DE69204917D1 - Messverfahren und -vorrichtung. - Google Patents

Messverfahren und -vorrichtung.

Info

Publication number
DE69204917D1
DE69204917D1 DE69204917T DE69204917T DE69204917D1 DE 69204917 D1 DE69204917 D1 DE 69204917D1 DE 69204917 T DE69204917 T DE 69204917T DE 69204917 T DE69204917 T DE 69204917T DE 69204917 D1 DE69204917 D1 DE 69204917D1
Authority
DE
Germany
Prior art keywords
measuring method
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69204917T
Other languages
English (en)
Other versions
DE69204917T2 (de
Inventor
Katsuyuki Kobayashi
Atsushi Tanaka
Yuichiro Yoshimura
Kiyoshi Kaneko
Masaki Tokioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3150047A external-priority patent/JP2996538B2/ja
Priority claimed from JP3150046A external-priority patent/JP2996537B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69204917D1 publication Critical patent/DE69204917D1/de
Publication of DE69204917T2 publication Critical patent/DE69204917T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S73/00Measuring and testing
    • Y10S73/01Vibration

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
DE69204917T 1991-06-21 1992-06-19 Messverfahren und -vorrichtung. Expired - Fee Related DE69204917T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3150047A JP2996538B2 (ja) 1991-06-21 1991-06-21 測定方法及び装置
JP3150046A JP2996537B2 (ja) 1991-06-21 1991-06-21 測定方法及び装置

Publications (2)

Publication Number Publication Date
DE69204917D1 true DE69204917D1 (de) 1995-10-26
DE69204917T2 DE69204917T2 (de) 1996-03-14

Family

ID=26479759

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69204917T Expired - Fee Related DE69204917T2 (de) 1991-06-21 1992-06-19 Messverfahren und -vorrichtung.

Country Status (3)

Country Link
US (1) US5438872A (de)
EP (1) EP0519476B1 (de)
DE (1) DE69204917T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244895B2 (ja) * 1993-12-02 2002-01-07 キヤノン株式会社 距離測定装置及びそれを用いた座標入力装置、及び距離測定方法及びそれを用いた座標入力方法
US5665907A (en) * 1994-09-06 1997-09-09 The University Of Chicago Ultrasonic imaging system for in-process fabric defect detection
JPH09190273A (ja) 1996-01-10 1997-07-22 Canon Inc 座標入力装置
JPH1011207A (ja) * 1996-06-25 1998-01-16 Canon Inc 座標入力装置及びその制御方法
US5686652A (en) * 1996-09-09 1997-11-11 Pfund; Bruce Portable test hammer apparatus
US5996415A (en) * 1997-04-30 1999-12-07 Sensys Instruments Corporation Apparatus and method for characterizing semiconductor wafers during processing
US6026688A (en) * 1997-10-03 2000-02-22 The Board Of Trustees Of The Leland Stanford Junior University Ultrasonic photoresist process monitor and method
US6250161B1 (en) 1997-10-03 2001-06-26 Board Of Trustees Of The Leland Stanford Junior University Ultrasonic photoresist process monitor and method
US6019000A (en) * 1997-11-20 2000-02-01 Sensys Instruments Corporation In-situ measurement of deposition on reactor chamber members
US5965818A (en) * 1998-01-15 1999-10-12 Shell Oil Company Ultrasonic Lamb wave technique for measurement of pipe wall thickness at pipe supports
US6715354B2 (en) 1998-02-24 2004-04-06 Massachusetts Institute Of Technology Flaw detection system using acoustic doppler effect
US6029521A (en) * 1998-10-19 2000-02-29 National Science Council Method for measuring cover thickness of reinforcing bar in concrete by using stress wave
US6728515B1 (en) 2000-02-16 2004-04-27 Massachusetts Institute Of Technology Tuned wave phased array
US6360609B1 (en) * 2000-02-23 2002-03-26 Massachusetts Institute Of Technology Method and system for interpreting and utilizing multimode dispersive acoustic guided waves
US6497159B1 (en) 2000-06-12 2002-12-24 Hydro-Quebec Bracelet for moving ultrasonic sensors along a pipe
US6833554B2 (en) * 2000-11-21 2004-12-21 Massachusetts Institute Of Technology Laser-induced defect detection system and method
GB0114455D0 (en) * 2001-06-14 2001-08-08 Koninkl Philips Electronics Nv Data inut system
JP3658382B2 (ja) * 2001-08-21 2005-06-08 キヤノン株式会社 信号出力装置、シート材の判別方法、画像形成装置、シート材搬送装置、及び信号出力方法
US6904806B2 (en) * 2002-07-18 2005-06-14 Wayne State University Electronic intelligent indenter
US7111092B1 (en) * 2004-04-16 2006-09-19 Cisco Technology, Inc. Buffer management technique for a hypertransport data path protocol
JP2008226386A (ja) * 2007-03-14 2008-09-25 Fujitsu Ltd 記憶装置、制御装置、振動検出方法
JP5395417B2 (ja) * 2008-12-09 2014-01-22 テイ・エス テック株式会社 測定方法および測定装置
US9518959B2 (en) * 2013-08-12 2016-12-13 Texas Instruments Incorporated Structural health monitoring system and method
FR3075947B1 (fr) * 2017-12-21 2020-01-03 Centre Technique Des Industries Mecaniques Methode et dispositif de determination de l'epaisseur d'une couche traitee d'une piece metallique

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175952A (en) * 1981-04-24 1982-10-29 Kyoei Giken:Kk Non-destructive test device of non-metallic object by impulsive elastic wave
JPS601553A (ja) * 1983-06-20 1985-01-07 Mitsubishi Electric Corp 超音波検査装置
JPS63175712A (ja) * 1987-01-16 1988-07-20 Toshiba Corp 超音波厚み計
SU1525455A1 (ru) * 1987-07-01 1989-11-30 Каунасский Политехнический Институт Им.Антанаса Снечкуса Способ определени изменени физико-механических свойств материалов по толщине
SU1569534A1 (ru) * 1987-08-11 1990-06-07 Предприятие П/Я М-5953 Ультразвуковой способ контрол толщины изделий
SU1631410A1 (ru) * 1988-08-09 1991-02-28 В.В. Драгинич, М.В. Носаль, Г.О. Драгинич, С.А. Половко и Ю.М. Носаль Устройство дл контрол акустических характеристик материалов
US5035144A (en) * 1989-07-31 1991-07-30 National Research Council Of Canada Frequency broadband measurement of the characteristics of acoustic waves

Also Published As

Publication number Publication date
DE69204917T2 (de) 1996-03-14
EP0519476A1 (de) 1992-12-23
EP0519476B1 (de) 1995-09-20
US5438872A (en) 1995-08-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee