DE69216377D1 - Form und Verfahren zur Herstellung von Kunststoffpackungen für integrierte Schaltungen die eine freie metallische Wärmesenke enthalten zur Inspektion der Lötverbindung - Google Patents
Form und Verfahren zur Herstellung von Kunststoffpackungen für integrierte Schaltungen die eine freie metallische Wärmesenke enthalten zur Inspektion der LötverbindungInfo
- Publication number
- DE69216377D1 DE69216377D1 DE69216377T DE69216377T DE69216377D1 DE 69216377 D1 DE69216377 D1 DE 69216377D1 DE 69216377 T DE69216377 T DE 69216377T DE 69216377 T DE69216377 T DE 69216377T DE 69216377 D1 DE69216377 D1 DE 69216377D1
- Authority
- DE
- Germany
- Prior art keywords
- inspection
- contain
- heat sink
- integrated circuits
- metallic heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10931—Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead, e.g. for soldering purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI913440A IT1252575B (it) | 1991-12-20 | 1991-12-20 | Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69216377D1 true DE69216377D1 (de) | 1997-02-13 |
DE69216377T2 DE69216377T2 (de) | 1997-04-24 |
Family
ID=11361402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69216377T Expired - Fee Related DE69216377T2 (de) | 1991-12-20 | 1992-10-22 | Form und Verfahren zur Herstellung von Kunststoffpackungen für integrierte Schaltungen die eine freie metallische Wärmesenke enthalten zur Inspektion der Lötverbindung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5445995A (de) |
EP (1) | EP0548496B1 (de) |
JP (1) | JP3217876B2 (de) |
DE (1) | DE69216377T2 (de) |
IT (1) | IT1252575B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1252575B (it) * | 1991-12-20 | 1995-06-19 | Sgs Thomson Microelectronics | Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura |
DE69620564T2 (de) * | 1996-01-25 | 2003-01-30 | Stmicroelectronics S.R.L., Agrate Brianza | Kunststoffkörper eines Leitungshalbleiters zur Oberflächenmontage mit optimierten charakteristischen Abmessungen zur Benutzung von Standard-Transport- und Testhaltern |
DE19624478A1 (de) * | 1996-02-08 | 1998-01-02 | Bayerische Motoren Werke Ag | Verfahren zum Herstellen eines elektronischen Steuergeräts |
DE19621766A1 (de) * | 1996-05-30 | 1997-12-04 | Siemens Ag | Halbleiteranordnung mit Kunststoffgehäuse und Wärmeverteiler |
US6046501A (en) * | 1996-10-02 | 2000-04-04 | Matsushita Electric Industrial Co., Ltd. | RF-driven semiconductor device |
US5939775A (en) * | 1996-11-05 | 1999-08-17 | Gcb Technologies, Llc | Leadframe structure and process for packaging intergrated circuits |
DE69636853T2 (de) * | 1996-11-27 | 2007-11-08 | Stmicroelectronics S.R.L., Agrate Brianza | Herstellunsgverfahren einer Kunststoffpackung für elektronische Anordnungen mit einer Wärmesenke |
JP3027954B2 (ja) * | 1997-04-17 | 2000-04-04 | 日本電気株式会社 | 集積回路装置、その製造方法 |
WO2002020236A2 (en) * | 2000-09-08 | 2002-03-14 | Asm Technology Singapore Pte Ltd. | A mold |
US20040113240A1 (en) | 2002-10-11 | 2004-06-17 | Wolfgang Hauser | An electronic component with a leadframe |
DE102005016830A1 (de) * | 2004-04-14 | 2005-11-03 | Denso Corp., Kariya | Halbleitervorrichtung und Verfahren zu ihrer Herstellung |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
JPS5480079A (en) * | 1978-08-07 | 1979-06-26 | Dai Ichi Seiko Co Ltd | Method of forming semiconductor seal |
JPS6188535A (ja) * | 1984-10-08 | 1986-05-06 | Nec Corp | 半導体装置の製造方法 |
JPS62128721A (ja) * | 1985-11-29 | 1987-06-11 | Rohm Co Ltd | 樹脂成形方法 |
JPS62244139A (ja) * | 1986-04-17 | 1987-10-24 | Citizen Watch Co Ltd | 樹脂封止型ピングリツドアレイ及びその製造方法 |
IT1201836B (it) * | 1986-07-17 | 1989-02-02 | Sgs Microelettronica Spa | Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico |
US4688152A (en) * | 1986-08-11 | 1987-08-18 | National Semiconductor Corporation | Molded pin grid array package GPT |
JPS63107159A (ja) * | 1986-10-24 | 1988-05-12 | Toshiba Corp | 半導体装置 |
JPH0828443B2 (ja) * | 1987-09-26 | 1996-03-21 | 株式会社東芝 | 半導体装置 |
JP2752677B2 (ja) * | 1989-01-11 | 1998-05-18 | 日本電気株式会社 | 半導体装置の製造方法 |
US5157478A (en) * | 1989-04-19 | 1992-10-20 | Mitsubishi Denki Kabushiki Kaisha | Tape automated bonding packaged semiconductor device incorporating a heat sink |
JPH02306639A (ja) * | 1989-05-22 | 1990-12-20 | Toshiba Corp | 半導体装置の樹脂封入方法 |
ATE154990T1 (de) * | 1991-04-10 | 1997-07-15 | Caddock Electronics Inc | Schichtwiderstand |
IT1252575B (it) * | 1991-12-20 | 1995-06-19 | Sgs Thomson Microelectronics | Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura |
-
1991
- 1991-12-20 IT ITMI913440A patent/IT1252575B/it active IP Right Grant
-
1992
- 1992-10-22 EP EP92118078A patent/EP0548496B1/de not_active Expired - Lifetime
- 1992-10-22 DE DE69216377T patent/DE69216377T2/de not_active Expired - Fee Related
- 1992-11-06 JP JP29671592A patent/JP3217876B2/ja not_active Expired - Lifetime
- 1992-12-21 US US07/994,421 patent/US5445995A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0548496B1 (de) | 1997-01-02 |
ITMI913440A1 (it) | 1993-06-20 |
US5445995A (en) | 1995-08-29 |
JP3217876B2 (ja) | 2001-10-15 |
JPH05326589A (ja) | 1993-12-10 |
IT1252575B (it) | 1995-06-19 |
ITMI913440A0 (it) | 1991-12-20 |
DE69216377T2 (de) | 1997-04-24 |
EP0548496A1 (de) | 1993-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |