DE69203253D1 - IC-Chipstruktur. - Google Patents
IC-Chipstruktur.Info
- Publication number
- DE69203253D1 DE69203253D1 DE69203253T DE69203253T DE69203253D1 DE 69203253 D1 DE69203253 D1 DE 69203253D1 DE 69203253 T DE69203253 T DE 69203253T DE 69203253 T DE69203253 T DE 69203253T DE 69203253 D1 DE69203253 D1 DE 69203253D1
- Authority
- DE
- Germany
- Prior art keywords
- chip structure
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
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- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3024971A JPH04264758A (ja) | 1991-02-20 | 1991-02-20 | 半導体チップキャリア |
Publications (2)
Publication Number | Publication Date |
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DE69203253D1 true DE69203253D1 (de) | 1995-08-10 |
DE69203253T2 DE69203253T2 (de) | 1995-11-02 |
Family
ID=12152858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69203253T Expired - Fee Related DE69203253T2 (de) | 1991-02-20 | 1992-02-19 | IC-Chipstruktur. |
Country Status (4)
Country | Link |
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EP (2) | EP0500074B1 (de) |
JP (1) | JPH04264758A (de) |
CA (1) | CA2061522C (de) |
DE (1) | DE69203253T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US6835898B2 (en) | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US6336269B1 (en) | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
EP0792519B1 (de) * | 1994-11-15 | 2003-03-26 | Formfactor, Inc. | Verbindungselemente für mikroelektronische komponenten |
EP0792517B1 (de) * | 1994-11-15 | 2003-10-22 | Formfactor, Inc. | Elektrische kontaktstruktur aus flexiblem draht |
EP0792463B1 (de) * | 1994-11-15 | 2004-05-12 | Formfactor, Inc. | Montage von federelementen auf halbleiterbauteilen |
US6727579B1 (en) | 1994-11-16 | 2004-04-27 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US20100065963A1 (en) | 1995-05-26 | 2010-03-18 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
JP2000312075A (ja) * | 1999-04-27 | 2000-11-07 | Nec Corp | プリント配線板への接続方法および構造 |
US7242199B2 (en) * | 2005-04-21 | 2007-07-10 | Hewlett-Packard Development Company, L.P. | Active interconnects and control points in integrated circuits |
JP5577801B2 (ja) * | 2010-04-07 | 2014-08-27 | ダイキン工業株式会社 | 冷凍装置 |
US8780561B2 (en) * | 2012-03-30 | 2014-07-15 | Raytheon Company | Conduction cooling of multi-channel flip chip based panel array circuits |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4196444A (en) * | 1976-12-03 | 1980-04-01 | Texas Instruments Deutschland Gmbh | Encapsulated power semiconductor device with single piece heat sink mounting plate |
US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
DE3127457C2 (de) * | 1981-07-11 | 1985-09-12 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichtermodul |
DE3231389A1 (de) * | 1981-08-29 | 1983-03-10 | Robert Bosch Gmbh, 7000 Stuttgart | Gleichrichteranordnung mit einem halbleiter-diodenplaettchen |
WO1987006765A1 (en) * | 1986-04-21 | 1987-11-05 | Aegis, Inc. | Corrosion resistant pins for metal packaged microcircuits |
US4987478A (en) * | 1990-02-20 | 1991-01-22 | Unisys Corporation | Micro individual integrated circuit package |
-
1991
- 1991-02-20 JP JP3024971A patent/JPH04264758A/ja active Pending
-
1992
- 1992-02-19 CA CA002061522A patent/CA2061522C/en not_active Expired - Fee Related
- 1992-02-19 EP EP92102759A patent/EP0500074B1/de not_active Expired - Lifetime
- 1992-02-19 EP EP94118778A patent/EP0650191A1/de not_active Withdrawn
- 1992-02-19 DE DE69203253T patent/DE69203253T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0500074B1 (de) | 1995-07-05 |
EP0500074A1 (de) | 1992-08-26 |
EP0650191A1 (de) | 1995-04-26 |
CA2061522A1 (en) | 1992-08-21 |
JPH04264758A (ja) | 1992-09-21 |
DE69203253T2 (de) | 1995-11-02 |
CA2061522C (en) | 1998-08-11 |
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Legal Events
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8339 | Ceased/non-payment of the annual fee |