DE69520094D1 - Lösung zur vorbehandlung für elektronenloses beschichten, bad und verfahren - Google Patents
Lösung zur vorbehandlung für elektronenloses beschichten, bad und verfahrenInfo
- Publication number
- DE69520094D1 DE69520094D1 DE69520094T DE69520094T DE69520094D1 DE 69520094 D1 DE69520094 D1 DE 69520094D1 DE 69520094 T DE69520094 T DE 69520094T DE 69520094 T DE69520094 T DE 69520094T DE 69520094 D1 DE69520094 D1 DE 69520094D1
- Authority
- DE
- Germany
- Prior art keywords
- electronless
- bath
- coating
- treatment solution
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32558494 | 1994-12-27 | ||
JP5457695 | 1995-03-14 | ||
JP16525895 | 1995-06-30 | ||
PCT/JP1995/002014 WO1996020294A1 (fr) | 1994-12-27 | 1995-10-03 | Solution de pre-traitement pour depot autocatalytique, bain et procede de depot autocatalytique |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69520094D1 true DE69520094D1 (de) | 2001-03-22 |
DE69520094T2 DE69520094T2 (de) | 2001-06-13 |
Family
ID=27295336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69520094T Expired - Lifetime DE69520094T2 (de) | 1994-12-27 | 1995-10-03 | Lösung zur vorbehandlung für elektronenloses beschichten, bad und verfahren |
Country Status (8)
Country | Link |
---|---|
US (2) | US6146700A (de) |
EP (1) | EP0747507B1 (de) |
JP (1) | JP3392873B2 (de) |
KR (1) | KR100235850B1 (de) |
CN (1) | CN1131894C (de) |
DE (1) | DE69520094T2 (de) |
MY (1) | MY126635A (de) |
WO (1) | WO1996020294A1 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
IT1306477B1 (it) | 1998-10-13 | 2001-06-11 | Hydor Srl | Dispositivo riscaldatore termostatico per liquidi, in particolare perl'acqua di acquari. |
US7338908B1 (en) | 2003-10-20 | 2008-03-04 | Novellus Systems, Inc. | Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage |
EP1020543A1 (de) * | 1999-01-15 | 2000-07-19 | Interuniversitair Micro-Elektronica Centrum Vzw | Absetzung von Kupfer auf einer aktivierter Oberfläche eines Substrats |
US6674053B2 (en) | 2001-06-14 | 2004-01-06 | Trebor International | Electrical, thin film termination |
US6663914B2 (en) | 2000-02-01 | 2003-12-16 | Trebor International | Method for adhering a resistive coating to a substrate |
US6433319B1 (en) | 2000-12-15 | 2002-08-13 | Brian A. Bullock | Electrical, thin film termination |
US6580061B2 (en) | 2000-02-01 | 2003-06-17 | Trebor International Inc | Durable, non-reactive, resistive-film heater |
US6544583B2 (en) | 2000-02-01 | 2003-04-08 | Trebor International, Inc. | Method for adjusting resistivity of a film heater |
US7081602B1 (en) | 2000-02-01 | 2006-07-25 | Trebor International, Inc. | Fail-safe, resistive-film, immersion heater |
JP4521947B2 (ja) * | 2000-08-07 | 2010-08-11 | イビデン株式会社 | 無電解めっき用前処理液、無電解めっき用処理液、および、多層プリント配線板の製造方法 |
JP4508380B2 (ja) * | 2000-08-23 | 2010-07-21 | イビデン株式会社 | 多層プリント配線板の製造方法 |
DE10048844A1 (de) * | 2000-10-02 | 2002-04-11 | Basf Ag | Verfahren zur Herstellung von Platinmetall-Katalysatoren |
JP2003147541A (ja) * | 2001-11-15 | 2003-05-21 | Hitachi Ltd | 無電解銅めっき液、無電解銅めっき用補給液及び配線板の製造方法 |
KR20030049682A (ko) * | 2001-12-17 | 2003-06-25 | 최순돈 | 압전소자의 무전해도금을 위한 촉매독 제거 방법 |
US7897198B1 (en) * | 2002-09-03 | 2011-03-01 | Novellus Systems, Inc. | Electroless layer plating process and apparatus |
US20050016416A1 (en) * | 2003-07-23 | 2005-01-27 | Jon Bengston | Stabilizer for electroless copper plating solution |
US8530359B2 (en) * | 2003-10-20 | 2013-09-10 | Novellus Systems, Inc. | Modulated metal removal using localized wet etching |
US8158532B2 (en) * | 2003-10-20 | 2012-04-17 | Novellus Systems, Inc. | Topography reduction and control by selective accelerator removal |
US8372757B2 (en) * | 2003-10-20 | 2013-02-12 | Novellus Systems, Inc. | Wet etching methods for copper removal and planarization in semiconductor processing |
US7531463B2 (en) * | 2003-10-20 | 2009-05-12 | Novellus Systems, Inc. | Fabrication of semiconductor interconnect structure |
US7972970B2 (en) | 2003-10-20 | 2011-07-05 | Novellus Systems, Inc. | Fabrication of semiconductor interconnect structure |
EP1692081A2 (de) * | 2003-11-29 | 2006-08-23 | Cross Match Technologies, Inc. | Piezoelektrische vorrichtung und herstellungsverfahren dafür |
US20050194255A1 (en) * | 2004-03-04 | 2005-09-08 | Tiwari Chandra S. | Self-activated electroless metal deposition |
US6933231B1 (en) * | 2004-06-28 | 2005-08-23 | Micron Technology, Inc. | Methods of forming conductive interconnects, and methods of depositing nickel |
US20060035016A1 (en) * | 2004-08-11 | 2006-02-16 | Chandra Tiwari | Electroless metal deposition methods |
KR100966774B1 (ko) * | 2005-05-23 | 2010-06-29 | 이비덴 가부시키가이샤 | 프린트 배선판 |
US20060280860A1 (en) * | 2005-06-09 | 2006-12-14 | Enthone Inc. | Cobalt electroless plating in microelectronic devices |
US7605082B1 (en) | 2005-10-13 | 2009-10-20 | Novellus Systems, Inc. | Capping before barrier-removal IC fabrication method |
DE102005053553A1 (de) * | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Lotpasten mit harzfreien Flussmittel |
US7981508B1 (en) * | 2006-09-12 | 2011-07-19 | Sri International | Flexible circuits |
US20080236619A1 (en) * | 2007-04-02 | 2008-10-02 | Enthone Inc. | Cobalt capping surface preparation in microelectronics manufacture |
US8628818B1 (en) | 2007-06-21 | 2014-01-14 | Sri International | Conductive pattern formation |
US7989029B1 (en) * | 2007-06-21 | 2011-08-02 | Sri International | Reduced porosity copper deposition |
US20090162681A1 (en) * | 2007-12-21 | 2009-06-25 | Artur Kolics | Activation solution for electroless plating on dielectric layers |
US8159056B1 (en) | 2008-01-15 | 2012-04-17 | Rf Micro Devices, Inc. | Package for an electronic device |
JP5715748B2 (ja) * | 2008-10-31 | 2015-05-13 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 無電解めっき用コンディショナー |
US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
US8597461B2 (en) * | 2009-09-02 | 2013-12-03 | Novellus Systems, Inc. | Reduced isotropic etchant material consumption and waste generation |
JP5752504B2 (ja) * | 2011-06-30 | 2015-07-22 | 株式会社トクヤマ | 配線基板のめっき方法、めっき配線基板の製造方法、及び銀エッチング液 |
EP2581469B1 (de) * | 2011-10-10 | 2015-04-15 | Enthone, Inc. | Wässrige Aktivierungslösung und Verfahren zur stromlosen Kupferabscheidung auf direkt laserstrukturierten Substraten |
CN103476199B (zh) * | 2013-09-27 | 2016-02-03 | 电子科技大学 | 基于铜自催化和化学镀铜的印制电路加成制备方法 |
WO2015076549A1 (ko) * | 2013-11-22 | 2015-05-28 | 한국생산기술연구원 | 무전해 구리 도금액 조성물 및 이를 이용한 무전해 구리 도금방법 |
KR101612476B1 (ko) | 2013-11-22 | 2016-04-14 | 한국생산기술연구원 | 무전해 구리 도금액 조성물 및 이를 이용한 무전해 구리 도금방법 |
