DE69715952D1 - Poliervorrichtung - Google Patents
PoliervorrichtungInfo
- Publication number
- DE69715952D1 DE69715952D1 DE69715952T DE69715952T DE69715952D1 DE 69715952 D1 DE69715952 D1 DE 69715952D1 DE 69715952 T DE69715952 T DE 69715952T DE 69715952 T DE69715952 T DE 69715952T DE 69715952 D1 DE69715952 D1 DE 69715952D1
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13098796A JPH09295262A (ja) | 1996-04-26 | 1996-04-26 | ポリッシング装置 |
JP15760896A JPH09320997A (ja) | 1996-05-28 | 1996-05-28 | ポリッシング装置と洗浄装置の配管構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69715952D1 true DE69715952D1 (de) | 2002-11-07 |
DE69715952T2 DE69715952T2 (de) | 2003-08-07 |
Family
ID=26465955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69715952T Expired - Fee Related DE69715952T2 (de) | 1996-04-26 | 1997-04-25 | Poliervorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6227954B1 (de) |
EP (1) | EP0803326B1 (de) |
KR (1) | KR100415406B1 (de) |
DE (1) | DE69715952T2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3770752B2 (ja) | 1998-08-11 | 2006-04-26 | 株式会社日立製作所 | 半導体装置の製造方法及び加工装置 |
US6409580B1 (en) * | 2001-03-26 | 2002-06-25 | Speedfam-Ipec Corporation | Rigid polishing pad conditioner for chemical mechanical polishing tool |
US9245783B2 (en) | 2013-05-24 | 2016-01-26 | Novellus Systems, Inc. | Vacuum robot with linear translation carriage |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63207559A (ja) | 1987-02-19 | 1988-08-26 | Disco Abrasive Syst Ltd | ウエ−ハ自動研削装置 |
US5036625A (en) | 1988-12-07 | 1991-08-06 | Anatoly Gosis | Lapping plate for a lapping and polishing machine |
JPH0615565A (ja) * | 1991-12-18 | 1994-01-25 | Shin Etsu Handotai Co Ltd | ウエーハ自動ラッピング装置 |
US5733171A (en) * | 1996-07-18 | 1998-03-31 | Speedfam Corporation | Apparatus for the in-process detection of workpieces in a CMP environment |
KR100390293B1 (ko) | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | 폴리싱장치 |
JP3326642B2 (ja) * | 1993-11-09 | 2002-09-24 | ソニー株式会社 | 基板の研磨後処理方法およびこれに用いる研磨装置 |
US5679060A (en) * | 1994-07-14 | 1997-10-21 | Silicon Technology Corporation | Wafer grinding machine |
DE19544328B4 (de) | 1994-11-29 | 2014-03-20 | Ebara Corp. | Poliervorrichtung |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
US5679055A (en) * | 1996-05-31 | 1997-10-21 | Memc Electronic Materials, Inc. | Automated wafer lapping system |
-
1997
- 1997-04-25 KR KR1019970015480A patent/KR100415406B1/ko not_active IP Right Cessation
- 1997-04-25 DE DE69715952T patent/DE69715952T2/de not_active Expired - Fee Related
- 1997-04-25 US US08/845,423 patent/US6227954B1/en not_active Expired - Lifetime
- 1997-04-25 EP EP97106937A patent/EP0803326B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0803326A3 (de) | 1998-04-15 |
US6227954B1 (en) | 2001-05-08 |
EP0803326A2 (de) | 1997-10-29 |
KR100415406B1 (ko) | 2004-06-18 |
KR970077251A (ko) | 1997-12-12 |
EP0803326B1 (de) | 2002-10-02 |
DE69715952T2 (de) | 2003-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: EBARA CORP., TOKIO/TOKYO, JP |
|
8339 | Ceased/non-payment of the annual fee |