DE69833968D1 - Laserbearbeitungsverfahren, - vorrichtung und - steuerungsverfahren - Google Patents
Laserbearbeitungsverfahren, - vorrichtung und - steuerungsverfahrenInfo
- Publication number
- DE69833968D1 DE69833968D1 DE69833968T DE69833968T DE69833968D1 DE 69833968 D1 DE69833968 D1 DE 69833968D1 DE 69833968 T DE69833968 T DE 69833968T DE 69833968 T DE69833968 T DE 69833968T DE 69833968 D1 DE69833968 D1 DE 69833968D1
- Authority
- DE
- Germany
- Prior art keywords
- laser processing
- control method
- processing method
- control
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34245397 | 1997-12-12 | ||
JP34245397A JP3269440B2 (ja) | 1997-12-12 | 1997-12-12 | レーザ加工装置およびその制御方法 |
JP10125682A JP3011183B2 (ja) | 1998-05-08 | 1998-05-08 | レーザ加工方法および加工装置 |
JP12568298 | 1998-05-08 | ||
PCT/JP1998/005583 WO1999030864A1 (fr) | 1997-12-12 | 1998-12-10 | Procede et dispositif d'usinage laser, et procede de commande de l'usinage laser |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69833968D1 true DE69833968D1 (de) | 2006-05-11 |
DE69833968T2 DE69833968T2 (de) | 2006-08-17 |
Family
ID=26462037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69833968T Expired - Lifetime DE69833968T2 (de) | 1997-12-12 | 1998-12-10 | Laserbearbeitungsverfahren, - vorrichtung und - steuerungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (3) | US6441337B1 (de) |
EP (1) | EP0980737B1 (de) |
KR (1) | KR100369688B1 (de) |
DE (1) | DE69833968T2 (de) |
TW (1) | TW436357B (de) |
WO (1) | WO1999030864A1 (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281471B1 (en) | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US20040134894A1 (en) * | 1999-12-28 | 2004-07-15 | Bo Gu | Laser-based system for memory link processing with picosecond lasers |
US7723642B2 (en) * | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
US7671295B2 (en) | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
US6696008B2 (en) * | 2000-05-25 | 2004-02-24 | Westar Photonics Inc. | Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation |
JP3460678B2 (ja) | 2000-06-02 | 2003-10-27 | 松下電器産業株式会社 | レーザ加工方法および加工装置 |
DE10060407C2 (de) * | 2000-12-05 | 2003-04-30 | Lpkf Laser & Electronics Ag | Vorrichtung zum Laserstrahlbohren |
US6777645B2 (en) | 2001-03-29 | 2004-08-17 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
JP3666435B2 (ja) * | 2001-09-28 | 2005-06-29 | 松下電器産業株式会社 | 光照射装置と光加工装置およびその加工方法 |
US6713718B1 (en) * | 2001-11-27 | 2004-03-30 | Vi Engineering, Inc. | Scoring process and apparatus with confocal optical measurement |
JP3971627B2 (ja) * | 2002-02-26 | 2007-09-05 | 三菱電機株式会社 | 中間層回路の特性評価方法 |
US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
US6987240B2 (en) * | 2002-04-18 | 2006-01-17 | Applied Materials, Inc. | Thermal flux processing by scanning |
US20030227614A1 (en) * | 2002-06-05 | 2003-12-11 | Taminiau August A. | Laser machining apparatus with automatic focusing |
US8084866B2 (en) | 2003-12-10 | 2011-12-27 | Micron Technology, Inc. | Microelectronic devices and methods for filling vias in microelectronic devices |
US7091124B2 (en) | 2003-11-13 | 2006-08-15 | Micron Technology, Inc. | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
US20050242471A1 (en) * | 2004-04-30 | 2005-11-03 | Bhatt Sanjiv M | Methods for continuously producing shaped articles |
