DE69230660D1 - Kabelbaum - Google Patents

Kabelbaum

Info

Publication number
DE69230660D1
DE69230660D1 DE69230660T DE69230660T DE69230660D1 DE 69230660 D1 DE69230660 D1 DE 69230660D1 DE 69230660 T DE69230660 T DE 69230660T DE 69230660 T DE69230660 T DE 69230660T DE 69230660 D1 DE69230660 D1 DE 69230660D1
Authority
DE
Germany
Prior art keywords
wiring harness
harness
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69230660T
Other languages
English (en)
Other versions
DE69230660T2 (de
Inventor
Kazuhito Saka
Masayoshi Hashimoto
Kou Furuta
Takahiro Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3309814A external-priority patent/JP2624063B2/ja
Priority claimed from JP2796692U external-priority patent/JPH0581911U/ja
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of DE69230660D1 publication Critical patent/DE69230660D1/de
Application granted granted Critical
Publication of DE69230660T2 publication Critical patent/DE69230660T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/052—Branched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Conductors (AREA)
  • Multi-Conductor Connections (AREA)
DE69230660T 1991-10-29 1992-10-28 Kabelbaum Expired - Fee Related DE69230660T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3309814A JP2624063B2 (ja) 1991-10-29 1991-10-29 ワイヤハーネス
JP2796692U JPH0581911U (ja) 1992-03-31 1992-03-31 フレキシブルケーブル

Publications (2)

Publication Number Publication Date
DE69230660D1 true DE69230660D1 (de) 2000-03-16
DE69230660T2 DE69230660T2 (de) 2000-12-07

Family

ID=26365972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69230660T Expired - Fee Related DE69230660T2 (de) 1991-10-29 1992-10-28 Kabelbaum

Country Status (3)

Country Link
US (1) US5598627A (de)
EP (1) EP0540319B1 (de)
DE (1) DE69230660T2 (de)

Families Citing this family (80)

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US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
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DE19718920C5 (de) * 1997-04-25 2007-01-11 Yazaki Wiring Technologies Gmbh Leitungssatz für ein Kraftfahrzeug
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US6071446A (en) * 1997-08-29 2000-06-06 Lear Automotive Dearborn, Inc Method for centering wire harness in mold
US6086037A (en) * 1997-08-29 2000-07-11 Lear Automotive Dearborn, Inc Mold for assembling and forming wire harness
US6027679A (en) * 1997-08-29 2000-02-22 Lear Automotive Dearborn, Inc. Method for securing a wire harness to a surface
US5973265A (en) * 1997-08-29 1999-10-26 Lear Automotive Dearborn, Inc. Wire harness with splice locators
US6126228A (en) * 1997-09-11 2000-10-03 Lear Automotive Dearborn, Inc. Wire harness foamed to trim panel
US6048222A (en) * 1997-12-10 2000-04-11 Micron Electronics, Inc. Retentive ribbon cable connector
US6011318A (en) * 1998-04-16 2000-01-04 Lear Automotive Dearborn, Inc. Wire harness for vehicle seat
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US6392148B1 (en) * 1999-05-10 2002-05-21 Furukawa Electric Co., Ltd. Wire harness joint
DE10080343B3 (de) * 1999-01-18 2014-08-28 The Furukawa Electric Co., Ltd. Elektrische Installation für eine Sitzeinrichtung
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CN108092015B (zh) 2013-11-26 2020-03-06 申泰公司 缆线、缆线组件以及将缆线连接到基板的方法
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JP6323250B2 (ja) * 2014-08-15 2018-05-16 富士通株式会社 電子機器及び電子機器の製造方法
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KR102120813B1 (ko) 2015-01-11 2020-06-17 몰렉스 엘엘씨 회로 기판 바이패스 조립체 및 그를 위한 구성요소
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CN108713355B (zh) 2016-01-11 2020-06-05 莫列斯有限公司 路由组件及使用路由组件的***
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CN109565137A (zh) 2016-05-31 2019-04-02 安费诺有限公司 高性能线缆终端装置
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TWI797094B (zh) 2016-10-19 2023-04-01 美商安芬諾股份有限公司 用於非常高速、高密度電性互連的順應性屏蔽件
JP6940277B2 (ja) * 2016-12-26 2021-09-22 矢崎総業株式会社 回路体の製造方法、及び、回路体の製造装置
CN115275663A (zh) 2017-08-03 2022-11-01 安费诺有限公司 用于低损耗互连***的连接器以及电子器件***
HUE055329T2 (hu) * 2018-01-25 2021-11-29 Nexans Kábelköteg összekötõ moduláris kábelköteghez
US10665973B2 (en) 2018-03-22 2020-05-26 Amphenol Corporation High density electrical connector
CN115632285A (zh) 2018-04-02 2023-01-20 安达概念股份有限公司 受控阻抗线缆连接器以及与其耦接的装置
US10903594B2 (en) * 2018-10-01 2021-01-26 Te Connectivity Corporation Board-to-board connector assembly for add-in cards
US10931062B2 (en) 2018-11-21 2021-02-23 Amphenol Corporation High-frequency electrical connector
WO2020154526A1 (en) 2019-01-25 2020-07-30 Fci Usa Llc I/o connector configured for cabled connection to the midboard
CN117175239A (zh) 2019-01-25 2023-12-05 富加宜（美国）有限责任公司 插座连接器和电连接器
US11437762B2 (en) 2019-02-22 2022-09-06 Amphenol Corporation High performance cable connector assembly
US11302614B2 (en) * 2019-08-23 2022-04-12 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Chip on film and display device
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CN115428275A (zh) 2020-01-27 2022-12-02 富加宜（美国）有限责任公司 高速连接器
US11469554B2 (en) 2020-01-27 2022-10-11 Fci Usa Llc High speed, high density direct mate orthogonal connector
CN113258325A (zh) 2020-01-28 2021-08-13 富加宜（美国）有限责任公司 高频中板连接器
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Also Published As

Publication number Publication date
EP0540319A3 (en) 1994-09-21
EP0540319B1 (de) 2000-02-09
US5598627A (en) 1997-02-04
EP0540319A2 (de) 1993-05-05
DE69230660T2 (de) 2000-12-07

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