DE69216634D1 - Additivzusammensetzungen für hohe thermozyklen- und alterungsbeständige adhäsion. - Google Patents

Additivzusammensetzungen für hohe thermozyklen- und alterungsbeständige adhäsion.

Info

Publication number
DE69216634D1
DE69216634D1 DE69216634T DE69216634T DE69216634D1 DE 69216634 D1 DE69216634 D1 DE 69216634D1 DE 69216634 T DE69216634 T DE 69216634T DE 69216634 T DE69216634 T DE 69216634T DE 69216634 D1 DE69216634 D1 DE 69216634D1
Authority
DE
Germany
Prior art keywords
thermocycle
aging
additive compositions
resistant adhesion
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69216634T
Other languages
English (en)
Other versions
DE69216634T2 (de
Inventor
Hiroyuki Takado-Cho Hara
Marc Labranche
Barry Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69216634D1 publication Critical patent/DE69216634D1/de
Publication of DE69216634T2 publication Critical patent/DE69216634T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5183—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69216634T 1991-10-10 1992-10-08 Additivzusammensetzungen für hohe thermozyklen- und alterungsbeständige adhäsion. Expired - Fee Related DE69216634T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/774,788 US5250229A (en) 1991-10-10 1991-10-10 Silver-rich conductor compositions for high thermal cycled and aged adhesion
PCT/US1992/008578 WO1993007736A1 (en) 1991-10-10 1992-10-08 Silver-rich conductor compositions for high thermal cycled and aged adhesion

Publications (2)

Publication Number Publication Date
DE69216634D1 true DE69216634D1 (de) 1997-02-20
DE69216634T2 DE69216634T2 (de) 1997-04-24

Family

ID=25102309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69216634T Expired - Fee Related DE69216634T2 (de) 1991-10-10 1992-10-08 Additivzusammensetzungen für hohe thermozyklen- und alterungsbeständige adhäsion.

Country Status (9)

Country Link
US (1) US5250229A (de)
EP (1) EP0607255B1 (de)
JP (1) JP2793912B2 (de)
KR (2) KR970008549B1 (de)
CN (1) CN1071535A (de)
DE (1) DE69216634T2 (de)
MY (1) MY108362A (de)
TW (1) TW215908B (de)
WO (1) WO1993007736A1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US6316100B1 (en) 1997-02-24 2001-11-13 Superior Micropowders Llc Nickel powders, methods for producing powders and devices fabricated from same
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP3397125B2 (ja) * 1998-03-12 2003-04-14 株式会社村田製作所 電子部品
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP3494115B2 (ja) * 2000-03-30 2004-02-03 株式会社村田製作所 導電性ペーストおよびこれを用いた積層セラミック電子部品
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7732002B2 (en) 2001-10-19 2010-06-08 Cabot Corporation Method for the fabrication of conductive electronic features
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US6878184B1 (en) 2002-08-09 2005-04-12 Kovio, Inc. Nanoparticle synthesis and the formation of inks therefrom
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
US7078276B1 (en) * 2003-01-08 2006-07-18 Kovio, Inc. Nanoparticles and method for making the same
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US7533361B2 (en) 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US20060189113A1 (en) 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板
KR100875625B1 (ko) * 2005-11-14 2008-12-24 티디케이가부시기가이샤 복합 배선 기판 및 그 제조 방법
US7560052B2 (en) * 2007-03-30 2009-07-14 Lexmark International, Inc. Silver ink compositions containing a cationic styrene/acrylate copolymer additive for inkjet printing
US8511535B1 (en) * 2010-04-19 2013-08-20 Aegis Technology Inc. Innovative braze and brazing process for hermetic sealing between ceramic and metal components in a high-temperature oxidizing or reducing atmosphere
KR101343891B1 (ko) 2010-08-17 2013-12-20 (주)바이오니아 써멀 사이클러용 저 비열성 복합 소재
US9441117B2 (en) * 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
CN107041061A (zh) * 2015-12-22 2017-08-11 德国贺利氏公司 通过厚膜浆料增强的直接覆铜基板
CN108191449B (zh) * 2018-01-03 2021-04-27 上海富乐华半导体科技有限公司 一种铜-氧化铝陶瓷基板及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US553421A (en) * 1896-01-21 Corn-harvester
GB1346851A (en) * 1971-05-21 1974-02-13 Matsushita Electric Ind Co Ltd Varistors
US3896054A (en) * 1972-03-02 1975-07-22 Du Pont High adhesion metallizations
US3838071A (en) * 1972-06-30 1974-09-24 Du Pont High adhesion silver-based metallizations
US4001146A (en) * 1975-02-26 1977-01-04 E. I. Du Pont De Nemours And Company Novel silver compositions
US4094061A (en) * 1975-11-12 1978-06-13 Westinghouse Electric Corp. Method of producing homogeneous sintered ZnO non-linear resistors
US4090009A (en) * 1977-03-11 1978-05-16 E. I. Du Pont De Nemours And Company Novel silver compositions
US4187201A (en) * 1978-03-15 1980-02-05 Electro Materials Corporation Of America Thick film conductors
US4318830A (en) * 1979-01-15 1982-03-09 E. I. Du Pont De Nemours And Company Thick film conductors having improved aged adhesion
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
US4414143A (en) * 1981-05-06 1983-11-08 E. I. Du Pont De Nemours & Co. Conductor compositions
US4381945A (en) * 1981-08-03 1983-05-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions
DE3470975D1 (en) * 1983-12-22 1988-06-09 Bbc Brown Boveri & Cie Zinc oxide varistor
US4714570A (en) * 1984-07-17 1987-12-22 Matsushita Electric Industrial Co., Ltd. Conductor paste and method of manufacturing a multilayered ceramic body using the paste
JPH06104873B2 (ja) * 1986-07-08 1994-12-21 富士電機株式会社 銀―金属酸化物系接点用材料及びその製造方法

Also Published As

Publication number Publication date
US5250229A (en) 1993-10-05
EP0607255A1 (de) 1994-07-27
WO1993007736A1 (en) 1993-04-15
TW215908B (de) 1993-11-11
DE69216634T2 (de) 1997-04-24
JPH07500450A (ja) 1995-01-12
CN1071535A (zh) 1993-04-28
MY108362A (en) 1996-09-30
JP2793912B2 (ja) 1998-09-03
EP0607255B1 (de) 1997-01-08
KR940703066A (ko) 1994-09-17
KR970008549B1 (ko) 1997-05-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee