DE19581894T1 - IC-Transportvorrichtung, Vorrichtung zum Änderung der Ausrichtung von ICs, und Vorrichtung zum Herausnehmen von ICs - Google Patents
IC-Transportvorrichtung, Vorrichtung zum Änderung der Ausrichtung von ICs, und Vorrichtung zum Herausnehmen von ICsInfo
- Publication number
- DE19581894T1 DE19581894T1 DE19581894T DE19581894T DE19581894T1 DE 19581894 T1 DE19581894 T1 DE 19581894T1 DE 19581894 T DE19581894 T DE 19581894T DE 19581894 T DE19581894 T DE 19581894T DE 19581894 T1 DE19581894 T1 DE 19581894T1
- Authority
- DE
- Germany
- Prior art keywords
- ics
- orientation
- changing
- transport
- transport device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28765595 | 1995-11-06 | ||
PCT/JP1995/002393 WO1997017619A1 (fr) | 1995-11-06 | 1995-11-24 | Transporteur, changeur de position et dispositif de prelevement pour circuits integres |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19581894T1 true DE19581894T1 (de) | 1998-01-08 |
DE19581894C2 DE19581894C2 (de) | 1999-12-23 |
Family
ID=17720023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19581894T Expired - Fee Related DE19581894C2 (de) | 1995-11-06 | 1995-11-24 | Vorrichtung zum Ändern der Ausrichtung von ICs |
Country Status (5)
Country | Link |
---|---|
US (2) | US6074158A (de) |
KR (1) | KR100230070B1 (de) |
DE (1) | DE19581894C2 (de) |
TW (1) | TW350991B (de) |
WO (1) | WO1997017619A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4210801B2 (ja) * | 1997-05-23 | 2009-01-21 | モレックス インコーポレーテッド | コネクタ供給装置 |
JP3958852B2 (ja) * | 1997-12-22 | 2007-08-15 | 株式会社日本マイクロニクス | 被測定基板の検査装置 |
JP3430918B2 (ja) * | 1998-05-15 | 2003-07-28 | 株式会社村田製作所 | 部品搬送装置 |
TW490564B (en) * | 1999-02-01 | 2002-06-11 | Mirae Corp | A carrier handling apparatus for module IC handler, and method thereof |
US6264415B1 (en) * | 1999-09-30 | 2001-07-24 | Advanced Micro Devices, Inc. | Mechanism for accurately transferring a predetermined number of integrated circuit packages from tube to tube |
WO2001073458A1 (en) * | 2000-03-06 | 2001-10-04 | Vladimir Nikolaevich Davidov | Apparatus for processing and sorting semiconductor devices received in trays |
US6371715B1 (en) * | 2000-07-03 | 2002-04-16 | Advanced Micro Devices, Inc. | Automated tube to tube transfer of a predetermined number of IC packages for various types of IC packages |
US20030205030A1 (en) * | 2001-02-22 | 2003-11-06 | Martin Weiss | Taper machine using inertial control of parts |
US6734694B2 (en) * | 2001-03-19 | 2004-05-11 | Juki Corporation | Method and apparatus for automatically testing semiconductor device |
US6719518B2 (en) * | 2001-10-15 | 2004-04-13 | Anadigics, Inc. | Portable tube holder apparatus |
US6771060B1 (en) | 2001-10-22 | 2004-08-03 | Electroglas, Inc. | Testing circuits on substrates |
US6781394B1 (en) * | 2001-10-22 | 2004-08-24 | Electroglas, Inc. | Testing circuits on substrate |
US6861859B1 (en) * | 2001-10-22 | 2005-03-01 | Electroglas, Inc. | Testing circuits on substrates |
DE10208757B4 (de) * | 2002-02-28 | 2006-06-29 | Infineon Technologies Ag | Verfahren und Magazinvorrichtung zur Prüfung von Halbleitereinrichtungen |
EP2273279A1 (de) | 2005-04-27 | 2011-01-12 | Aehr Test Systems, Inc. | Vorrichtung zur Prüfung elektronischer Vorrichtungen |
TWI275814B (en) * | 2005-07-22 | 2007-03-11 | King Yuan Electronics Co Ltd | Electronic component testing apparatus |
US7501809B2 (en) * | 2005-09-22 | 2009-03-10 | King Yuan Electronics Co., Ltd. | Electronic component handling and testing apparatus and method for electronic component handling and testing |
US7528617B2 (en) * | 2006-03-07 | 2009-05-05 | Testmetrix, Inc. | Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing |
KR100866156B1 (ko) | 2007-03-16 | 2008-10-30 | 미래산업 주식회사 | 반도체 소자 테스트용 핸들러 및 테스트방법 |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
KR100990886B1 (ko) | 2008-11-13 | 2010-11-01 | (주) 에스에스피 | 자동화 장비의 자재공급장치 |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
JP2015184162A (ja) * | 2014-03-25 | 2015-10-22 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
JP2015184165A (ja) * | 2014-03-25 | 2015-10-22 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
CN105366364A (zh) * | 2015-12-02 | 2016-03-02 | 苏州索力旺新能源科技有限公司 | 一种接线盒贴片上料装置 |
KR20180101476A (ko) | 2016-01-08 | 2018-09-12 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 |
US9975708B2 (en) | 2016-03-16 | 2018-05-22 | Texas Instruments Incorporated | Transfer track stopper for packaged integrated circuits |
TWI583973B (zh) * | 2016-03-29 | 2017-05-21 | Bothhand Entpr Inc | Electronic component detection device |
KR102495427B1 (ko) | 2017-03-03 | 2023-02-02 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 |
CN110026346A (zh) * | 2019-05-17 | 2019-07-19 | 福州派利德电子科技有限公司 | 集成电路芯片测试分选机送料装置及方法 |
WO2022076333A1 (en) | 2020-10-07 | 2022-04-14 | Aehr Test Systems | Electronics tester |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5897900A (ja) * | 1981-12-07 | 1983-06-10 | 稲畑産業株式会社 | ソケットボ−ドへの集積回路片の自動装填装置 |
EP0382264B1 (de) * | 1984-06-29 | 1994-06-15 | Advantest Corporation | IC-Testvorrichtung |
JPS61217775A (ja) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | 物品配列装置 |
JPS6256874A (ja) * | 1985-09-06 | 1987-03-12 | Daitoo:Kk | Ic挿入装置用搬送機構 |
US4953749A (en) * | 1986-05-27 | 1990-09-04 | Nitto Kogyo Kabushiki Kaisha | Chip separation and alignment apparatus |
JPH01131469A (ja) * | 1987-11-17 | 1989-05-24 | Hitachi Electron Eng Co Ltd | Icの加熱方式 |
US5024978A (en) * | 1989-05-30 | 1991-06-18 | Corning Incorporated | Compositions and methods for making ceramic matrix composites |
JP2989912B2 (ja) * | 1991-02-12 | 1999-12-13 | 福田金属箔粉工業株式会社 | 導電塗料 |
US5190431A (en) * | 1991-07-03 | 1993-03-02 | Sym-Tek Systems, Inc. | Separation and transfer apparatus |
DE4227072A1 (de) * | 1992-08-17 | 1994-02-24 | Bayer Ag | Verfahren zur Herstellung eines Siliziumnitridpulvers |
US5326218A (en) * | 1993-03-08 | 1994-07-05 | Fallas David M | Robotic arm for handling product |
TW287235B (de) * | 1994-06-30 | 1996-10-01 | Zenshin Test Co |
-
1995
- 1995-11-24 DE DE19581894T patent/DE19581894C2/de not_active Expired - Fee Related
- 1995-11-24 KR KR1019960707305A patent/KR100230070B1/ko not_active IP Right Cessation
- 1995-11-24 WO PCT/JP1995/002393 patent/WO1997017619A1/ja active Application Filing
- 1995-11-28 TW TW084112677A patent/TW350991B/zh active
-
1999
- 1999-08-23 US US09/382,415 patent/US6074158A/en not_active Expired - Fee Related
- 1999-08-23 US US09/382,208 patent/US6135699A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE19581894C2 (de) | 1999-12-23 |
US6074158A (en) | 2000-06-13 |
TW350991B (en) | 1999-01-21 |
WO1997017619A1 (fr) | 1997-05-15 |
KR100230070B1 (ko) | 1999-11-15 |
US6135699A (en) | 2000-10-24 |
KR970704156A (ko) | 1997-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8125 | Change of the main classification |
Ipc: B65G 49/05 |
|
8607 | Notification of search results after publication | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |