DE69120975T2 - Verfahren zum Herstellen einer Halbleitervorrichtung - Google Patents
Verfahren zum Herstellen einer HalbleitervorrichtungInfo
- Publication number
- DE69120975T2 DE69120975T2 DE69120975T DE69120975T DE69120975T2 DE 69120975 T2 DE69120975 T2 DE 69120975T2 DE 69120975 T DE69120975 T DE 69120975T DE 69120975 T DE69120975 T DE 69120975T DE 69120975 T2 DE69120975 T2 DE 69120975T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
- H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/131—Reactive ion etching rie
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP510890 | 1990-01-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69120975D1 DE69120975D1 (de) | 1996-08-29 |
DE69120975T2 true DE69120975T2 (de) | 1996-12-19 |
Family
ID=11602164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69120975T Expired - Fee Related DE69120975T2 (de) | 1990-01-12 | 1991-01-11 | Verfahren zum Herstellen einer Halbleitervorrichtung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5183781A (de) |
EP (1) | EP0437371B1 (de) |
DE (1) | DE69120975T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5284804A (en) * | 1991-12-31 | 1994-02-08 | Texas Instruments Incorporated | Global planarization process |
CN1038964C (zh) * | 1994-05-23 | 1998-07-01 | 现代电子产业株式会社 | 半导体器件的接触结构及其制造方法 |
JP2746167B2 (ja) * | 1995-01-25 | 1998-04-28 | 日本電気株式会社 | 半導体装置の製造方法 |
US5624870A (en) * | 1995-03-16 | 1997-04-29 | United Microelectronics Corporation | Method of contact planarization |
KR0144909B1 (ko) * | 1995-03-21 | 1998-07-01 | 김광호 | 비휘발성 메모리 장치의 셀 어레이 레이아웃 방법 |
US5587338A (en) * | 1995-04-27 | 1996-12-24 | Vanguard International Semiconductor Corporation | Polysilicon contact stud process |
US5534460A (en) * | 1995-04-27 | 1996-07-09 | Vanguard International Semiconductor Corp. | Optimized contact plug process |
US5599736A (en) * | 1995-06-28 | 1997-02-04 | Vanguard International Semiconductor Corporation | Fabrication method for polysilicon contact plugs |
US5856700A (en) * | 1996-05-08 | 1999-01-05 | Harris Corporation | Semiconductor device with doped semiconductor and dielectric trench sidewall layers |
US6440837B1 (en) * | 2000-07-14 | 2002-08-27 | Micron Technology, Inc. | Method of forming a contact structure in a semiconductor device |
US6563156B2 (en) | 2001-03-15 | 2003-05-13 | Micron Technology, Inc. | Memory elements and methods for making same |
KR100475122B1 (ko) * | 2002-12-20 | 2005-03-10 | 삼성전자주식회사 | 실리콘 접촉저항을 개선할 수 있는 반도체 소자 형성방법 |
CN102468222A (zh) * | 2010-11-16 | 2012-05-23 | 上海华虹Nec电子有限公司 | 射频ldmos器件中源衬接触柱的实现方法 |
JP2014222699A (ja) | 2013-05-13 | 2014-11-27 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6010718A (ja) * | 1983-06-30 | 1985-01-19 | Nec Corp | 半導体装置の製造方法 |
JPS61222225A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS63181423A (ja) * | 1987-01-23 | 1988-07-26 | Toshiba Corp | 半導体装置の製造方法 |
US4728391A (en) * | 1987-05-11 | 1988-03-01 | Motorola Inc. | Pedestal transistors and method of production thereof |
JPS6465625A (en) * | 1987-09-07 | 1989-03-10 | Alps Electric Co Ltd | Optical type coordinate input device |
JPH025525A (ja) * | 1988-06-24 | 1990-01-10 | Nec Corp | 半導体基板のエッチング方法 |
JPH02108541A (ja) * | 1988-10-18 | 1990-04-20 | Nec Corp | 印刷装置等の定着器 |
-
1991
- 1991-01-08 US US07/638,757 patent/US5183781A/en not_active Expired - Fee Related
- 1991-01-11 EP EP91300193A patent/EP0437371B1/de not_active Expired - Lifetime
- 1991-01-11 DE DE69120975T patent/DE69120975T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0437371A2 (de) | 1991-07-17 |
DE69120975D1 (de) | 1996-08-29 |
US5183781A (en) | 1993-02-02 |
EP0437371B1 (de) | 1996-07-24 |
EP0437371A3 (en) | 1992-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP |
|
8339 | Ceased/non-payment of the annual fee |