US20050247894A1 (en) | 2004-05-05 | 2005-11-10 | Watkins Charles M | Systems and methods for forming apertures in microfeature workpieces |
US7232754B2 (en) | 2004-06-29 | 2007-06-19 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
SG120200A1 (en) | 2004-08-27 | 2006-03-28 | Micron Technology Inc | Slanted vias for electrical circuits on circuit boards and other substrates |
US7300857B2 (en) | 2004-09-02 | 2007-11-27 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
JP2006101631A (ja) * | 2004-09-29 | 2006-04-13 | Fanuc Ltd | 静電モータ及びその製造方法 |
US7271482B2 (en) | 2004-12-30 | 2007-09-18 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
JP4559260B2 (ja) * | 2005-03-04 | 2010-10-06 | 日立ビアメカニクス株式会社 | プリント基板の穴明け方法 |
TWI382795B (zh) * | 2005-03-04 | 2013-01-11 | Hitachi Via Mechanics Ltd | A method of opening a printed circuit board and an opening device for a printed circuit board |
JP2006305608A (ja) * | 2005-04-28 | 2006-11-09 | Toshiba Corp | レーザ加工装置、及びレーザ加工方法 |
US7795134B2 (en) | 2005-06-28 | 2010-09-14 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US7244906B2 (en) * | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
US7262134B2 (en) | 2005-09-01 | 2007-08-28 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US7863187B2 (en) | 2005-09-01 | 2011-01-04 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
WO2007041460A2 (en) * | 2005-10-03 | 2007-04-12 | Aradigm Corporation | Method and system for laser machining |
EP1806203A1 (de) * | 2006-01-10 | 2007-07-11 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines Lochs |
KR100699246B1 (ko) * | 2006-04-03 | 2007-03-28 | 주식회사 고려반도체시스템 | 웨이퍼 레이저 쏘잉 장치 및 레이저 세기 제어방법 |
US7449699B1 (en) | 2006-04-20 | 2008-11-11 | Sandia Corporation | Method and apparatus for creating a topography at a surface |
US7749899B2 (en) | 2006-06-01 | 2010-07-06 | Micron Technology, Inc. | Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces |
JP5048978B2 (ja) * | 2006-07-14 | 2012-10-17 | 株式会社ディスコ | レーザ加工装置 |
US7629249B2 (en) * | 2006-08-28 | 2009-12-08 | Micron Technology, Inc. | Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods |
US7902643B2 (en) | 2006-08-31 | 2011-03-08 | Micron Technology, Inc. | Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods |
KR20080028559A (ko) | 2006-09-27 | 2008-04-01 | 주식회사 이오테크닉스 | 폴리곤 미러를 이용한 대상물 다중 가공 방법 |
KR20080079828A (ko) * | 2007-02-28 | 2008-09-02 | 주식회사 이오테크닉스 | 레이저 가공 장치 및 방법 |
SG150410A1 (en) | 2007-08-31 | 2009-03-30 | Micron Technology Inc | Partitioned through-layer via and associated systems and methods |
JP2009123421A (ja) * | 2007-11-13 | 2009-06-04 | Canon Inc | 気密容器の製造方法 |
US7884015B2 (en) | 2007-12-06 | 2011-02-08 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
WO2011082065A2 (en) * | 2009-12-30 | 2011-07-07 | Gsi Group Corporation | Link processing with high speed beam deflection |
JP5460420B2 (ja) * | 2010-03-30 | 2014-04-02 | 三菱電機株式会社 | 加工制御装置およびレーザ加工装置 |
JP5091287B2 (ja) * | 2010-08-06 | 2012-12-05 | ファナック株式会社 | 加工点にエネルギー又は物質を供給する加工機における加工情報取得装置 |
JP5869259B2 (ja) * | 2011-08-24 | 2016-02-24 | 株式会社ディスコ | 穿孔方法およびレーザー加工装置 |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
US20140263219A1 (en) * | 2013-03-15 | 2014-09-18 | Abbott Cardiovascular Systems Inc. | Laser optics with lateral and angular shift compensation |
JP6290960B2 (ja) * | 2016-04-04 | 2018-03-07 | ファナック株式会社 | 反射光強度を低減する機能を備えたレーザ加工装置 |
CN106064279A (zh) * | 2016-07-27 | 2016-11-02 | 深圳英诺激光科技有限公司 | 一种激光打标、漂白装置及其加工方法 |
JP2018051764A (ja) * | 2016-09-26 | 2018-04-05 | エスアイアイ・プリンテック株式会社 | 噴射孔プレートの製造方法 |
JP6382901B2 (ja) * | 2016-09-29 | 2018-08-29 | ファナック株式会社 | レーザー加工システム |
CN107824989B (zh) * | 2017-10-26 | 2019-11-12 | 大族激光科技产业集团股份有限公司 | 一种激光穿孔的检测方法及*** |
US11576265B2 (en) * | 2019-01-01 | 2023-02-07 | Ofuna Enterprise Japan Co., Ltd. | Manufacturing method for printed circuit board and laser processing machine |
CN113492269A (zh) * | 2020-03-20 | 2021-10-12 | 大族激光科技产业集团股份有限公司 | 激光加工方法 |
KR102434794B1 (ko) * | 2020-11-03 | 2022-08-19 | 디아이티 주식회사 | 레이저 모니터링이 가능한 레이저 조사 장치 및 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5645715B2 (de) | 1973-06-29 | 1981-10-28 | ||
US4504727A (en) * | 1982-12-30 | 1985-03-12 | International Business Machines Corporation | Laser drilling system utilizing photoacoustic feedback |
JPS603994A (ja) | 1983-06-18 | 1985-01-10 | Amada Co Ltd | レ−ザ加工機のz軸制御装置 |
JPS62216297A (ja) | 1986-03-17 | 1987-09-22 | 富士通株式会社 | 多層プリント板の孔加工法 |
JPH0292482A (ja) | 1988-09-30 | 1990-04-03 | Hitachi Ltd | レーザ穿孔装置 |
JPH02235589A (ja) | 1989-03-09 | 1990-09-18 | Fuji Electric Co Ltd | レーザ加工方法 |
JPH0445593A (ja) | 1990-06-12 | 1992-02-14 | Canon Inc | プリント配線板の孔明けにおける確認方法 |
US5063280A (en) | 1989-07-24 | 1991-11-05 | Canon Kabushiki Kaisha | Method and apparatus for forming holes into printed circuit board |
JP2694929B2 (ja) * | 1989-10-04 | 1997-12-24 | 石川島播磨重工業株式会社 | レーザービーム加工用加工孔貫通検知装置 |
JP2805242B2 (ja) | 1990-06-02 | 1998-09-30 | 日立精工株式会社 | プリント基板の穴明け加工方法 |
JP2872453B2 (ja) | 1991-08-13 | 1999-03-17 | 日立精工株式会社 | レーザによるプリント基板の穴明け加工方法 |
DE4133923A1 (de) | 1991-10-12 | 1993-04-15 | Borsig Babcock Ag | Verlorenes modell und verfahren zu seiner herstellung |
JP2720744B2 (ja) * | 1992-12-28 | 1998-03-04 | 三菱電機株式会社 | レーザ加工機 |
JPH06277863A (ja) | 1993-03-29 | 1994-10-04 | Toshiba Corp | 積層基板の加工方法 |
DE19513354A1 (de) * | 1994-04-14 | 1995-12-14 | Zeiss Carl | Materialbearbeitungseinrichtung |
US5620618A (en) * | 1995-04-28 | 1997-04-15 | International Business Machines Corporation | Multi-wavelength programmable laser processing mechanisms and apparatus |
JPH10113781A (ja) | 1996-10-09 | 1998-05-06 | Hitachi Seiko Ltd | レーザ加工方法 |
-
1998
- 1998-12-10 TW TW087120507A patent/TW436357B/zh not_active IP Right Cessation
- 1998-12-10 WO PCT/JP1998/005583 patent/WO1999030864A1/ja active IP Right Grant
- 1998-12-10 KR KR10-1999-7007316A patent/KR100369688B1/ko not_active IP Right Cessation
- 1998-12-10 EP EP98959152A patent/EP0980737B1/de not_active Expired - Lifetime
- 1998-12-10 US US09/367,343 patent/US6441337B1/en not_active Expired - Lifetime
- 1998-12-10 DE DE69833968T patent/DE69833968T2/de not_active Expired - Lifetime
-
2001
- 2001-06-04 US US09/873,971 patent/US6555782B2/en not_active Expired - Lifetime
- 2001-06-04 US US09/873,529 patent/US6586703B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1999030864A1 (fr) | 1999-06-24 |
EP0980737A1 (de) | 2000-02-23 |
KR100369688B1 (ko) | 2003-01-30 |
US20010040151A1 (en) | 2001-11-15 |
EP0980737A4 (de) | 2002-07-31 |
EP0980737B1 (de) | 2006-03-22 |
KR20000071048A (ko) | 2000-11-25 |
DE69833968T2 (de) | 2006-08-17 |
US6555782B2 (en) | 2003-04-29 |
US6441337B1 (en) | 2002-08-27 |
US6586703B2 (en) | 2003-07-01 |
US20010027964A1 (en) | 2001-10-11 |
TW436357B (en) | 2001-05-28 |
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