KR101509473B1 (ko) | 2014-12-19 | 2015-04-09 | (주) 우진 더블유.티.피. | 합성수지 무전해 인테나 도금 방법 및 이에 의한 리어 케이스 |
CN105296976A (zh) * | 2015-10-21 | 2016-02-03 | 深圳市发斯特精密技术有限公司 | 化学镀铜液及化学镀铜的方法 |
JP6982383B2 (ja) * | 2016-08-10 | 2021-12-17 | 上村工業株式会社 | 還元処理と同時に用いられる無電解めっき用前処理液、およびプリント配線基板の製造方法 |
JP7360903B2 (ja) * | 2018-11-09 | 2023-10-13 | 東洋鋼鈑株式会社 | めっき方法 |
CN110904444A (zh) * | 2019-12-23 | 2020-03-24 | 上海建立电镀有限公司 | 一种环保型钝化液及其钝化工艺 |
US20220074067A1 (en) * | 2020-09-04 | 2022-03-10 | Hutchinson Technology Incorporated | Microetch Neutralizer Chemistry For Ni-Au Plating Defect Elimination |
CN114150299A (zh) * | 2021-04-27 | 2022-03-08 | 天津大学 | 用于超低轮廓铜箔及其覆铜板制备的化学沉积方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3716462A (en) * | 1970-10-05 | 1973-02-13 | D Jensen | Copper plating on zinc and its alloys |
BE793263A (fr) * | 1971-12-22 | 1973-06-22 | Ici Ltd | Procede de depot du cobalt |
US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
US4234628A (en) * | 1978-11-28 | 1980-11-18 | The Harshaw Chemical Company | Two-step preplate system for polymeric surfaces |
EP0060294B1 (de) * | 1980-09-15 | 1985-12-27 | Shipley Company Inc. | Verfahren zum stromlosen abscheiden eines legierungsüberzuges |
JPS5852466A (ja) * | 1981-09-21 | 1983-03-28 | Hitachi Chem Co Ltd | 無電解銅めつき液 |
US4478883A (en) * | 1982-07-14 | 1984-10-23 | International Business Machines Corporation | Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate |
CA1218839A (en) * | 1982-10-28 | 1987-03-10 | Tokuzo Kanbe | Shielding material of electromagnetic waves |
JPS59119786A (ja) * | 1982-12-27 | 1984-07-11 | イビデン株式会社 | プリント配線板の無電解銅めっき方法 |
GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
US4639380A (en) * | 1985-05-06 | 1987-01-27 | International Business Machines Corporation | Process for preparing a substrate for subsequent electroless deposition of a metal |
JPS6311676A (ja) * | 1986-07-01 | 1988-01-19 | Nippon Denso Co Ltd | 化学銅めつき浴 |
JPH0723539B2 (ja) * | 1986-11-06 | 1995-03-15 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
JPS63129692A (ja) * | 1986-11-20 | 1988-06-02 | 富士通株式会社 | プリント配線板の製法 |
US4869930A (en) * | 1987-07-10 | 1989-09-26 | International Business Machines Corporation | Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization |
JPH01176078A (ja) * | 1987-12-29 | 1989-07-12 | Hitachi Chem Co Ltd | 無電解めっき用触媒活性測定法 |
US4948707A (en) * | 1988-02-16 | 1990-08-14 | International Business Machines Corporation | Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon |
JPH0816787B2 (ja) * | 1988-06-20 | 1996-02-21 | シャープ株式会社 | 電子写真用トナー |
JPH0230768A (ja) * | 1988-07-18 | 1990-02-01 | Hitachi Chem Co Ltd | 無電解めっき用前処理液 |
JPH0230769A (ja) * | 1988-07-18 | 1990-02-01 | Hitachi Chem Co Ltd | 無電解めっき用前処理液 |
JP2595319B2 (ja) * | 1988-07-20 | 1997-04-02 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
DE4020795C1 (de) * | 1990-06-28 | 1991-10-17 | Schering Ag Berlin-Bergkamen, 1000 Berlin, De | |
US5509557A (en) * | 1994-01-24 | 1996-04-23 | International Business Machines Corporation | Depositing a conductive metal onto a substrate |
EP0666341B1 (de) * | 1994-02-08 | 1997-08-06 | Sumitomo Metal Industries, Ltd. | Verfahren zur Herstellung eines plattierten Rohres |
-
1995
- 1995-10-03 KR KR1019960704700A patent/KR100235850B1/ko not_active IP Right Cessation
- 1995-10-03 JP JP52034996A patent/JP3392873B2/ja not_active Expired - Fee Related
- 1995-10-03 WO PCT/JP1995/002014 patent/WO1996020294A1/ja active IP Right Grant
- 1995-10-03 CN CN95191827A patent/CN1131894C/zh not_active Expired - Lifetime
- 1995-10-03 DE DE69520094T patent/DE69520094T2/de not_active Expired - Lifetime
- 1995-10-03 EP EP95932961A patent/EP0747507B1/de not_active Expired - Lifetime
- 1995-12-27 MY MYPI95004109A patent/MY126635A/en unknown
-
1997
- 1997-06-30 US US08/885,917 patent/US6146700A/en not_active Expired - Lifetime
-
1999
- 1999-09-09 US US09/392,783 patent/US6174353B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1142252A (zh) | 1997-02-05 |
JP3392873B2 (ja) | 2003-03-31 |
KR100235850B1 (ko) | 1999-12-15 |
US6174353B1 (en) | 2001-01-16 |
DE69520094T2 (de) | 2001-06-13 |
CN1131894C (zh) | 2003-12-24 |
EP0747507B1 (de) | 2001-02-14 |
US6146700A (en) | 2000-11-14 |
EP0747507A1 (de) | 1996-12-11 |
KR970701275A (ko) | 1997-03-17 |
MY126635A (en) | 2006-10-31 |
EP0747507A4 (de) | 1997-01-02 |
WO1996020294A1 (fr) | 1996-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69520094T2 (de) | Lösung zur vorbehandlung für elektronenloses beschichten, bad und verfahren | |
DE69720435D1 (de) | Beschichtungslösung für Zinn-Silber-Legierungen und Verfahren zur Beschichtung mit dieser Lösung | |
DE69941347D1 (de) | Verfahren zur Beschichtung von elastischen Fäden | |
DE59812032D1 (de) | Verfahren zur mehrschichtlackierung und überzugsmittel fur das verfahren | |
DE69530781D1 (de) | Verfahren zum beschichten von platinaluminid mit cvd | |
DE69731826D1 (de) | Verfahren zum beschichten von substraten | |
DE69701714D1 (de) | Verfahren zur behandlung von glassubstraten | |
DE69916859D1 (de) | Verfahren zur beschichtung von textilprodukten | |
DE69837619D1 (de) | Elektrodenstab für funkenbeschichtung, verfahren zu dessen herstellung und verfahren zur beschichtung mit supraschleif-enthaltender schicht | |
DE59608888D1 (de) | Verfahren und anlage zur beschichtung von werkstücken | |
DE3583512D1 (de) | Verfahren und ueberzugsmittel zur behandlung von metalloberflaechen. | |
DE59603235D1 (de) | Überzugsmittel, deren verwendung und verfahren zur herstellung von mehrschichtüberzügen | |
DE69624821D1 (de) | Verfahren und vorrichtung zum beschichten von petrischalen | |
DE59702088D1 (de) | Wässrige lösung und verfahren zur phosphatierung metallischer oberflächen | |
DE69505626T2 (de) | Verfahren zur selektiven Plattierung | |
DE59801033D1 (de) | Verfahren zum Beschichten von Elastomerkomponenten | |
DE69830324D1 (de) | Trennbeschichtung für klebeartikel und verfahren | |
ATE264066T1 (de) | Verfahren zur herstellung und vorrichtung für beschichtung von artikeln | |
DE69605561D1 (de) | Verfahren zur beschichtung | |
DE59510000D1 (de) | Reaktor und verfahren zum beschichten von flächigen substraten | |
DE59708316D1 (de) | Verfahren zur beschichtung von metallbändern | |
DE59710600D1 (de) | Verfahren zur Lackierung von Substraten | |
DE69731855D1 (de) | Verfahren und Vorrichtung zur Tauchbeschichtung | |
ATA68497A (de) | Verfahren zur nachbehandlung von gebeiztem stahlband | |
DE69824357D1 (de) | Verfahren und Vorrichtung zur Herstellung und Beschichtung von Flaschen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |