DE69610691T2 - Belichtungsverfahren und Belichtungsvorrichtung - Google Patents

Belichtungsverfahren und Belichtungsvorrichtung

Info

Publication number
DE69610691T2
DE69610691T2 DE69610691T DE69610691T DE69610691T2 DE 69610691 T2 DE69610691 T2 DE 69610691T2 DE 69610691 T DE69610691 T DE 69610691T DE 69610691 T DE69610691 T DE 69610691T DE 69610691 T2 DE69610691 T2 DE 69610691T2
Authority
DE
Germany
Prior art keywords
exposure
exposure device
exposure method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69610691T
Other languages
English (en)
Other versions
DE69610691D1 (de
Inventor
Masahiro Morisada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1698696A external-priority patent/JPH09190224A/ja
Priority claimed from JP8340445A external-priority patent/JPH09251955A/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69610691D1 publication Critical patent/DE69610691D1/de
Publication of DE69610691T2 publication Critical patent/DE69610691T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69610691T 1996-01-08 1996-12-31 Belichtungsverfahren und Belichtungsvorrichtung Expired - Fee Related DE69610691T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1698596 1996-01-08
JP1698696A JPH09190224A (ja) 1996-01-08 1996-01-08 Xyステージ制御装置
JP8340445A JPH09251955A (ja) 1996-01-08 1996-12-06 露光方法および装置、ならびにデバイス製造方法

Publications (2)

Publication Number Publication Date
DE69610691D1 DE69610691D1 (de) 2000-11-23
DE69610691T2 true DE69610691T2 (de) 2001-05-03

Family

ID=27281646

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69610691T Expired - Fee Related DE69610691T2 (de) 1996-01-08 1996-12-31 Belichtungsverfahren und Belichtungsvorrichtung

Country Status (3)

Country Link
EP (1) EP0785571B1 (de)
KR (1) KR100219824B1 (de)
DE (1) DE69610691T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU9095798A (en) 1997-09-19 1999-04-12 Nikon Corporation Stage device, a scanning aligner and a scanning exposure method, and a device manufactured thereby
JP3796367B2 (ja) 1999-03-09 2006-07-12 キヤノン株式会社 ステージ制御方法、露光方法、露光装置およびデバイス製造方法
US6285438B1 (en) 1999-05-19 2001-09-04 Nikon Corporation Scanning exposure method with reduced time between scans
JP2004072076A (ja) * 2002-06-10 2004-03-04 Nikon Corp 露光装置及びステージ装置、並びにデバイス製造方法
US7016019B2 (en) 2003-12-16 2006-03-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100456136C (zh) * 2005-12-02 2009-01-28 上海微电子装备有限公司 一种步进扫描投影光刻机多总线时序同步控制方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4023126A (en) * 1975-06-26 1977-05-10 Gte Laboratories Incorporated Scanning photographic printer for integrated circuits
US5285236A (en) * 1992-09-30 1994-02-08 Kanti Jain Large-area, high-throughput, high-resolution projection imaging system

Also Published As

Publication number Publication date
EP0785571B1 (de) 2000-10-18
KR970060355A (ko) 1997-08-12
EP0785571A2 (de) 1997-07-23
DE69610691D1 (de) 2000-11-23
EP0785571A3 (de) 1997-08-27
KR100219824B1 (ko) 1999-09-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee