DE69730524D1 - Polieren mittels schleifflüssigkeitsstrahl - Google Patents

Polieren mittels schleifflüssigkeitsstrahl

Info

Publication number
DE69730524D1
DE69730524D1 DE69730524T DE69730524T DE69730524D1 DE 69730524 D1 DE69730524 D1 DE 69730524D1 DE 69730524 T DE69730524 T DE 69730524T DE 69730524 T DE69730524 T DE 69730524T DE 69730524 D1 DE69730524 D1 DE 69730524D1
Authority
DE
Germany
Prior art keywords
medium
abrasive
jet
polishing
chemical bonds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69730524T
Other languages
English (en)
Other versions
DE69730524T2 (de
Inventor
J Rhoades
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Extrude Hone LLC
Original Assignee
Extrude Hone LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Extrude Hone LLC filed Critical Extrude Hone LLC
Application granted granted Critical
Publication of DE69730524D1 publication Critical patent/DE69730524D1/de
Publication of DE69730524T2 publication Critical patent/DE69730524T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/06—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for producing matt surfaces, e.g. on plastic materials, on glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
    • B24C1/083—Deburring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
    • B24C1/086—Descaling; Removing coating films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Disintegrating Or Milling (AREA)
  • Polarising Elements (AREA)
DE69730524T 1996-03-01 1997-02-26 Polieren mittels schleifflüssigkeitsstrahl Expired - Lifetime DE69730524T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/627,226 US5964644A (en) 1996-03-01 1996-03-01 Abrasive jet stream polishing
US627226 1996-03-01
PCT/US1997/003316 WO1997031752A1 (en) 1996-03-01 1997-02-26 Abrasive jet stream polishing

Publications (2)

Publication Number Publication Date
DE69730524D1 true DE69730524D1 (de) 2004-10-07
DE69730524T2 DE69730524T2 (de) 2005-09-15

Family

ID=24513763

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69730524T Expired - Lifetime DE69730524T2 (de) 1996-03-01 1997-02-26 Polieren mittels schleifflüssigkeitsstrahl

Country Status (7)

Country Link
US (2) US5964644A (de)
EP (1) EP0956180B1 (de)
AT (1) ATE275023T1 (de)
AU (1) AU724229B2 (de)
CA (1) CA2283131C (de)
DE (1) DE69730524T2 (de)
WO (1) WO1997031752A1 (de)

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DE19953131A1 (de) * 1999-11-04 2001-08-02 Bosch Gmbh Robert Verfahren und Vorrichtung zum Kantenverrunden
US6502442B2 (en) * 2000-05-11 2003-01-07 University Of Maryland Baltimore County Method and apparatus for abrasive for abrasive fluid jet peening surface treatment
US6562090B1 (en) * 2000-08-28 2003-05-13 Hercules Incorporated Fluid abrasive suspension for use in dentifrices
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
US20030032370A1 (en) * 2001-04-10 2003-02-13 Balcar Gerald P. Process for reclaiming mirror cullet and production of a powdered glass
EP1317995A1 (de) * 2001-12-05 2003-06-11 Siemens Aktiengesellschaft Verfahren und Vorrichtung zur Glättung der Oberfläche einer Gasturbinenschaufel
DE10393355D2 (de) * 2002-07-03 2005-06-02 Siemens Ag Verfahren zum Hydro-Erosiven verrunden einer Kante eines Bauteiles und Verwendung hierzu
JP2004082240A (ja) * 2002-08-26 2004-03-18 Minebea Co Ltd ステッピングモータのステータスタックおよびロータスタックの仕上げ加工方法
US7648584B2 (en) * 2003-06-27 2010-01-19 Lam Research Corporation Method and apparatus for removing contamination from substrate
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US20150040941A1 (en) * 2003-12-23 2015-02-12 Lam Research Corporation Method and Apparatus for Cleaning A Semiconductor Substrate
US8602843B2 (en) * 2004-07-01 2013-12-10 Kennametal Inc. Abrasive machining media containing thermoplastic polymer
EP1645363A1 (de) * 2004-10-05 2006-04-12 Siemens Aktiengesellschaft Verfahren und Vorrichtung zum Glätten der Oberfläche eines Bauteils
DE102005006049A1 (de) * 2005-02-10 2006-08-31 Mannesmann Plastics Machinery Gmbh Verfahren und Vorrichtung zum Polieren von kunststoffverarbeitenden Schnecken
CN101595239B (zh) * 2007-01-29 2013-01-02 东曹Smd有限公司 超光滑面溅射靶及其制造方法
WO2008102010A2 (de) 2007-02-23 2008-08-28 Tgc Technologie Beteiligungsgesellschaft Mbh Verfahren und vorrichtung zum schleifen und polieren von holzwerkstoffen sowie entsprechende holzbauteile
JP2011020212A (ja) * 2009-07-15 2011-02-03 Sharp Corp 基板の加工装置および基板の加工方法、並びに加工基板の製造方法
DE102009043697A1 (de) 2009-10-01 2011-04-07 Alstom Technology Ltd. Verfahren zum Bearbeiten von Werkstücken mittels eines unter hohem Druck aus einer Düse austretenden schleifmittelhaltigen Wasserstrahls, Wasserstrahlanlage zur Durchführung des Verfahrens sowie Anwendung des Verfahrens
EP2498764B1 (de) 2009-11-09 2017-09-06 Spotlight Technology Partners LLC Fragmentierte hydrogele
NZ599524A (en) 2009-11-09 2014-04-30 Spotlight Technology Partners Llc Polysaccharide based hydrogels
DE102009055679A1 (de) * 2009-11-25 2011-05-26 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Aufrauhen einer Bauteiloberfläche, insbesondere einer Lauffläche eines Zylinders eines Verbrennungsmotors
CN102101270B (zh) * 2010-12-22 2013-01-30 超晶科技有限公司 一种水射流抛光工艺
US20130104615A1 (en) * 2011-04-20 2013-05-02 Thomas J. Butler Method and apparatus for peening with liquid propelled shot
US20130084190A1 (en) * 2011-09-30 2013-04-04 General Electric Company Titanium aluminide articles with improved surface finish and methods for their manufacture
US20130130597A1 (en) * 2011-11-21 2013-05-23 James William Brown Glass treatment apparatus and methods of treating glass
US9115417B2 (en) * 2012-04-05 2015-08-25 United Technologies Corporation Liquid drop peening method and apparatus therefor
JP6022862B2 (ja) * 2012-05-08 2016-11-09 株式会社不二製作所 硬質脆性基板の切り出し方法及び切り出し装置
US20140248432A1 (en) * 2013-03-01 2014-09-04 Integrated Protective Coatings, Inc. Apparatus and process for nickel plating and sealing
US9459407B2 (en) * 2013-03-15 2016-10-04 Ofs Fitel, Llc Ring combiner
FR3035607B1 (fr) * 2015-04-30 2017-04-28 Saint-Gobain Centre De Rech Et D'Etudes Europeen Procede de modification de l'aspect d'une surface
JP6350384B2 (ja) * 2015-05-11 2018-07-04 信越半導体株式会社 研削用砥石
WO2018064284A1 (en) 2016-09-30 2018-04-05 Novaflux, Inc. Compositions for cleaning and decontamination
CN108555698B (zh) * 2018-01-31 2020-02-21 湖南科技大学 一种高效超精密剪切增稠-化学协同抛光方法
JP2021520442A (ja) 2018-04-03 2021-08-19 ノバフラックス インコーポレイテッド 高吸収性ポリマーを備える洗浄組成物
EP3632618B1 (de) * 2018-10-04 2021-03-10 Politecnico di Milano Abrasive wasserstrahlschneidemaschine und -verfahren, sowie zusammensetzung mit pulverförmigen abrasiven partikeln
JP7452963B2 (ja) * 2019-09-19 2024-03-19 株式会社フジミインコーポレーテッド ウェットブラスト用スラリー
CA3156824A1 (en) 2019-10-03 2021-04-08 Novaflux Inc. Oral cavity cleaning composition, method, and apparatus
JP7162265B2 (ja) * 2019-10-07 2022-10-28 株式会社サーフテクノロジー 微小凹凸形成方法及び粉体接触部材
TWI742924B (zh) * 2020-11-13 2021-10-11 國立勤益科技大學 自動擠膏拋光刀把
CN114734307B (zh) * 2022-06-13 2022-09-02 中国航发上海商用航空发动机制造有限责任公司 具有转弯结构的微细内流道的表面光整方法

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US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
US4195450A (en) * 1975-11-18 1980-04-01 Josef Korb Process for treating surfaces by means of a jet of liquid
KR930008692B1 (ko) * 1986-02-20 1993-09-13 가와사끼 쥬고교 가부시기가이샤 어브레시브 워터 제트 절단방법 및 장치
US4733503A (en) * 1986-05-01 1988-03-29 Airsonics License Partnership Abrasive jet machining
US4827679A (en) * 1987-11-24 1989-05-09 Ltv Aerospace & Defense Company Fluid jet cutting system with self orienting catcher
US4955164A (en) * 1989-06-15 1990-09-11 Flow Research, Inc Method and apparatus for drilling small diameter holes in fragile material with high velocity liquid jet
US4937985A (en) * 1989-09-25 1990-07-03 Possis Corporation Abrasive waterjet receiver
EP0445103A3 (en) * 1990-02-27 1992-10-21 Boehler Gesellschaft M.B.H. Method and device for feeding particles to an abrasive cutting device
GB9020204D0 (en) * 1990-09-15 1990-10-24 Pain B R K Surface treatment
JP2883230B2 (ja) * 1991-08-22 1999-04-19 新日本製鐵株式会社 鋼片の研削方法
JPH06132273A (ja) * 1992-10-19 1994-05-13 Mitsubishi Electric Corp ウエハ洗浄装置
US5441549A (en) * 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
US5527204A (en) * 1993-08-27 1996-06-18 Rhoades; Lawrence J. Abrasive jet stream cutting
KR0132274B1 (ko) * 1994-05-16 1998-04-11 김광호 웨이퍼 연마 설비

Also Published As

Publication number Publication date
DE69730524T2 (de) 2005-09-15
AU1984897A (en) 1997-09-16
US6288154B1 (en) 2001-09-11
EP0956180A4 (de) 2003-01-15
US5964644A (en) 1999-10-12
AU724229B2 (en) 2000-09-14
CA2283131A1 (en) 1997-09-04
EP0956180A1 (de) 1999-11-17
EP0956180B1 (de) 2004-09-01
ATE275023T1 (de) 2004-09-15
CA2283131C (en) 2005-04-26
WO1997031752A1 (en) 1997-09-04

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