path
WO2007119556A1 (ja) * 2006-04-05 2007-10-25 Murata Manufacturing Co., Ltd. 圧電共振子及び圧電フィルタ
DE102006023165B4 (de) * 2006-05-17 2008-02-14 Infineon Technologies Ag Verfahren zur Herstellung eines akustischen Spiegels aus alternierend angeordneten Schichten hoher und niedriger akustischer Impedanz
JP4884134B2 (ja) * 2006-05-30 2012-02-29 京セラ株式会社 音響波共振子およびフィルタならびに通信装置
US7629865B2 (en) 2006-05-31 2009-12-08 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Piezoelectric resonator structures and electrical filters
US7508286B2 (en) * 2006-09-28 2009-03-24 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. HBAR oscillator and method of manufacture
US20080202239A1 (en) * 2007-02-28 2008-08-28 Fazzio R Shane Piezoelectric acceleration sensor
US20090079514A1 (en) * 2007-09-24 2009-03-26 Tiberiu Jamneala Hybrid acoustic resonator-based filters
US7791435B2 (en) * 2007-09-28 2010-09-07 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Single stack coupled resonators having differential output
US8089195B2 (en) * 2007-12-17 2012-01-03 Resonance Semiconductor Corporation Integrated acoustic bandgap devices for energy confinement and methods of fabricating same
WO2009110062A1 (ja) * 2008-03-04 2009-09-11 富士通株式会社 圧電薄膜共振器、フィルタ、通信モジュール、および通信装置
US7855618B2 (en) * 2008-04-30 2010-12-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator electrical impedance transformers
US7732977B2 (en) * 2008-04-30 2010-06-08 Avago Technologies Wireless Ip (Singapore) Transceiver circuit for film bulk acoustic resonator (FBAR) transducers
JP4586897B2 (ja) * 2008-06-24 2010-11-24 株式会社村田製作所 分波器
US9735338B2 (en) 2009-01-26 2017-08-15 Cymatics Laboratories Corp. Protected resonator
US8030823B2 (en) * 2009-01-26 2011-10-04 Resonance Semiconductor Corporation Protected resonator
US8291559B2 (en) * 2009-02-24 2012-10-23 Epcos Ag Process for adapting resonance frequency of a BAW resonator
US9255912B2 (en) * 2009-04-29 2016-02-09 The Trustees Of Columbia University In The City Of New York Monolithic FBAR-CMOS structure such as for mass sensing
US8902023B2 (en) * 2009-06-24 2014-12-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator structure having an electrode with a cantilevered portion
US8248185B2 (en) * 2009-06-24 2012-08-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator structure comprising a bridge
US8330556B2 (en) * 2009-11-23 2012-12-11 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Passivation layers in acoustic resonators
US20110121916A1 (en) * 2009-11-24 2011-05-26 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Hybrid bulk acoustic wave resonator
US8193877B2 (en) * 2009-11-30 2012-06-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Duplexer with negative phase shifting circuit
US9243316B2 (en) 2010-01-22 2016-01-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Method of fabricating piezoelectric material with selected c-axis orientation
US8796904B2 (en) 2011-10-31 2014-08-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer
US9197185B2 (en) * 2010-04-29 2015-11-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Resonator device including electrodes with buried temperature compensating layers
US9479139B2 (en) 2010-04-29 2016-10-25 Avago Technologies General Ip (Singapore) Pte. Ltd. Resonator device including electrode with buried temperature compensating layer
US20110304412A1 (en) * 2010-06-10 2011-12-15 Hao Zhang Acoustic Wave Resonators and Methods of Manufacturing Same
US8830012B2 (en) 2010-09-07 2014-09-09 Wei Pang Composite bulk acoustic wave resonator
US8610333B2 (en) * 2010-09-24 2013-12-17 Wei Pang Acoustic wave devices
US8962443B2 (en) 2011-01-31 2015-02-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor device having an airbridge and method of fabricating the same
US9203374B2 (en) 2011-02-28 2015-12-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator comprising a bridge
US9048812B2 (en) 2011-02-28 2015-06-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer
US9148117B2 (en) 2011-02-28 2015-09-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge and frame elements
US9425764B2 (en) 2012-10-25 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having composite electrodes with integrated lateral features
US9083302B2 (en) 2011-02-28 2015-07-14 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator
US9136818B2 (en) 2011-02-28 2015-09-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked acoustic resonator comprising a bridge
US9154112B2 (en) 2011-02-28 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge
US8575820B2 (en) 2011-03-29 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator
US9444426B2 (en) 2012-10-25 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having integrated lateral feature and temperature compensation feature
US9917567B2 (en) 2011-05-20 2018-03-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising aluminum scandium nitride
US9154111B2 (en) * 2011-05-20 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Double bulk acoustic resonator comprising aluminum scandium nitride
US20120293278A1 (en) * 2011-05-20 2012-11-22 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator comprising distributed bragg reflector
US8350445B1 (en) 2011-06-16 2013-01-08 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising non-piezoelectric layer and bridge
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
KR101945723B1 (ko) * 2011-10-25 2019-02-11 삼성전자주식회사 박막 벌크 음향 공진기 및 박막 벌크 음향 공진기의 제조방법
KR101919118B1 (ko) 2012-01-18 2018-11-15 삼성전자주식회사 체적 음향 공진기
WO2014062936A1 (en) 2012-10-17 2014-04-24 The Trustees Of Columbia University In The City Of New York Cmos-integrated jfet for dense low-noise bioelectronic platforms
US10122345B2 (en) 2013-06-26 2018-11-06 The Trustees Of Columbia University In The City Of New York Co-integrated bulk acoustic wave resonators
JP5997796B2 (ja) * 2015-02-27 2016-09-28 株式会社日立製作所 超音波振動子ユニット
JP2016195305A (ja) * 2015-03-31 2016-11-17 太陽誘電株式会社 弾性波フィルタ、分波器、およびモジュール
US10177736B2 (en) 2015-05-29 2019-01-08 Avago Technologies International Sales Pte. Limited Bulk acoustic wave resonator comprising multiple acoustic reflectors
US10135415B2 (en) * 2015-12-18 2018-11-20 Texas Instruments Incorporated Method to reduce frequency distribution of bulk acoustic wave resonators during manufacturing
US10361677B2 (en) 2016-02-18 2019-07-23 X-Celeprint Limited Transverse bulk acoustic wave filter
US10200013B2 (en) 2016-02-18 2019-02-05 X-Celeprint Limited Micro-transfer-printed acoustic wave filter device
US10128813B2 (en) 2016-04-21 2018-11-13 Avago Technologies International Sales Pte. Limited Bulk acoustic wave (BAW) resonator structure
US10804880B2 (en) 2018-12-03 2020-10-13 X-Celeprint Limited Device structures with acoustic wave transducers and connection posts
US10840884B2 (en) * 2018-05-24 2020-11-17 Qualcomm Incorporated Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integration
US11482979B2 (en) 2018-12-03 2022-10-25 X Display Company Technology Limited Printing components over substrate post edges
US11274035B2 (en) 2019-04-24 2022-03-15 X-Celeprint Limited Overhanging device structures and related methods of manufacture
US11528808B2 (en) 2018-12-03 2022-12-13 X Display Company Technology Limited Printing components to substrate posts
US20210002128A1 (en) 2018-12-03 2021-01-07 X-Celeprint Limited Enclosed cavity structures
US10790173B2 (en) 2018-12-03 2020-09-29 X Display Company Technology Limited Printed components on substrate posts
CN113497593B (zh) * 2020-04-08 2023-05-12 诺思(天津)微***有限责任公司 单晶体声波谐振器、滤波器及电子设备
US20220052667A1 (en) * 2020-08-14 2022-02-17 Qorvo Us, Inc. Electronic device with solder interconnect and multiple material encapsulant
DE102022203972A1 (de) * 2022-04-25 2023-10-26 Robert Bosch Gesellschaft mit beschränkter Haftung Volumenakustische Vorrichtung und Verfahren zum Herstellen einer volumenakustischen Vorrichtung
US20240113063A1 (en) * 2022-09-30 2024-04-04 Texas Instruments Incorporated Radiator layers for ultrasonic transducers

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL277613A (de) * 1961-04-26 1900-01-01
US3189851A (en) * 1962-06-04 1965-06-15 Sonus Corp Piezoelectric filter
US3293557A (en) * 1964-03-19 1966-12-20 Bell Telephone Labor Inc Elastic wave devices utilizing mixed crystals of potassium tantalatepotassium niobate
US3422371A (en) * 1967-07-24 1969-01-14 Sanders Associates Inc Thin film piezoelectric oscillator
DE1566009A1 (de) * 1967-08-26 1971-02-18 Telefunken Patent Mechanisches Frequenzfilter und Verfahren zu seiner Herstellung
US3486046A (en) * 1968-10-17 1969-12-23 Westinghouse Electric Corp Thin film piezoelectric resonator
US3696312A (en) * 1970-06-30 1972-10-03 Ibm Cyclotron resonance devices controllable by electric fields
US3686579A (en) * 1971-06-21 1972-08-22 Zenith Radio Corp Solid-state, acoustic-wave amplifiers
US3723920A (en) * 1971-06-24 1973-03-27 Gte Automatic Electric Lab Inc Crystal filter assembly
FR2151727A5 (de) * 1971-09-10 1973-04-20 Thomson Csf
FR2182295A5 (de) * 1972-04-25 1973-12-07 Thomson Csf
SE384958B (sv) * 1974-07-19 1976-05-24 Philips Svenska Ab Sett for overforing av information i en transponderanleggning samt anordning for utforande av settet
JPS5213793A (en) * 1975-07-22 1977-02-02 Kinsekishiya Kenkyusho:Kk Piezoelectric oscillator
AT353506B (de) 1976-10-19 1979-11-26 List Hans Piezoelektrischer resonator
GB1592010A (en) * 1977-01-12 1981-07-01 Suwa Seikosha Kk Contour vibrator
CH630747A5 (fr) * 1979-01-18 1982-06-30 Ebauches Sa Procede d'ajustement de la frequence d'un resonateur et resonateur a frequence ajustee obtenu par la mise en oeuvre de ce procede.
JPS56100510A (en) * 1980-01-16 1981-08-12 Clarion Co Ltd Elastic surface wave device
US4320365A (en) * 1980-11-03 1982-03-16 United Technologies Corporation Fundamental, longitudinal, thickness mode bulk wave resonator
JPS58137317A (ja) * 1982-02-09 1983-08-15 Nec Corp 圧電薄膜複合振動子
US4556812A (en) * 1983-10-13 1985-12-03 The United States Of America As Represented By The United States Department Of Energy Acoustic resonator with Al electrodes on an AlN layer and using a GaAs substrate
US4502932A (en) * 1983-10-13 1985-03-05 The United States Of America As Represented By The United States Department Of Energy Acoustic resonator and method of making same
JPS60189307A (ja) * 1984-03-09 1985-09-26 Toshiba Corp 圧電薄膜共振器およびその製造方法
JPS6276913A (ja) * 1985-09-30 1987-04-09 Toshiba Corp 薄膜弾性波装置
US4897618A (en) * 1989-06-05 1990-01-30 The Curran Company Harmonic frequency selecting circuit
US5162691A (en) * 1991-01-22 1992-11-10 The United States Of America As Represented By The Secretary Of The Army Cantilevered air-gap type thin film piezoelectric resonator
US5233259A (en) * 1991-02-19 1993-08-03 Westinghouse Electric Corp. Lateral field FBAR
US5153476A (en) * 1991-03-11 1992-10-06 The United States Of America As Represented By The Secretary Of The Army Acoustic vibrator with variable sensitivity to external acceleration
US5185589A (en) * 1991-05-17 1993-02-09 Westinghouse Electric Corp. Microwave film bulk acoustic resonator and manifolded filter bank
US5294898A (en) * 1992-01-29 1994-03-15 Motorola, Inc. Wide bandwidth bandpass filter comprising parallel connected piezoelectric resonators
US5166646A (en) * 1992-02-07 1992-11-24 Motorola, Inc. Integrated tunable resonators for use in oscillators and filters
JPH05299970A (ja) * 1992-04-17 1993-11-12 Murata Mfg Co Ltd 圧電ラダーフィルタ
US5382930A (en) * 1992-12-21 1995-01-17 Trw Inc. Monolithic multipole filters made of thin film stacked crystal filters
US5373268A (en) * 1993-02-01 1994-12-13 Motorola, Inc. Thin film resonator having stacked acoustic reflecting impedance matching layers and method
US5332943A (en) * 1993-10-21 1994-07-26 Bhardwaj Mahesh C High temperature ultrasonic transducer device
US5446306A (en) * 1993-12-13 1995-08-29 Trw Inc. Thin film voltage-tuned semiconductor bulk acoustic resonator (SBAR)
JPH07170144A (ja) * 1993-12-15 1995-07-04 Murata Mfg Co Ltd 表面実装型電子部品
US5587620A (en) * 1993-12-21 1996-12-24 Hewlett-Packard Company Tunable thin film acoustic resonators and method for making the same
US5422533A (en) * 1994-03-09 1995-06-06 The United States Of America As Represented By The Secretary Of The Army Piezoelectric resonator
US5629906A (en) * 1995-02-15 1997-05-13 Hewlett-Packard Company Ultrasonic transducer
US5596239A (en) * 1995-06-29 1997-01-21 Motorola, Inc. Enhanced quality factor resonator
US5692279A (en) * 1995-08-17 1997-12-02 Motorola Method of making a monolithic thin film resonator lattice filter
US5646583A (en) * 1996-01-04 1997-07-08 Rockwell International Corporation Acoustic isolator having a high impedance layer of hafnium oxide

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EP0865157A3 (de) 2000-04-05
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EP0865157A2 (de) 1998-09-16
EP0865157B1 (de) 2009-04-29

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