DE69511635T2 - Eine Walze - Google Patents

Eine Walze

Info

Publication number
DE69511635T2
DE69511635T2 DE69511635T DE69511635T DE69511635T2 DE 69511635 T2 DE69511635 T2 DE 69511635T2 DE 69511635 T DE69511635 T DE 69511635T DE 69511635 T DE69511635 T DE 69511635T DE 69511635 T2 DE69511635 T2 DE 69511635T2
Authority
DE
Germany
Prior art keywords
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69511635T
Other languages
English (en)
Other versions
DE69511635D1 (de
Inventor
Etsuo Kiuchi
Kazuo Hayakawa
Kouhei Toyoma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69511635D1 publication Critical patent/DE69511635D1/de
Application granted granted Critical
Publication of DE69511635T2 publication Critical patent/DE69511635T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/283With means to control or modify temperature of apparatus or work
    • Y10T83/293Of tool
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/929Tool or tool with support
    • Y10T83/9292Wire tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69511635T 1994-06-28 1995-06-20 Eine Walze Expired - Fee Related DE69511635T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6168794A JP2755907B2 (ja) 1994-06-28 1994-06-28 ワイヤソー用溝ローラ

Publications (2)

Publication Number Publication Date
DE69511635D1 DE69511635D1 (de) 1999-09-30
DE69511635T2 true DE69511635T2 (de) 2000-03-16

Family

ID=15874602

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69511635T Expired - Fee Related DE69511635T2 (de) 1994-06-28 1995-06-20 Eine Walze

Country Status (5)

Country Link
US (1) US5575189A (de)
EP (1) EP0689891B1 (de)
JP (1) JP2755907B2 (de)
DE (1) DE69511635T2 (de)
MY (1) MY113788A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013225104A1 (de) 2013-12-06 2015-07-02 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69631353T2 (de) * 1995-04-22 2004-12-09 Hct Shaping Systems Sa Verfahren zur Orientierung von Einkristallen zum Schneiden in eine Schneidemaschine und Einrichtung zur Durchführung des Verfahrens
JP2885270B2 (ja) * 1995-06-01 1999-04-19 信越半導体株式会社 ワイヤーソー装置及びワークの切断方法
CH691037A5 (fr) * 1996-02-06 2001-04-12 Hct Shaping Systems Sa Dispositif de sciage par fil.
CH691036A5 (fr) * 1996-02-06 2001-04-12 Hct Shaping Systems Sa Dispositif de sciage par fil pour la découpe de tranches fines comprenant un mécanisme pour le taillage in situ des gorges des cylindres guide-fils.
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
JP3273163B2 (ja) * 1996-09-06 2002-04-08 シャープ株式会社 マルチワイヤソー
DE19717379A1 (de) * 1997-04-24 1998-10-29 Wacker Siltronic Halbleitermat Drahtsäge und Montagestation für eine Drahtführungsrolle einer Drahtsäge sowie Verfahren zum Auswechseln einer Drahtführungsrolle
TW383249B (en) 1998-09-01 2000-03-01 Sumitomo Spec Metals Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board
EP1004383A1 (de) * 1998-11-25 2000-05-31 Meyer & Burger AG Drahtführungsrolle für Drahtsäge mit Temperiereinrichtung
MY126994A (en) 1999-12-14 2006-11-30 Hitachi Metals Ltd Method and apparatus for cutting a rare earth alloy
US6357433B1 (en) * 2000-06-01 2002-03-19 Motorola, Inc. Machine for cutting brittle materials
US6352071B1 (en) * 2000-06-20 2002-03-05 Seh America, Inc. Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw
US20030170948A1 (en) * 2002-03-07 2003-09-11 Memc Electronic Materials, Inc. Method and apparatus for slicing semiconductor wafers
CN101970193A (zh) * 2008-02-11 2011-02-09 Memc电子材料有限公司 用于将锭线锯切片成晶片中的碳纳米管加强线锯梁
CN102744794A (zh) * 2011-04-01 2012-10-24 江苏省惠山中等专业学校 一种双片独立式的导线轮
DE102011083175A1 (de) * 2011-09-22 2013-03-28 Voith Patent Gmbh Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem
DE102018221922A1 (de) * 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
CN113369582B (zh) * 2021-06-28 2022-12-02 中国有色桂林矿产地质研究院有限公司 一种环形金刚石绳锯的制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826880A (en) * 1957-04-10 1958-03-18 Lyon Inc Buffing cooling mechanism
US4134384A (en) * 1977-09-16 1979-01-16 Motorola, Inc. Wire saw with rotatable guide sleeve
JPH0616985B2 (ja) * 1986-04-24 1994-03-09 住友金属工業株式会社 ワイヤソ−における切断方法
JP2516717B2 (ja) * 1991-11-29 1996-07-24 信越半導体株式会社 ワイヤソ―及びその切断方法
JP2731309B2 (ja) * 1991-12-10 1998-03-25 信越半導体株式会社 ワイヤソー、及び、そのローラ軸支装置の温度制御方法
CH687301A5 (fr) * 1992-01-22 1996-11-15 W S Technologies Ltd Dispositif de sciage par fil.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013225104A1 (de) 2013-12-06 2015-07-02 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge
US9662804B2 (en) 2013-12-06 2017-05-30 Siltronic Ag Method for slicing wafers from a workpiece by means of a wire saw
DE102013225104B4 (de) * 2013-12-06 2019-11-28 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge

Also Published As

Publication number Publication date
JPH0811048A (ja) 1996-01-16
DE69511635D1 (de) 1999-09-30
US5575189A (en) 1996-11-19
EP0689891A1 (de) 1996-01-03
MY113788A (en) 2002-05-31
JP2755907B2 (ja) 1998-05-25
EP0689891B1 (de) 1999-08-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee