DE69300548D1 - Verbesserungen an und hinsichtlich des Aufbringens von Beschichtungen. - Google Patents
Verbesserungen an und hinsichtlich des Aufbringens von Beschichtungen.Info
- Publication number
- DE69300548D1 DE69300548D1 DE69300548T DE69300548T DE69300548D1 DE 69300548 D1 DE69300548 D1 DE 69300548D1 DE 69300548 T DE69300548 T DE 69300548T DE 69300548 T DE69300548 T DE 69300548T DE 69300548 D1 DE69300548 D1 DE 69300548D1
- Authority
- DE
- Germany
- Prior art keywords
- coatings
- regard
- application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
- B05B7/0807—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets
- B05B7/0861—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets with one single jet constituted by a liquid or a mixture containing a liquid and several gas jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
- B05D1/265—Extrusion coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/042—Directing or stopping the fluid to be coated with air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US91078292A | 1992-07-08 | 1992-07-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69300548D1 true DE69300548D1 (de) | 1995-11-02 |
DE69300548T2 DE69300548T2 (de) | 1996-03-21 |
Family
ID=25429317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69300548T Expired - Fee Related DE69300548T2 (de) | 1992-07-08 | 1993-07-05 | Verbesserungen an und hinsichtlich des Aufbringens von Beschichtungen. |
Country Status (5)
Country | Link |
---|---|
US (2) | US5409733A (de) |
EP (1) | EP0578469B1 (de) |
JP (1) | JP3614446B2 (de) |
CA (1) | CA2098784A1 (de) |
DE (1) | DE69300548T2 (de) |
Families Citing this family (74)
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---|---|---|---|---|
US5733597A (en) * | 1992-07-08 | 1998-03-31 | Nordson Corporation | Snuff back controlled coating dispensing apparatus and methods |
EP0761317B1 (de) * | 1994-12-28 | 2002-07-10 | Toray Industries, Inc. | Beschichtungsverfahren und -vorrichtung |
US5647908A (en) * | 1995-02-15 | 1997-07-15 | Foseco International Limited | Applicator for surface treatment agent for continuous casting process |
US7078075B1 (en) | 1995-02-23 | 2006-07-18 | H.B. Fuller Licensing & Financing Inc. | Method for producing a continuous thermoplastic coating and articles constructed therefrom |
JPH08309250A (ja) * | 1995-03-13 | 1996-11-26 | Fujitsu Ltd | 塗布剤の両面塗布方法及び両面塗布装置並びに両面乾燥方法及び両面乾燥装置 |
JP3834737B2 (ja) * | 1995-05-18 | 2006-10-18 | ノードソン株式会社 | 液体又は加熱溶融体のスプレイ方法 |
DE19530516A1 (de) * | 1995-08-19 | 1997-02-20 | Hoechst Ag | Vorrichtung zum Auftragen einer Beschichtungslösung |
US6159546A (en) * | 1996-02-28 | 2000-12-12 | Nippon Shokubai Co., Ltd. | Process of continuously coating an organometallic coating composition on a running substrate |
US5904298A (en) * | 1996-10-08 | 1999-05-18 | Illinois Tool Works Inc. | Meltblowing method and system |
US5902540A (en) | 1996-10-08 | 1999-05-11 | Illinois Tool Works Inc. | Meltblowing method and apparatus |
US6680021B1 (en) | 1996-07-16 | 2004-01-20 | Illinois Toolworks Inc. | Meltblowing method and system |
US5800614A (en) * | 1996-09-24 | 1998-09-01 | Foust; Paul William | Adhesive applier for screen printing machine |
US5740963A (en) * | 1997-01-07 | 1998-04-21 | Nordson Corporation | Self-sealing slot nozzle die |
US6132809A (en) * | 1997-01-16 | 2000-10-17 | Precision Valve & Automation, Inc. | Conformal coating using multiple applications |
US5882573A (en) * | 1997-09-29 | 1999-03-16 | Illinois Tool Works Inc. | Adhesive dispensing nozzles for producing partial spray patterns and method therefor |
DE19753266B4 (de) | 1997-12-01 | 2010-10-07 | H.B. Fuller Licensing & Financing, Inc., St. Paul | Verfahren zum Verbinden luftundurchlässiger Materialien |
US6127038A (en) * | 1997-12-11 | 2000-10-03 | American Meter Company | Printed circuit board coating and method |
GB9801132D0 (en) | 1998-01-21 | 1998-03-18 | Cadbury Schweppes Plc | Method and apparatus of coating articles |
US6051180A (en) * | 1998-08-13 | 2000-04-18 | Illinois Tool Works Inc. | Extruding nozzle for producing non-wovens and method therefor |
US6200635B1 (en) | 1998-08-31 | 2001-03-13 | Illinois Tool Works Inc. | Omega spray pattern and method therefor |
US6068202A (en) * | 1998-09-10 | 2000-05-30 | Precision Valve & Automotion, Inc. | Spraying and dispensing apparatus |
EP1154890A1 (de) * | 1999-02-26 | 2001-11-21 | The Procter & Gamble Company | Vorrichtung zum extrudieren einer kontinuierlichen schicht |
US6244522B1 (en) | 1999-05-10 | 2001-06-12 | Nordson Corporation | Nozzle assembly for dispensing head |
US6395088B1 (en) | 1999-06-30 | 2002-05-28 | Gaston Systems, Inc. | Apparatus for applying foamed coating material to a traveling textile substrate |
US6457655B1 (en) | 1999-09-03 | 2002-10-01 | Nordson Corporation | Method and apparatus for measuring and adjusting a liquid spray pattern |
US6602554B1 (en) | 2000-01-14 | 2003-08-05 | Illinois Tool Works Inc. | Liquid atomization method and system |
US6706315B2 (en) * | 2001-09-17 | 2004-03-16 | Xerox Corporation | Coating process for coating die with laser position sensors |
US6814806B2 (en) | 2002-07-25 | 2004-11-09 | Gaston Systems Inc. | Controlled flow applicator |
CN1671291A (zh) * | 2002-08-06 | 2005-09-21 | 帝斯曼知识产权资产管理有限公司 | 用多烯抗真菌组合物覆盖食物的方法 |
JP2004148167A (ja) * | 2002-10-29 | 2004-05-27 | Nordson Corp | 粘性流体材料の塗布方法及び装置 |
JP2004154665A (ja) * | 2002-11-06 | 2004-06-03 | Suntool Corp | ホットメルト接着剤スプレー塗布方法およびホットメルト接着剤スプレー塗布装置の塗布ノズル装置 |
DE10261576B4 (de) * | 2002-12-23 | 2013-01-31 | Wolfgang Klingel | Vorrichtung zum Beschichten einer Leiterplatte |
US7083826B2 (en) * | 2003-05-16 | 2006-08-01 | 3M Innovative Properties Company | Coating die and method for use |
US20050158470A1 (en) * | 2003-11-11 | 2005-07-21 | Nicholas Maiorino | Spray head applicator, dispensing systems, and methods of use |
US20050120947A1 (en) * | 2003-12-09 | 2005-06-09 | Konica Minolta Photo Imaging, Inc. | Coating apparatus and coating method |
JP2005262011A (ja) * | 2004-03-16 | 2005-09-29 | Sunstar Eng Inc | 高粘度材料の塗布装置 |
US7431771B2 (en) * | 2004-11-12 | 2008-10-07 | Gaston Systems, Inc. | Apparatus and method for applying a foamed composition to a dimensionally unstable traveling substrate |
JP4641837B2 (ja) | 2005-03-17 | 2011-03-02 | 株式会社リコー | 樹脂吐出ノズル及び樹脂封止方法 |
US20060257785A1 (en) * | 2005-05-13 | 2006-11-16 | Johnson Donald W | Method of forming a photoresist element |
JP4730771B2 (ja) * | 2005-08-23 | 2011-07-20 | 東京応化工業株式会社 | 処理液供給ノズル及び基板処理装置 |
EP1925369A4 (de) * | 2005-09-13 | 2014-01-15 | Sunstar Engineering Inc | Auftragsvorrichtung zur beschichtung mit hochviskosem material |
US20070125886A1 (en) * | 2005-12-01 | 2007-06-07 | 3M Innovative Properties Company | Methods of spraying multi-component liquids |
JP2009517213A (ja) * | 2005-12-01 | 2009-04-30 | スリーエム イノベイティブ プロパティズ カンパニー | 多成分液体噴霧システム |
WO2007106390A2 (en) | 2006-03-10 | 2007-09-20 | Amesbury Group, Inc | Apparatus and method for manufacturing reinforced weatherstrip, and such a weatherstrip |
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US7798434B2 (en) * | 2006-12-13 | 2010-09-21 | Nordson Corporation | Multi-plate nozzle and method for dispensing random pattern of adhesive filaments |
EP2168082B1 (de) * | 2007-06-26 | 2013-02-27 | NagraID SA | Verfahren zur herstellung von mindestens eine elektronische einheit enthaltenden leiterplatten |
US8074902B2 (en) * | 2008-04-14 | 2011-12-13 | Nordson Corporation | Nozzle and method for dispensing random pattern of adhesive filaments |
US20110092076A1 (en) * | 2008-05-19 | 2011-04-21 | E.I. Du Pont De Nemours And Company | Apparatus and method of vapor coating in an electronic device |
CN102170976A (zh) * | 2008-09-02 | 2011-08-31 | 恩斯克里普特公司 | 高速分配包括线和点的图案 |
US8182880B2 (en) | 2009-01-28 | 2012-05-22 | Honeywell International Inc. | Methods of manufacturing flexible insulated wires |
DE102009017453A1 (de) * | 2009-04-07 | 2010-11-11 | Hüttlin, Herbert, Dr. h.c. | Spaltdüse zum Versprühen einer Flüssigkeit |
DE102009023403A1 (de) * | 2009-05-29 | 2010-12-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur strukturierten Beschichtung von Substraten |
TW201127498A (en) * | 2010-02-08 | 2011-08-16 | Hon Hai Prec Ind Co Ltd | Nozzle apparatus and coater system |
KR101199099B1 (ko) | 2010-08-03 | 2012-11-08 | 삼성에스디아이 주식회사 | 코팅장치의 진공챔버 시스템 및 이를 이용한 코팅방법 |
JP5702223B2 (ja) * | 2011-05-16 | 2015-04-15 | 武蔵エンジニアリング株式会社 | 膜状塗布ノズル、塗布装置および塗布方法 |
US10371468B2 (en) | 2011-11-30 | 2019-08-06 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US9120190B2 (en) | 2011-11-30 | 2015-09-01 | Palo Alto Research Center Incorporated | Co-extruded microchannel heat pipes |
US8875653B2 (en) * | 2012-02-10 | 2014-11-04 | Palo Alto Research Center Incorporated | Micro-extrusion printhead with offset orifices for generating gridlines on non-square substrates |
KR101949332B1 (ko) * | 2012-04-20 | 2019-02-19 | 주식회사 탑 엔지니어링 | 수지도포장치의 노즐 |
US10422614B2 (en) * | 2012-09-14 | 2019-09-24 | Henkel IP & Holding GmbH | Dispenser for applying an adhesive to a remote surface |
GB201300483D0 (en) | 2013-01-11 | 2013-02-27 | Zephyros Inc | Extrusion of bands of material |
WO2014178818A1 (en) * | 2013-04-29 | 2014-11-06 | Hewlett-Packard Development Company, L.P. | Selective slot coating |
KR102131118B1 (ko) * | 2013-07-04 | 2020-07-08 | 삼성디스플레이 주식회사 | 반도체 패턴 형성용 마스크, 이를 포함하는 반도체 패턴 형성장치, 이를 이용한 반도체 소자의 제조방법 |
JP6412374B2 (ja) * | 2014-09-05 | 2018-10-24 | ノードソン コーポレーションNordson Corporation | 塗布ノズル組立体およびシム板 |
WO2016106325A1 (en) * | 2014-12-22 | 2016-06-30 | Sikorsky Aircraft Corporation | Liquid shim adhesive injection tool |
WO2016130976A1 (en) | 2015-02-13 | 2016-08-18 | Peter Mertinooke | Low compression-force tpe weatherseals |
US10595417B2 (en) * | 2016-07-18 | 2020-03-17 | Verily Life Sciences Llc | Method of manufacturing flexible electronic circuits having conformal material coatings |
CN106076689B (zh) * | 2016-08-15 | 2022-05-13 | 天来节能科技(上海)有限公司 | 一种具有通断功能的智能雾化器 |
US11179744B2 (en) | 2018-11-13 | 2021-11-23 | Gaston Systems, Inc. | Segmented distribution assembly for distributing fluid to an applicator nozzle |
JP2021154195A (ja) * | 2020-03-26 | 2021-10-07 | ノードソン コーポレーションNordson Corporation | ノズル、接着剤塗布ヘッド、接着剤塗布装置及びおむつ製造方法 |
US11583887B2 (en) * | 2021-04-30 | 2023-02-21 | Nordson Corporation | Slot nozzle for adhesive applicators |
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CN115279048B (zh) * | 2022-09-26 | 2022-12-16 | 四川英创力电子科技股份有限公司 | 一种电路板烘烤自动输送装置 |
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-
1993
- 1993-06-18 CA CA002098784A patent/CA2098784A1/en not_active Abandoned
- 1993-07-05 DE DE69300548T patent/DE69300548T2/de not_active Expired - Fee Related
- 1993-07-05 EP EP93305269A patent/EP0578469B1/de not_active Expired - Lifetime
- 1993-07-08 JP JP16918793A patent/JP3614446B2/ja not_active Expired - Fee Related
-
1994
- 1994-06-15 US US08/259,818 patent/US5409733A/en not_active Expired - Lifetime
-
1995
- 1995-02-13 US US08/388,138 patent/US5720820A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0578469A3 (en) | 1994-06-22 |
US5720820A (en) | 1998-02-24 |
CA2098784A1 (en) | 1994-01-09 |
JP3614446B2 (ja) | 2005-01-26 |
EP0578469B1 (de) | 1995-09-27 |
EP0578469A2 (de) | 1994-01-12 |
US5409733A (en) | 1995-04-25 |
JPH06154691A (ja) | 1994-06-03 |
DE69300548T2 (de) | 1996-03-21 |
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