DE69531568D1 - Apparat zur Projektionsbelichtung und Verfahren zur Herstellung einer Vorrichtung unter Verwendung desselben - Google Patents

Apparat zur Projektionsbelichtung und Verfahren zur Herstellung einer Vorrichtung unter Verwendung desselben

Info

Publication number
DE69531568D1
DE69531568D1 DE69531568T DE69531568T DE69531568D1 DE 69531568 D1 DE69531568 D1 DE 69531568D1 DE 69531568 T DE69531568 T DE 69531568T DE 69531568 T DE69531568 T DE 69531568T DE 69531568 D1 DE69531568 D1 DE 69531568D1
Authority
DE
Germany
Prior art keywords
manufacturing
same
exposure apparatus
projection exposure
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69531568T
Other languages
English (en)
Other versions
DE69531568T2 (de
Inventor
Fumio Sakai
Yuichi Yamada
Yasuo Hasegawa
Shinji Utamura
Kazuhito Outsuka
Kazuhiro Takahashi
Hideki Nogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69531568D1 publication Critical patent/DE69531568D1/de
Application granted granted Critical
Publication of DE69531568T2 publication Critical patent/DE69531568T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70133—Measurement of illumination distribution, in pupil plane or field plane
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69531568T 1994-06-24 1995-06-22 Apparat zur Projektionsbelichtung und Verfahren zur Herstellung einer Vorrichtung unter Verwendung desselben Expired - Lifetime DE69531568T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP14332894 1994-06-24
JP14332894 1994-06-24
JP22175494 1994-09-16
JP22175494A JP3186011B2 (ja) 1994-06-24 1994-09-16 投影露光装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
DE69531568D1 true DE69531568D1 (de) 2003-10-02
DE69531568T2 DE69531568T2 (de) 2004-06-17

Family

ID=26475093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69531568T Expired - Lifetime DE69531568T2 (de) 1994-06-24 1995-06-22 Apparat zur Projektionsbelichtung und Verfahren zur Herstellung einer Vorrichtung unter Verwendung desselben

Country Status (6)

Country Link
US (1) US5925887A (de)
EP (1) EP0689099B1 (de)
JP (1) JP3186011B2 (de)
KR (1) KR960002904A (de)
DE (1) DE69531568T2 (de)
SG (1) SG40012A1 (de)

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US6559465B1 (en) 1996-08-02 2003-05-06 Canon Kabushiki Kaisha Surface position detecting method having a detection timing determination
JPH10116766A (ja) * 1996-10-11 1998-05-06 Canon Inc 露光装置及びデバイス製造方法
US5888675A (en) * 1996-12-04 1999-03-30 Advanced Micro Devices, Inc. Reticle that compensates for radiation-induced lens error in a photolithographic system
US5723238A (en) * 1996-12-04 1998-03-03 Advanced Micro Devices, Inc. Inspection of lens error associated with lens heating in a photolithographic system
US6118113A (en) * 1998-03-02 2000-09-12 Hibbard; Earl Roger Focusing mirror control system and method for adjusting same
JP2000003855A (ja) 1998-06-12 2000-01-07 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JP2001110710A (ja) 1999-10-08 2001-04-20 Nikon Corp 露光装置、露光方法、および半導体デバイスの製造方法
JP2001196293A (ja) 2000-01-14 2001-07-19 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JP2001267239A (ja) * 2000-01-14 2001-09-28 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP2001217178A (ja) 2000-02-02 2001-08-10 Canon Inc 露光装置及びデバイス製造方法
JP3631094B2 (ja) * 2000-03-30 2005-03-23 キヤノン株式会社 投影露光装置及びデバイス製造方法
EP1184727A1 (de) * 2000-09-01 2002-03-06 Asm Lithography B.V. Lithographischer Apparat
JP2002110540A (ja) * 2000-09-01 2002-04-12 Asm Lithography Bv リソグラフィ装置を操作する方法、リソグラフィ装置、デバイス製造方法、およびそれによって製造されるデバイス
JP2002134393A (ja) * 2000-10-24 2002-05-10 Mitsubishi Electric Corp 露光装置、露光方法およびその露光方法を用いて製造した半導体装置
JP2002158154A (ja) 2000-11-16 2002-05-31 Canon Inc 露光装置
DE10133992A1 (de) 2001-07-12 2003-01-23 Leica Microsystems Anordnung und Verfahren zur Beleuchtung eines Objektfeldes in einem optischen Gerät
JP3870153B2 (ja) * 2002-10-22 2007-01-17 キヤノン株式会社 光学特性の測定方法
WO2004057423A1 (de) * 2002-12-19 2004-07-08 Carl Zeiss Smt Ag Messverfahren und messsystem zur vermessung der abbildungsqualität eines optischen abbildungssystems
DE10261775A1 (de) * 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Vorrichtung zur optischen Vermessung eines Abbildungssystems
EP1628330A4 (de) 2003-05-28 2009-09-16 Nikon Corp Belichtungsverfahren, belichtungseinrichtung und bauelementeherstellungsverfahren
TWI497565B (zh) 2003-09-29 2015-08-21 尼康股份有限公司 An exposure apparatus and an exposure method, and an element manufacturing method
JP4684563B2 (ja) 2004-02-26 2011-05-18 キヤノン株式会社 露光装置及び方法
US7221430B2 (en) * 2004-05-11 2007-05-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4845880B2 (ja) 2004-06-04 2011-12-28 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学結像系の像品質測定システム
JP2007024758A (ja) * 2005-07-20 2007-02-01 Tokyo Seimitsu Co Ltd 光学式検査装置及びその照明方法
US7382438B2 (en) * 2005-08-23 2008-06-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007060118A (ja) * 2005-08-23 2007-03-08 Casio Comput Co Ltd 投影装置及び投影制御方法
DE102005042496A1 (de) 2005-09-05 2007-03-08 Carl Zeiss Sms Gmbh Verfahren zur Korrektur der Apodisierung in mikroskopischen Abbildungssystemen
KR100741110B1 (ko) * 2006-02-15 2007-07-19 삼성에스디아이 주식회사 광 파이버 및 플라즈마 디스플레이 패널의 전극 형성 방법
US7760345B2 (en) * 2006-11-22 2010-07-20 Carl Zeiss Smt Ag Method and apparatus for determining at least one optical property of an imaging optical system
JP2009033048A (ja) * 2007-07-30 2009-02-12 Canon Inc 露光装置及びデバイス製造方法
JP2009218366A (ja) 2008-03-10 2009-09-24 Canon Inc 露光装置、露光方法、算出方法及びデバイス製造方法
KR102170864B1 (ko) * 2012-05-02 2020-10-28 가부시키가이샤 니콘 동공 휘도 분포의 평가 방법 및 개선 방법, 조명 광학계 및 그 조정 방법, 노광 장치, 노광 방법, 및 디바이스 제조 방법
CN107870522B (zh) * 2016-09-26 2020-06-16 上海微电子装备（集团）股份有限公司 成像光路装置与成像光路装置的检测控制方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58179834A (ja) * 1982-04-14 1983-10-21 Canon Inc 投影露光装置及び方法
US4666273A (en) * 1983-10-05 1987-05-19 Nippon Kogaku K. K. Automatic magnification correcting system in a projection optical apparatus
JPS60148115A (ja) * 1984-01-13 1985-08-05 Nec Corp 縮小投影式露光装置
US4585342A (en) * 1984-06-29 1986-04-29 International Business Machines Corporation System for real-time monitoring the characteristics, variations and alignment errors of lithography structures
US4780615A (en) * 1985-02-01 1988-10-25 Canon Kabushiki Kaisha Alignment system for use in pattern transfer apparatus
US5337097A (en) * 1985-12-26 1994-08-09 Nippon Kogaku K.K. Projection optical apparatus
US4780616A (en) * 1986-09-25 1988-10-25 Nippon Kogaku K. K. Projection optical apparatus for mask to substrate alignment
US5105075A (en) * 1988-09-19 1992-04-14 Canon Kabushiki Kaisha Projection exposure apparatus
US5305054A (en) * 1991-02-22 1994-04-19 Canon Kabushiki Kaisha Imaging method for manufacture of microdevices
JPH0536586A (ja) * 1991-08-02 1993-02-12 Canon Inc 像投影方法及び該方法を用いた半導体デバイスの製造方法
US5424803A (en) * 1991-08-09 1995-06-13 Canon Kabushiki Kaisha Projection exposure apparatus and semiconductor device manufacturing method
JP2938187B2 (ja) * 1991-09-20 1999-08-23 株式会社日立製作所 パターン形成方法及び同方法を実施するための装置
US5420417A (en) * 1991-10-08 1995-05-30 Nikon Corporation Projection exposure apparatus with light distribution adjustment

Also Published As

Publication number Publication date
EP0689099A1 (de) 1995-12-27
KR960002904A (ko) 1996-01-26
JP3186011B2 (ja) 2001-07-11
EP0689099B1 (de) 2003-08-27
JPH0869963A (ja) 1996-03-12
SG40012A1 (en) 1997-06-14
US5925887A (en) 1999-07-20
DE69531568T2 (de) 2004-06-17

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