DE3688385D1 - System und verfahren zum absetzen mehrerer duenner filmschichten auf ein substrat. - Google Patents

System und verfahren zum absetzen mehrerer duenner filmschichten auf ein substrat.

Info

Publication number
DE3688385D1
DE3688385D1 DE8686901593T DE3688385T DE3688385D1 DE 3688385 D1 DE3688385 D1 DE 3688385D1 DE 8686901593 T DE8686901593 T DE 8686901593T DE 3688385 T DE3688385 T DE 3688385T DE 3688385 D1 DE3688385 D1 DE 3688385D1
Authority
DE
Germany
Prior art keywords
substrate
thin film
film layers
layers onto
several thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686901593T
Other languages
English (en)
Inventor
Darrel Bloomquist
George Drennan
Robert Lawton
James Opfer
Michael Jacobson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE3688385D1 publication Critical patent/DE3688385D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE8686901593T 1985-02-08 1986-02-06 System und verfahren zum absetzen mehrerer duenner filmschichten auf ein substrat. Expired - Lifetime DE3688385D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/699,969 US4663009A (en) 1985-02-08 1985-02-08 System and method for depositing plural thin film layers on a substrate
PCT/US1986/000270 WO1986004617A1 (en) 1985-02-08 1986-02-06 System and method for depositing plural thin film layers on a substrate

Publications (1)

Publication Number Publication Date
DE3688385D1 true DE3688385D1 (de) 1993-06-09

Family

ID=24811684

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686901593T Expired - Lifetime DE3688385D1 (de) 1985-02-08 1986-02-06 System und verfahren zum absetzen mehrerer duenner filmschichten auf ein substrat.

Country Status (6)

Country Link
US (1) US4663009A (de)
EP (1) EP0211938B1 (de)
JP (1) JPS62502050A (de)
CA (1) CA1310297C (de)
DE (1) DE3688385D1 (de)
WO (1) WO1986004617A1 (de)

