DE69712541D1 - Halbleiterlaser und Herstellungsverfahren - Google Patents

Halbleiterlaser und Herstellungsverfahren

Info

Publication number
DE69712541D1
DE69712541D1 DE69712541T DE69712541T DE69712541D1 DE 69712541 D1 DE69712541 D1 DE 69712541D1 DE 69712541 T DE69712541 T DE 69712541T DE 69712541 T DE69712541 T DE 69712541T DE 69712541 D1 DE69712541 D1 DE 69712541D1
Authority
DE
Germany
Prior art keywords
manufacturing process
semiconductor laser
laser
semiconductor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69712541T
Other languages
English (en)
Other versions
DE69712541T2 (de
Inventor
Hiroaki Ikeda
Ken Ohbayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69712541D1 publication Critical patent/DE69712541D1/de
Publication of DE69712541T2 publication Critical patent/DE69712541T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/204—Strongly index guided structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054—Methods of obtaining the confinement
    • H01S5/2081—Methods of obtaining the confinement using special etching techniques
    • H01S5/209—Methods of obtaining the confinement using special etching techniques special etch stop layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2218—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
    • H01S5/222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties having a refractive index lower than that of the cladding layers or outer guiding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
    • H01S5/2227—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties special thin layer sequence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32316—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm comprising only (Al)GaAs

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE69712541T 1996-01-19 1997-01-17 Halbleiterlaser und Herstellungsverfahren Expired - Lifetime DE69712541T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00738296A JP3429407B2 (ja) 1996-01-19 1996-01-19 半導体レーザ装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE69712541D1 true DE69712541D1 (de) 2002-06-20
DE69712541T2 DE69712541T2 (de) 2002-12-19

Family

ID=11664396

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69712541T Expired - Lifetime DE69712541T2 (de) 1996-01-19 1997-01-17 Halbleiterlaser und Herstellungsverfahren

Country Status (4)

Country Link
US (2) US5956361A (de)
EP (1) EP0785602B1 (de)
JP (1) JP3429407B2 (de)
DE (1) DE69712541T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0870352A1 (de) * 1996-09-26 1998-10-14 Uniphase Opto Holdings, Inc. Verfahren zur herstellung einer optoelektronischen halbleitervorrichtung mit mesa
US6160830A (en) 1998-03-04 2000-12-12 Motorola, Inc. Semiconductor laser device and method of manufacture
WO2000021169A1 (fr) * 1998-10-07 2000-04-13 Sharp Kabushiki Kaisha Laser a semiconducteurs
DE60027949T2 (de) * 1999-02-23 2007-01-04 Mitsubishi Chemical Corp. Optische Halbleitervorrichtung
JP3459607B2 (ja) * 1999-03-24 2003-10-20 三洋電機株式会社 半導体レーザ素子およびその製造方法
JP3575373B2 (ja) * 1999-04-19 2004-10-13 株式会社村田製作所 外力検知センサの製造方法
DE60031819T2 (de) * 1999-09-27 2007-09-13 Sanyo Electric Co., Ltd., Moriguchi Halbleiterlaservorrichtung und Herstellungsverfahren
DE60033369T2 (de) * 1999-12-28 2007-11-29 Sanyo Electric Co., Ltd., Moriguchi Halbleiterlaservorrichtung
KR100396742B1 (ko) * 2000-11-23 2003-09-02 주식회사일진 광학집적회로 소자 및 그 제조방법, 그리고 그 광학집적회로 소자를 이용하여 제조한 광통신용 송수신 장치의 모듈
JP3762640B2 (ja) 2000-12-25 2006-04-05 ユーディナデバイス株式会社 半導体装置の製造方法および光導波路の製造方法、多層光導波路の製造方法
JP2002217105A (ja) * 2001-01-17 2002-08-02 Sumitomo Chem Co Ltd ３−５族化合物半導体の製造方法
JP2002374040A (ja) 2001-06-15 2002-12-26 Sharp Corp 半導体レーザ素子およびその製造方法
US6839369B2 (en) * 2001-06-26 2005-01-04 The Furukawa Electric Co., Ltd. Surface emitting semiconductor laser device
US6977953B2 (en) * 2001-07-27 2005-12-20 Sanyo Electric Co., Ltd. Nitride-based semiconductor light-emitting device and method of fabricating the same
JP2004055587A (ja) * 2002-07-16 2004-02-19 Sharp Corp 半導体レーザ素子および半導体レーザ素子の製造方法
JP2005085977A (ja) * 2003-09-09 2005-03-31 Sharp Corp 半導体レーザ素子および半導体レーザ素子の製造方法
US8373152B2 (en) * 2008-03-27 2013-02-12 Lg Innotek Co., Ltd. Light-emitting element and a production method therefor
JP2009289899A (ja) * 2008-05-28 2009-12-10 Kyocera Corp 半導体発光素子、これを備えたｌｅｄアレイチップ、及び半導体発光素子の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5029175A (en) * 1988-12-08 1991-07-02 Matsushita Electric Industrial Co., Ltd. Semiconductor laser
JPH02228089A (ja) * 1989-02-28 1990-09-11 Omron Tateisi Electron Co リッジ導波路型半導体レーザ
JP2555197B2 (ja) * 1989-09-09 1996-11-20 三菱電機株式会社 半導体レーザ装置
JP3098827B2 (ja) 1991-12-05 2000-10-16 松下電子工業株式会社 半導体レーザ装置
US5297158A (en) * 1991-04-22 1994-03-22 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device including a gallium-aluminum arsenic compound
US5316967A (en) * 1992-01-21 1994-05-31 Mitsubishi Denki Kabushiki Kaisha Method for producing semiconductor device
DE4240539C2 (de) * 1992-01-21 1997-07-03 Mitsubishi Electric Corp Verfahren zur Herstellung eines Halbleiterlasers
JPH06268334A (ja) * 1993-03-16 1994-09-22 Mitsubishi Kasei Corp レーザーダイオード及びその製造方法
JPH07235732A (ja) * 1993-12-28 1995-09-05 Nec Corp 半導体レーザ
US5400354A (en) * 1994-02-08 1995-03-21 Ludowise; Michael Laminated upper cladding structure for a light-emitting device
JPH08264898A (ja) * 1995-03-23 1996-10-11 Mitsubishi Electric Corp 半導体レーザ装置

Also Published As

Publication number Publication date
DE69712541T2 (de) 2002-12-19
JPH09199790A (ja) 1997-07-31
US6140142A (en) 2000-10-31
EP0785602B1 (de) 2002-05-15
EP0785602A1 (de) 1997-07-23
JP3429407B2 (ja) 2003-07-22
US5956361A (en) 1999-09-21

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