AU2001273596A1 - Printed circuit board having inductive vias - Google Patents

Printed circuit board having inductive vias

Info

Publication number
AU2001273596A1
AU2001273596A1 AU2001273596A AU7359601A AU2001273596A1 AU 2001273596 A1 AU2001273596 A1 AU 2001273596A1 AU 2001273596 A AU2001273596 A AU 2001273596A AU 7359601 A AU7359601 A AU 7359601A AU 2001273596 A1 AU2001273596 A1 AU 2001273596A1
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
vias
inductive
inductive vias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001273596A
Inventor
Alexander W. Barr
Larry Edward Moser
Samuel C. Ramey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robinson Nugent Inc
Original Assignee
Robinson Nugent Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robinson Nugent Inc filed Critical Robinson Nugent Inc
Publication of AU2001273596A1 publication Critical patent/AU2001273596A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AU2001273596A 2000-06-19 2001-06-18 Printed circuit board having inductive vias Abandoned AU2001273596A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21242400P 2000-06-19 2000-06-19
US60212424 2000-06-19
US21811200P 2000-07-13 2000-07-13
US60218112 2000-07-13
PCT/US2001/041030 WO2001099480A2 (en) 2000-06-19 2001-06-18 Printed circuit board having inductive vias

Publications (1)

Publication Number Publication Date
AU2001273596A1 true AU2001273596A1 (en) 2002-01-02

Family

ID=26907125

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001273596A Abandoned AU2001273596A1 (en) 2000-06-19 2001-06-18 Printed circuit board having inductive vias

Country Status (3)

Country Link
US (2) US6711814B2 (en)
AU (1) AU2001273596A1 (en)
WO (1) WO2001099480A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6737749B2 (en) * 2001-12-20 2004-05-18 Sun Microsystems, Inc. Resistive vias for controlling impedance and terminating I/O signals at the package level
US7152312B2 (en) * 2002-02-11 2006-12-26 Adc Dsl Systems, Inc. Method for transmitting current through a substrate
US7276921B2 (en) * 2003-06-30 2007-10-02 Intel Corporation Probe of under side of component through opening in a printed circuit board
DE102004014034A1 (en) * 2004-03-19 2005-10-06 Endress + Hauser Gmbh + Co. Kg Printed circuit board with at least one connection hole for a lead or pin of a wired electronic component
US20050231927A1 (en) * 2004-04-20 2005-10-20 Dell Products L.P. Method, system and apparatus for controlled impedance at transitional plated-through hole via sites using barrel inductance minimization
US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
US20070089902A1 (en) * 2005-10-25 2007-04-26 Tourne Joseph A Circuit board having a multi-signal via
JP5050655B2 (en) * 2006-06-01 2012-10-17 富士通株式会社 Build-up board, electronic component and electronic device having the same
US9172145B2 (en) 2006-09-21 2015-10-27 Raytheon Company Transmit/receive daughter card with integral circulator
US9019166B2 (en) 2009-06-15 2015-04-28 Raytheon Company Active electronically scanned array (AESA) card
US7671696B1 (en) * 2006-09-21 2010-03-02 Raytheon Company Radio frequency interconnect circuits and techniques
US7956713B2 (en) * 2007-09-25 2011-06-07 Intel Corporation Forming a helical inductor
US8440917B2 (en) * 2007-11-19 2013-05-14 International Business Machines Corporation Method and apparatus to reduce impedance discontinuity in packages
JP2010027654A (en) * 2008-07-15 2010-02-04 Nec Corp Wiring board, method of forming via in wiring board, and method of manufacturing wiring board
US20100237462A1 (en) * 2009-03-18 2010-09-23 Benjamin Beker Package Level Tuning Techniques for Propagation Channels of High-Speed Signals
US8508943B2 (en) 2009-10-16 2013-08-13 Raytheon Company Cooling active circuits
US8302301B2 (en) * 2010-03-31 2012-11-06 Flextronics Ap, Llc Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters
US8427371B2 (en) 2010-04-09 2013-04-23 Raytheon Company RF feed network for modular active aperture electronically steered arrays
US8215966B2 (en) * 2010-04-20 2012-07-10 Tyco Electronics Corporation Interposer connector assembly
US8363413B2 (en) 2010-09-13 2013-01-29 Raytheon Company Assembly to provide thermal cooling
US8355255B2 (en) 2010-12-22 2013-01-15 Raytheon Company Cooling of coplanar active circuits
US9124361B2 (en) 2011-10-06 2015-09-01 Raytheon Company Scalable, analog monopulse network
US9257221B2 (en) * 2012-04-13 2016-02-09 Cyntec Co., Ltd. Through-hole via inductor in a high-frequency device
DE102012207833A1 (en) * 2012-05-10 2013-11-14 Bayerische Motoren Werke Aktiengesellschaft Method for forming coil in circuit board for e.g. highly efficient bus system, involves forming helical conductor at inner wall of hole for formation of coil in circuit board, where helical conductors are wound around longitudinal axis
DE102013205532A1 (en) * 2013-03-28 2014-10-02 Bayerische Motoren Werke Aktiengesellschaft Method for forming magnetically coupled coils in a printed circuit board
CN104717827A (en) * 2013-12-11 2015-06-17 鸿富锦精密工业(武汉)有限公司 Printed circuit board
US10045434B2 (en) 2014-12-15 2018-08-07 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Reducing impedance discontinuities on a printed circuit board (‘PCB’)
US9615459B2 (en) * 2014-12-18 2017-04-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Inductor, circuit board, and implementing method of the inductor
US9870853B1 (en) * 2015-07-20 2018-01-16 The United States Of America As Represented By The Secretary Of The Navy Adjustable inductor
US10163557B2 (en) 2015-12-17 2018-12-25 Intel Corporation Helical plated through-hole package inductor
US10257931B2 (en) * 2016-02-09 2019-04-09 Dell Products, L.P. Systems and methods for providing grooved vias in high-speed printed circuit boards
CN105704921B (en) * 2016-03-29 2019-01-01 青岛海信移动通信技术股份有限公司 The via hole production method of printed wiring board and printed wiring board
DE102016116581A1 (en) * 2016-06-03 2018-03-01 E-Seven Systems Technology Management Ltd Connection plate for a battery and battery
US10834828B2 (en) * 2018-01-26 2020-11-10 International Business Machines Corporation Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology
GB202000401D0 (en) * 2020-01-10 2020-02-26 Cantor Tech Limited Substrate and method
CN113518515B (en) * 2021-03-15 2023-09-08 江西宇睿电子科技有限公司 Method for manufacturing broken joint metalized edge and circuit board

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2502291A (en) 1946-02-27 1950-03-28 Lawrence H Taylor Method for establishing electrical connections in electrical apparatus
US3148356A (en) 1959-09-14 1964-09-08 Jr George A Hedden Printed circuit connector
US3357099A (en) 1962-10-29 1967-12-12 North American Aviation Inc Providing plated through-hole connections with the plating resist extending to the hole edges
US3268652A (en) 1963-11-12 1966-08-23 Western Electric Co Electrical circuit assemblies
US3348990A (en) 1963-12-23 1967-10-24 Sperry Rand Corp Process for electrically interconnecting elements on different layers of a multilayer printed circuit assembly
US3400210A (en) 1966-04-26 1968-09-03 Automatic Elect Lab Interlayer connection technique for multilayer printed wiring boards
US3509270A (en) 1968-04-08 1970-04-28 Ney Co J M Interconnection for printed circuits and method of making same
US3739469A (en) * 1971-12-27 1973-06-19 Ibm Multilayer printed circuit board and method of manufacture
DE2323529A1 (en) 1973-05-10 1974-11-28 Peter Kammermeier CIRCUIT BOARD WITH PRINTED OR CLADDED TRACKS
YU37241B (en) 1977-03-14 1984-08-31 Iskra Programming matrix
US4784707A (en) * 1986-02-07 1988-11-15 Aluminum Company Of America Method of making electrical connections using joint compound
US4838800A (en) 1988-05-23 1989-06-13 Gte Products Corporation High density interconnect system
JPH0464278A (en) 1990-07-04 1992-02-28 Sumitomo Bakelite Co Ltd Manufacture of printed wiring board
CA2023361A1 (en) 1990-07-20 1992-01-21 Robert L. Barnhouse Printed circuit boards
US5133669A (en) * 1990-07-23 1992-07-28 Northern Telecom Limited Circuit board pins
JPH04273410A (en) 1991-02-28 1992-09-29 Taiyo Yuden Co Ltd Wiring board and its manufacture
US5425816A (en) 1991-08-19 1995-06-20 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
JPH05152702A (en) 1991-11-28 1993-06-18 Toshiba Corp Printed wiring board
US5497546A (en) 1992-09-21 1996-03-12 Matsushita Electric Works, Ltd. Method for mounting lead terminals to circuit board
US5414223A (en) * 1994-08-10 1995-05-09 Ast Research, Inc. Solder pad for printed circuit boards
US5619018A (en) 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US5940731A (en) 1996-10-16 1999-08-17 Vanguard International Semiconductor Corp. Method for forming tapered polysilicon plug and plug formed
JP2877132B2 (en) 1997-03-26 1999-03-31 日本電気株式会社 Multilayer printed circuit board and manufacturing method thereof
JPH11251702A (en) 1998-02-27 1999-09-17 Nissha Printing Co Ltd Printed wiring board having through hole
US6137064A (en) * 1999-06-11 2000-10-24 Teradyne, Inc. Split via surface mount connector and related techniques
US6891272B1 (en) * 2002-07-31 2005-05-10 Silicon Pipe, Inc. Multi-path via interconnection structures and methods for manufacturing the same
US20050231927A1 (en) * 2004-04-20 2005-10-20 Dell Products L.P. Method, system and apparatus for controlled impedance at transitional plated-through hole via sites using barrel inductance minimization

Also Published As

Publication number Publication date
US20040160721A1 (en) 2004-08-19
WO2001099480A2 (en) 2001-12-27
WO2001099480A3 (en) 2002-06-20
US6711814B2 (en) 2004-03-30
US20020022110A1 (en) 2002-02-21

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