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US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
DE3912297C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Katodenzerstäubungsanlage
JPH0449523A (ja) * 1990-06-18 1992-02-18 Denki Kagaku Kogyo Kk 磁気記録媒体の製造法及びその装置
JP2529031B2 (ja) * 1991-01-30 1996-08-28 株式会社芝浦製作所 スパッタリング装置
DE69230493T2 (de) * 1991-04-04 2000-05-04 Seagate Technology Verfahren und vorrichtung zum sputtern mit hoher geschwindigkeit
US5490910A (en) * 1992-03-09 1996-02-13 Tulip Memory Systems, Inc. Circularly symmetric sputtering apparatus with hollow-cathode plasma devices
WO1994000868A1 (en) 1992-06-26 1994-01-06 Materials Research Corporation Transport system for wafer processing line
US6136168A (en) * 1993-01-21 2000-10-24 Tdk Corporation Clean transfer method and apparatus therefor
US5831851A (en) * 1995-03-21 1998-11-03 Seagate Technology, Inc. Apparatus and method for controlling high throughput sputtering
US5958134A (en) * 1995-06-07 1999-09-28 Tokyo Electron Limited Process equipment with simultaneous or sequential deposition and etching capabilities
US5962923A (en) 1995-08-07 1999-10-05 Applied Materials, Inc. Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches
DE19537092C1 (de) * 1995-10-05 1996-07-11 Ardenne Anlagentech Gmbh Elektronenstrahl-Bedampfungsanlage im Durchlaufbetrieb für thermisch hoch belastete Substrate
CH691376A5 (de) * 1995-10-17 2001-07-13 Unaxis Balzers Ag Vakuumanlage zur Oberflächenbearbeitung von Werkstücken.
EP0799903A3 (de) * 1996-04-05 1999-11-17 Applied Materials, Inc. Verfahren zum Sputtern eines Metalls auf ein Substrat und Vorrichtung zur Behandlung von Halbleitern
US5963449A (en) 1996-08-08 1999-10-05 Tokyo Electron Limited Interlock apparatus for a transfer machine
US5933621A (en) * 1997-03-25 1999-08-03 Lam Research Corporation Method and Apparatus for terminal emulation in a semiconductor fabricating facility
US6063244A (en) * 1998-05-21 2000-05-16 International Business Machines Corporation Dual chamber ion beam sputter deposition system
US6582572B2 (en) 2000-06-01 2003-06-24 Seagate Technology Llc Target fabrication method for cylindrical cathodes
US6500264B2 (en) * 2001-04-06 2002-12-31 Wafermasters, Inc. Continuous thermal evaporation system
US6709774B2 (en) * 2001-09-18 2004-03-23 International Business Machines Corporation Magnetic thin film disks with a nonuniform composition
EP1422705A4 (de) * 2001-10-25 2008-05-28 Matsushita Electric Ind Co Ltd Verfahren zum Ausbilden einer Schicht auf einer optischen Platte
US6808783B1 (en) * 2002-01-17 2004-10-26 Maxtor Corporation Storage media with non-uniform properties
US7124466B2 (en) * 2002-02-05 2006-10-24 Seagate Technology Llc Particle capture system
US20060063680A1 (en) * 2002-07-26 2006-03-23 Metal Oxide Technologies, Inc. System and method for joining superconductivity tape
US7592079B1 (en) 2003-07-03 2009-09-22 Seagate Technology Llc Method to improve remanence-squareness-thickness-product and coercivity profiles in magnetic media
US7118815B2 (en) * 2004-02-05 2006-10-10 Seagate Technology Llc Method to improve coercivity radial profile in magnetic recording media and product thereof
US7828929B2 (en) * 2004-12-30 2010-11-09 Research Electro-Optics, Inc. Methods and devices for monitoring and controlling thin film processing
US8097133B2 (en) * 2005-07-19 2012-01-17 Applied Materials, Inc. Evacuable magnetron chamber
JP4537924B2 (ja) * 2005-09-29 2010-09-08 株式会社日立製作所 加速器利用システム
WO2007054633A1 (fr) * 2005-11-08 2007-05-18 Christian Salesse Outil de serrage comportant un systeme de compensation autonome
US20080157637A1 (en) * 2006-11-07 2008-07-03 Potenco, Inc. Secondary attachment for human power generation
US8093731B2 (en) 2006-11-07 2012-01-10 Potenco, Inc. Gearless human power generation
US9782949B2 (en) 2008-05-30 2017-10-10 Corning Incorporated Glass laminated articles and layered articles
US8432603B2 (en) 2009-03-31 2013-04-30 View, Inc. Electrochromic devices
US10550474B1 (en) * 2010-02-26 2020-02-04 Quantum Innovations, Inc. Vapor deposition system
US10808319B1 (en) * 2010-02-26 2020-10-20 Quantum Innovations, Inc. System and method for vapor deposition of substrates with circular substrate frame that rotates in a planetary motion and curved lens support arms
KR101136728B1 (ko) * 2010-10-18 2012-04-20 주성엔지니어링(주) 기판처리장치와 그의 분해 및 조립방법
AT510606B1 (de) * 2011-02-09 2012-05-15 Leica Mikrosysteme Gmbh Vorrichtung und verfahren zur probenpräparation
CN102181839B (zh) * 2011-06-03 2013-01-23 浙江大学 同端进出式连续溅射镀膜设备
CA2859023C (en) 2011-12-12 2023-08-22 View, Inc. Thin-film devices and fabrication
US20200292084A1 (en) * 2016-06-02 2020-09-17 Applied Materials, Inc. Gate valve for continuous tow processing
DE102018102762B3 (de) * 2018-02-07 2019-08-01 Uwe Beier Ladeschleuse für einen Substratbehälter, Vorrichtung mit einer Ladeschleuse und Verfahren zum Betrieb einer Ladeschleuse
US11087962B2 (en) * 2018-07-20 2021-08-10 Lam Research Corporation Real-time control of temperature in a plasma chamber
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Also Published As

Publication number Publication date
EP0211938A4 (de) 1988-09-28
EP0211938A1 (de) 1987-03-04
EP0211938B1 (de) 1993-05-05
US4663009A (en) 1987-05-05
JPS62502050A (ja) 1987-08-13
CA1310297C (en) 1992-11-17
WO1986004617A1 (en) 1986-08-14

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Legal Events

Date Code Title Description
8332 No legal effect for de