DE69503227T2 - Thermistor - Google Patents
ThermistorInfo
- Publication number
- DE69503227T2 DE69503227T2 DE69503227T DE69503227T DE69503227T2 DE 69503227 T2 DE69503227 T2 DE 69503227T2 DE 69503227 T DE69503227 T DE 69503227T DE 69503227 T DE69503227 T DE 69503227T DE 69503227 T2 DE69503227 T2 DE 69503227T2
- Authority
- DE
- Germany
- Prior art keywords
- component
- pct
- spaced
- face
- sec
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9403913A GB9403913D0 (en) | 1994-03-01 | 1994-03-01 | Thermistor |
GB9405863A GB9405863D0 (en) | 1994-03-01 | 1994-03-24 | Thermistor |
GB9421454A GB9421454D0 (en) | 1994-03-24 | 1994-10-25 | Thermistor |
PCT/GB1995/000427 WO1995024045A1 (en) | 1994-03-01 | 1995-02-28 | Thermistor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69503227D1 DE69503227D1 (en) | 1998-08-06 |
DE69503227T2 true DE69503227T2 (de) | 1999-03-25 |
Family
ID=27267073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69503227T Expired - Fee Related DE69503227T2 (de) | 1994-03-01 | 1995-02-28 | Thermistor |
Country Status (7)
Country | Link |
---|---|
US (1) | US5726623A (de) |
EP (1) | EP0748511B1 (de) |
AT (1) | ATE167952T1 (de) |
AU (1) | AU1817795A (de) |
DE (1) | DE69503227T2 (de) |
ES (1) | ES2120731T3 (de) |
WO (1) | WO1995024045A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5675307A (en) * | 1995-08-29 | 1997-10-07 | Therm-O-Disc, Incorporated | PTC device with extended thickness |
JP3297269B2 (ja) * | 1995-11-20 | 2002-07-02 | 株式会社村田製作所 | 正特性サーミスタの実装構造 |
JP2002507329A (ja) * | 1997-07-01 | 2002-03-05 | シーメンス アクチエンゲゼルシヤフト | 過負荷保護回路機能付きハイブリッド回路装置 |
DE60042187D1 (de) | 1999-06-09 | 2009-06-25 | Toshiba Kawasaki Kk | Bond-typ Halbleitersubstrat, lichtemittierendes Halbleiterbauelement und Herstellungsverfahren |
JP3589174B2 (ja) | 2000-10-24 | 2004-11-17 | 株式会社村田製作所 | 表面実装型正特性サーミスタおよびその実装方法 |
JP2002305101A (ja) * | 2001-04-05 | 2002-10-18 | Murata Mfg Co Ltd | 表面実装型正特性サーミスタおよびその製造方法 |
NL1018807C2 (nl) * | 2001-08-23 | 2003-02-25 | Bc Components Holding B V | PTC-weerstand in SMD-uitvoering. |
TWI353699B (en) * | 2003-05-02 | 2011-12-01 | Tyco Electronics Corp | Circuit protection device and assembly thereof |
US8289122B2 (en) | 2009-03-24 | 2012-10-16 | Tyco Electronics Corporation | Reflowable thermal fuse |
US8581686B2 (en) * | 2009-03-24 | 2013-11-12 | Tyco Electronics Corporation | Electrically activated surface mount thermal fuse |
US8854784B2 (en) | 2010-10-29 | 2014-10-07 | Tyco Electronics Corporation | Integrated FET and reflowable thermal fuse switch device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3638342A1 (de) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung |
JPH05234706A (ja) * | 1992-02-25 | 1993-09-10 | Rohm Co Ltd | 面実装用サーミスタ |
JP3238803B2 (ja) * | 1993-08-24 | 2001-12-17 | ローム株式会社 | 面実装型有極性電子部品の基板実装構造 |
-
1995
- 1995-02-28 US US08/704,496 patent/US5726623A/en not_active Expired - Fee Related
- 1995-02-28 AT AT95909873T patent/ATE167952T1/de not_active IP Right Cessation
- 1995-02-28 AU AU18177/95A patent/AU1817795A/en not_active Abandoned
- 1995-02-28 EP EP95909873A patent/EP0748511B1/de not_active Expired - Lifetime
- 1995-02-28 WO PCT/GB1995/000427 patent/WO1995024045A1/en active IP Right Grant
- 1995-02-28 DE DE69503227T patent/DE69503227T2/de not_active Expired - Fee Related
- 1995-02-28 ES ES95909873T patent/ES2120731T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU1817795A (en) | 1995-09-18 |
ES2120731T3 (es) | 1998-11-01 |
EP0748511A1 (de) | 1996-12-18 |
ATE167952T1 (de) | 1998-07-15 |
DE69503227D1 (en) | 1998-08-06 |
US5726623A (en) | 1998-03-10 |
WO1995024045A1 (en) | 1995-09-08 |
EP0748511B1 (de) | 1998-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |