DE69611692D1 - Verfahren und vorrichtung zum aufbringen von kleinen flüssigen materialmengen - Google Patents
Verfahren und vorrichtung zum aufbringen von kleinen flüssigen materialmengenInfo
- Publication number
- DE69611692D1 DE69611692D1 DE69611692T DE69611692T DE69611692D1 DE 69611692 D1 DE69611692 D1 DE 69611692D1 DE 69611692 T DE69611692 T DE 69611692T DE 69611692 T DE69611692 T DE 69611692T DE 69611692 D1 DE69611692 D1 DE 69611692D1
- Authority
- DE
- Germany
- Prior art keywords
- small liquid
- applying small
- liquid quantities
- quantities
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F13/00—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
- G01F13/006—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups measuring volume in function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55933295A | 1995-11-16 | 1995-11-16 | |
US60712696A | 1996-02-26 | 1996-02-26 | |
PCT/US1996/018380 WO1997018054A1 (en) | 1995-11-16 | 1996-11-12 | Method and apparatus for dispensing small amounts of liquid material |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69611692D1 true DE69611692D1 (de) | 2001-03-01 |
DE69611692T2 DE69611692T2 (de) | 2001-09-06 |
Family
ID=27072035
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE06075088T Pending DE06075088T1 (de) | 1995-11-16 | 1996-11-12 | Verfahren und Vorrichtung zum Abgeben von aus flüssigem Material hergestellten kleinen Mengen |
DE69632795T Revoked DE69632795T8 (de) | 1995-11-16 | 1996-11-12 | Verfahren und Vorrichtung zur Ausgabe von kleinen Mengen eines flüssigen Materials |
DE69611692T Expired - Lifetime DE69611692T2 (de) | 1995-11-16 | 1996-11-12 | Verfahren und vorrichtung zum aufbringen von kleinen flüssigen materialmengen |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE06075088T Pending DE06075088T1 (de) | 1995-11-16 | 1996-11-12 | Verfahren und Vorrichtung zum Abgeben von aus flüssigem Material hergestellten kleinen Mengen |
DE69632795T Revoked DE69632795T8 (de) | 1995-11-16 | 1996-11-12 | Verfahren und Vorrichtung zur Ausgabe von kleinen Mengen eines flüssigen Materials |
Country Status (6)
Country | Link |
---|---|
EP (4) | EP1437192A3 (de) |
JP (3) | JP3616105B2 (de) |
AU (1) | AU1119797A (de) |
CA (1) | CA2235991C (de) |
DE (3) | DE06075088T1 (de) |
WO (1) | WO1997018054A1 (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6253957B1 (en) | 1995-11-16 | 2001-07-03 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
US6267266B1 (en) | 1995-11-16 | 2001-07-31 | Nordson Corporation | Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate |
US5918648A (en) * | 1997-02-21 | 1999-07-06 | Speedline Techologies, Inc. | Method and apparatus for measuring volume |
US6093251A (en) * | 1997-02-21 | 2000-07-25 | Speedline Technologies, Inc. | Apparatus for measuring the height of a substrate in a dispensing system |
US5957343A (en) * | 1997-06-30 | 1999-09-28 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US6085943A (en) * | 1997-06-30 | 2000-07-11 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US6324973B2 (en) * | 1997-11-07 | 2001-12-04 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
ES2152817B1 (es) * | 1998-05-20 | 2001-08-16 | Barberan Sa | Perfeccionamientos en los cabezales de aplicacion por tobera de colas termofusibles o de poliuterano reactivo. |
DE20106464U1 (de) * | 2001-04-12 | 2001-08-02 | Pac Tech - Packaging Technologies GmbH, 14641 Nauen | Vorrichtung zum Aufbringen von Lotkugeln |
US7617951B2 (en) * | 2002-01-28 | 2009-11-17 | Nordson Corporation | Compact heated air manifolds for adhesive application |
CN100439820C (zh) | 2003-07-14 | 2008-12-03 | 诺信公司 | 用于分配不连续量的粘性物质的装置和方法 |
DE10338360A1 (de) * | 2003-08-21 | 2005-03-31 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Verfahren und Vorrichtung zur Herstellung eines Wabenkörpers |
US7168463B2 (en) * | 2004-02-23 | 2007-01-30 | Nidec Corporation | Method of charging dynamic-pressure bearing device with lubricating fluid, and method of inspecting dynamic-pressure bearing device |
JP5344262B2 (ja) * | 2004-12-20 | 2013-11-20 | Uht株式会社 | 液滴射出装置 |
JP5329974B2 (ja) | 2006-01-06 | 2013-10-30 | ノードソン コーポレーション | 個別化されたプロセス空気制御を有する液体ディスペンサ |
US20080099538A1 (en) * | 2006-10-27 | 2008-05-01 | United Technologies Corporation & Pratt & Whitney Canada Corp. | Braze pre-placement using cold spray deposition |
US20090095825A1 (en) * | 2007-10-11 | 2009-04-16 | Nordson Corporation | Dispenser nozzle having differential hardness |
DE202008004350U1 (de) | 2008-03-31 | 2009-08-27 | Hentschel, Lothar | Dosierventil für die berührungsfreie Dosierung von reaktiven Fluiden |
DE102008027259A1 (de) * | 2008-06-06 | 2009-12-17 | Focke & Co.(Gmbh & Co. Kg) | Verfahren und Vorrichtung zur Herstellung von Zigarettenpackungen |
US8753713B2 (en) * | 2010-06-05 | 2014-06-17 | Nordson Corporation | Jetting dispenser and method of jetting highly cohesive adhesives |
DE202010013815U1 (de) | 2010-10-05 | 2012-01-13 | Lothar Hentschel | Elektropneumatisch betätigtes Ventil für die dosierte Abgabe von Flüssigkeiten |
KR101869089B1 (ko) * | 2011-01-04 | 2018-06-19 | 주식회사 탑 엔지니어링 | 점성물질 젯팅 장치 |
JP5435308B2 (ja) | 2011-08-02 | 2014-03-05 | 株式会社安川電機 | 接着剤塗布装置 |
DE202011107412U1 (de) | 2011-11-03 | 2013-02-04 | Lothar Hentschel | Einstellbares Ventil für die dosierte Abgabe von Flüssigkeiten |
CH705930B1 (de) * | 2011-12-22 | 2015-08-28 | Esec Ag | Verfahren zum Auftragen von Klebstoff auf ein Substrat. |
DE102013006106A1 (de) * | 2013-04-09 | 2014-10-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung |
KR102288108B1 (ko) | 2013-10-05 | 2021-08-09 | 무사시 엔지니어링 가부시키가이샤 | 액체 재료 충전 장치 및 방법 |
DE102014010843B4 (de) | 2014-07-24 | 2020-12-03 | Technische Universität Braunschweig | Dosierdüse und Verfahren zum dosierten Auftragen hochviskoser Medien |
CN106794483A (zh) * | 2014-08-28 | 2017-05-31 | 诺信公司 | 非冲击的喷射分配模块及方法 |
DE102016212892C5 (de) * | 2016-07-14 | 2020-01-30 | F. Holzer Gmbh | Pumpkopf sowie Dosiervorrichtung |
DE102016212893A1 (de) * | 2016-07-14 | 2018-01-18 | F. Holzer Gmbh | Pumpkopf sowie Dosiervorrichtung |
DE102017126307A1 (de) | 2017-11-09 | 2019-05-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung sowie Verfahren zum Dosieren von flüssigen Medien |
WO2019181812A1 (ja) * | 2018-03-20 | 2019-09-26 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
CN110252591A (zh) * | 2018-06-12 | 2019-09-20 | 玛珂***分析和开发有限公司 | 喷射阀 |
DE102019107836A1 (de) * | 2018-06-12 | 2019-12-12 | Marco Systemanalyse Und Entwicklung Gmbh | Jet-Ventil |
DE102018133606B3 (de) | 2018-12-27 | 2019-12-24 | PerfecDos GbR (vertretungsberechtigte Gesellschafter: Lothar Hentschel, 82544 Egling; Benjamin Kratz, 82211 Hersching; Peter Friedl, 83623 Dietramszell) | Jet-Dosierventil |
KR102326763B1 (ko) * | 2020-07-15 | 2021-11-16 | 주식회사 위너스에프에이 | 디스펜서 |
JP7229558B2 (ja) * | 2020-12-04 | 2023-02-28 | 株式会社ワークス | 電子部品接着用ノズル |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2025509A (en) * | 1934-05-10 | 1935-12-24 | Hieber Karl | Electric soldering iron |
US4066188A (en) * | 1976-08-10 | 1978-01-03 | Nordson Corporation | Thermoplastic adhesive dispenser having an internal heat exchanger |
FR2637520B1 (fr) * | 1988-10-07 | 1990-11-23 | Bourton Gilles | Fer a souder integral a ecoulement automatique et simultane de la soudure et de son decapant |
US4942998A (en) * | 1988-12-15 | 1990-07-24 | Horvath Bruce B | Apparatus and process for automatically dispensing metal alloy paste material for joining metal components |
JP2572289B2 (ja) * | 1990-04-12 | 1997-01-16 | セイコー電子工業株式会社 | 高粘度液体定量吐出装置 |
DE4013323C2 (de) * | 1990-04-26 | 1996-07-25 | Hhs Leimauftrags Systeme Gmbh | Dosierventil |
JP2964540B2 (ja) * | 1990-05-09 | 1999-10-18 | ソニー株式会社 | 接着剤塗布装置 |
JPH0430593A (ja) * | 1990-05-28 | 1992-02-03 | Matsushita Electric Works Ltd | 接着剤塗布方法及びフラックス塗布方法及び半田ペースト塗布方法 |
JPH0522054A (ja) * | 1991-07-16 | 1993-01-29 | Nec Corp | エミツタ・フオロア付差動増幅回路 |
JPH0531458A (ja) * | 1991-07-30 | 1993-02-09 | Tdk Corp | 水性エマルジヨン接着剤の塗布方法 |
JP2527926Y2 (ja) * | 1991-09-05 | 1997-03-05 | 徳興 中橋 | ホットメルトアプリケータ |
US5320250A (en) * | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
JPH05168997A (ja) * | 1991-12-26 | 1993-07-02 | Matsushita Electric Ind Co Ltd | ディスペンサ |
-
1996
- 1996-11-12 DE DE06075088T patent/DE06075088T1/de active Pending
- 1996-11-12 DE DE69632795T patent/DE69632795T8/de not_active Revoked
- 1996-11-12 EP EP04075967A patent/EP1437192A3/de not_active Withdrawn
- 1996-11-12 CA CA002235991A patent/CA2235991C/en not_active Expired - Lifetime
- 1996-11-12 AU AU11197/97A patent/AU1119797A/en not_active Abandoned
- 1996-11-12 JP JP51911897A patent/JP3616105B2/ja not_active Expired - Lifetime
- 1996-11-12 EP EP00303607A patent/EP1029626B1/de not_active Revoked
- 1996-11-12 WO PCT/US1996/018380 patent/WO1997018054A1/en active IP Right Grant
- 1996-11-12 EP EP06075088A patent/EP1655094A1/de not_active Withdrawn
- 1996-11-12 EP EP96942008A patent/EP0861136B1/de not_active Expired - Lifetime
- 1996-11-12 DE DE69611692T patent/DE69611692T2/de not_active Expired - Lifetime
-
2004
- 2004-08-04 JP JP2004228340A patent/JP4657648B2/ja not_active Expired - Lifetime
-
2009
- 2009-12-24 JP JP2009292532A patent/JP4989716B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1437192A3 (de) | 2005-06-08 |
EP1437192A2 (de) | 2004-07-14 |
EP1029626B1 (de) | 2004-06-23 |
CA2235991A1 (en) | 1997-05-22 |
CA2235991C (en) | 2005-02-15 |
DE69632795T8 (de) | 2005-10-20 |
JP2000501331A (ja) | 2000-02-08 |
DE69611692T2 (de) | 2001-09-06 |
EP1029626A2 (de) | 2000-08-23 |
WO1997018054A1 (en) | 1997-05-22 |
EP0861136A1 (de) | 1998-09-02 |
JP4657648B2 (ja) | 2011-03-23 |
AU1119797A (en) | 1997-06-05 |
JP2004322099A (ja) | 2004-11-18 |
DE69632795T3 (de) | 2005-07-14 |
DE69632795D1 (de) | 2004-07-29 |
JP2010075930A (ja) | 2010-04-08 |
EP1029626A3 (de) | 2000-10-18 |
JP3616105B2 (ja) | 2005-02-02 |
DE06075088T1 (de) | 2007-01-04 |
JP4989716B2 (ja) | 2012-08-01 |
EP1655094A1 (de) | 2006-05-10 |
EP0861136B1 (de) | 2001-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |