DE69421772D1 - Verfahren zum Bohren eines Durchgangslochs in einem laminaren Substrat und in diesem Verfahren verwendete Folie - Google Patents

Verfahren zum Bohren eines Durchgangslochs in einem laminaren Substrat und in diesem Verfahren verwendete Folie

Info

Publication number
DE69421772D1
DE69421772D1 DE69421772T DE69421772T DE69421772D1 DE 69421772 D1 DE69421772 D1 DE 69421772D1 DE 69421772 T DE69421772 T DE 69421772T DE 69421772 T DE69421772 T DE 69421772T DE 69421772 D1 DE69421772 D1 DE 69421772D1
Authority
DE
Germany
Prior art keywords
drilling
hole
film used
laminar substrate
laminar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69421772T
Other languages
English (en)
Other versions
DE69421772T2 (de
Inventor
Takuji Nakano
Takeshi Fujita
Katsuaki Matsuo
Chuzo Isoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DKS Co Ltd
Original Assignee
Dai Ichi Kogyo Seiyaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Kogyo Seiyaku Co Ltd filed Critical Dai Ichi Kogyo Seiyaku Co Ltd
Application granted granted Critical
Publication of DE69421772D1 publication Critical patent/DE69421772D1/de
Publication of DE69421772T2 publication Critical patent/DE69421772T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69421772T 1993-08-05 1994-08-05 Verfahren zum Bohren eines Durchgangslochs in einem laminaren Substrat und in diesem Verfahren verwendete Folie Expired - Lifetime DE69421772T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19472593 1993-08-05

Publications (2)

Publication Number Publication Date
DE69421772D1 true DE69421772D1 (de) 1999-12-30
DE69421772T2 DE69421772T2 (de) 2000-05-18

Family

ID=16329208

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69421772T Expired - Lifetime DE69421772T2 (de) 1993-08-05 1994-08-05 Verfahren zum Bohren eines Durchgangslochs in einem laminaren Substrat und in diesem Verfahren verwendete Folie

Country Status (3)

Country Link
US (1) US5507603A (de)
EP (1) EP0642297B1 (de)
DE (1) DE69421772T2 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961255A (en) * 1996-07-30 1999-10-05 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5785465A (en) * 1996-07-30 1998-07-28 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6593255B1 (en) 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6200074B1 (en) * 1999-04-07 2001-03-13 James J. Miller Method for drilling circuit boards
SG115399A1 (en) * 2000-09-04 2005-10-28 Mitsubishi Gas Chemical Co Lubricant sheet for making hole and method of making hole with drill
TW521029B (en) * 2000-09-14 2003-02-21 Ohtomo Chemical Ins Corp An entry board for use in drilling small holes
US6669805B2 (en) * 2001-02-16 2003-12-30 International Business Machines Corporation Drill stack formation
US6866450B2 (en) * 2001-10-31 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling hole
US20030129030A1 (en) * 2002-01-04 2003-07-10 Jja, Inc. Lubricant sheet and method of forming the same
US8062746B2 (en) * 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
US20040000318A1 (en) * 2003-05-09 2004-01-01 Mcnamara Helen Hair coloring tool
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
US20060062996A1 (en) * 2004-09-22 2006-03-23 Yun-Chao Yeh Resin matrix composite with aluminum for lubrication in drilling
US7354641B2 (en) * 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
CN101878678A (zh) 2007-09-28 2010-11-03 三星层板有限公司 用于在印刷电路板中钻孔的改进***和方法
RU2673474C1 (ru) * 2015-08-06 2018-11-27 Мицубиси Гэс Кемикал Компани, Инк. Смазочный материал для облегчения процесса механообработки и способ механообработки
JP6315226B2 (ja) 2015-09-02 2018-04-25 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
EP3342517B1 (de) * 2015-11-26 2020-08-19 Mitsubishi Gas Chemical Company, Inc. Verfahren zum schneiden von faserverstärktem verbundstoffelement
BR112018007991A2 (pt) 2016-02-17 2018-10-30 Mitsubishi Gas Chemical Company, Inc. método de trabalho de corte e método para produzir um produto cortado
JP7029113B2 (ja) 2016-11-14 2022-03-03 三菱瓦斯化学株式会社 構成刃先形成用部材及び構成刃先形成方法
EP3633014A4 (de) 2017-05-25 2020-06-10 Mitsubishi Gas Chemical Company, Inc. Schneidarbeitsunterstützendes schmiermaterial, schneidarbeitsunterstützende schmierblatt und schneidverfahren
EP3858541A4 (de) 2018-09-26 2022-06-15 Dalian University Of Technology Verfahren zur automatischen locherzeugung mit selbstanpassender einstellung des bearbeitungsparameters
CN109226801B (zh) * 2018-09-26 2019-10-29 大连理工大学 一种叠层结构制孔时叠层界面的自动识别方法
JP2021141251A (ja) 2020-03-06 2021-09-16 キオクシア株式会社 電子部品の切削方法、部品の除去方法及び電子機器の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781495A (en) * 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards
US4929370A (en) * 1986-10-14 1990-05-29 Lubra Sheet Corporation Dry lubricant drilling of thru-holes in printed circuit boards
US4954200A (en) * 1987-11-10 1990-09-04 The General Electric Company Method of making drill back-up material for small bore drilling of circuit boards
JP2855818B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2855821B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2855823B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2855820B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2855819B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2855824B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2855822B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
GB9102672D0 (en) * 1991-02-07 1991-03-27 Holders Technology Plc Drilling printed circuit boards and dummy boards therefor

Also Published As

Publication number Publication date
EP0642297A1 (de) 1995-03-08
US5507603A (en) 1996-04-16
DE69421772T2 (de) 2000-05-18
EP0642297B1 (de) 1999-11-24

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Legal Events

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