DE69228374T2 - Herstellungsverfahren für ein Substrat vom Filmträgertyp - Google Patents
Herstellungsverfahren für ein Substrat vom FilmträgertypInfo
- Publication number
- DE69228374T2 DE69228374T2 DE69228374T DE69228374T DE69228374T2 DE 69228374 T2 DE69228374 T2 DE 69228374T2 DE 69228374 T DE69228374 T DE 69228374T DE 69228374 T DE69228374 T DE 69228374T DE 69228374 T2 DE69228374 T2 DE 69228374T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- type substrate
- film carrier
- carrier type
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2063—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 mixed adhesion layer containing metallic/inorganic and polymeric materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8575792A JPH05287500A (ja) | 1992-04-07 | 1992-04-07 | フィルムキャリア形基板の製造方法 |
JP8575992A JPH05287501A (ja) | 1992-04-07 | 1992-04-07 | フィルムキャリア形基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69228374D1 DE69228374D1 (de) | 1999-03-18 |
DE69228374T2 true DE69228374T2 (de) | 1999-06-17 |
Family
ID=26426761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69228374T Expired - Fee Related DE69228374T2 (de) | 1992-04-07 | 1992-06-05 | Herstellungsverfahren für ein Substrat vom Filmträgertyp |
Country Status (3)
Country | Link |
---|---|
US (1) | US5496772A (de) |
EP (1) | EP0564693B1 (de) |
DE (1) | DE69228374T2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5593852A (en) | 1993-12-02 | 1997-01-14 | Heller; Adam | Subcutaneous glucose electrode |
US6281035B1 (en) * | 1997-09-25 | 2001-08-28 | Midwest Research Institute | Ion-beam treatment to prepare surfaces of p-CdTe films |
US6103033A (en) * | 1998-03-04 | 2000-08-15 | Therasense, Inc. | Process for producing an electrochemical biosensor |
TWI537139B (zh) * | 2013-08-30 | 2016-06-11 | 群創光電股份有限公司 | 元件基板、顯示裝置及元件基板之製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4886681A (en) * | 1987-01-20 | 1989-12-12 | International Business Machines Corporation | Metal-polymer adhesion by low energy bombardment |
-
1992
- 1992-06-04 US US07/892,380 patent/US5496772A/en not_active Expired - Fee Related
- 1992-06-05 DE DE69228374T patent/DE69228374T2/de not_active Expired - Fee Related
- 1992-06-05 EP EP92109568A patent/EP0564693B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69228374D1 (de) | 1999-03-18 |
EP0564693B1 (de) | 1999-02-03 |
US5496772A (en) | 1996-03-05 |
EP0564693A1 (de) | 1993-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |