GB8331348D0 - Machine for placing electronic components on substrate - Google Patents

Machine for placing electronic components on substrate

Info

Publication number
GB8331348D0
GB8331348D0 GB838331348A GB8331348A GB8331348D0 GB 8331348 D0 GB8331348 D0 GB 8331348D0 GB 838331348 A GB838331348 A GB 838331348A GB 8331348 A GB8331348 A GB 8331348A GB 8331348 D0 GB8331348 D0 GB 8331348D0
Authority
GB
United Kingdom
Prior art keywords
substrate
machine
electronic components
placing electronic
placing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB838331348A
Other versions
GB2150098A (en
GB2150098B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aven Tools Ltd
Original Assignee
Dynapert Precima Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynapert Precima Ltd filed Critical Dynapert Precima Ltd
Priority to GB08331348A priority Critical patent/GB2150098B/en
Publication of GB8331348D0 publication Critical patent/GB8331348D0/en
Priority to JP59248574A priority patent/JPS60197000A/en
Publication of GB2150098A publication Critical patent/GB2150098A/en
Application granted granted Critical
Publication of GB2150098B publication Critical patent/GB2150098B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
GB08331348A 1983-11-24 1983-11-24 Machine for placing electronic components on a substrate Expired GB2150098B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB08331348A GB2150098B (en) 1983-11-24 1983-11-24 Machine for placing electronic components on a substrate
JP59248574A JPS60197000A (en) 1983-11-24 1984-11-24 Machine for placing electronic part on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08331348A GB2150098B (en) 1983-11-24 1983-11-24 Machine for placing electronic components on a substrate

Publications (3)

Publication Number Publication Date
GB8331348D0 true GB8331348D0 (en) 1984-01-04
GB2150098A GB2150098A (en) 1985-06-26
GB2150098B GB2150098B (en) 1986-10-08

Family

ID=10552270

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08331348A Expired GB2150098B (en) 1983-11-24 1983-11-24 Machine for placing electronic components on a substrate

Country Status (2)

Country Link
JP (1) JPS60197000A (en)
GB (1) GB2150098B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110831348A (en) * 2019-11-24 2020-02-21 湖南凯通电子有限公司 Thermistor bonding machine

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE456570B (en) * 1986-01-20 1988-10-17 Applied Vacuum Scandinavia Ab WAY TO TRANSPORT ARTICLES THROUGH A MANUFACTURING AND / OR FINISHING PROCESS
DE9004208U1 (en) * 1990-04-11 1990-06-13 Groninger & Co Gmbh, 7180 Crailsheim, De
KR0145258B1 (en) * 1993-11-16 1998-08-17 모리시타 요이찌 Apparatus for bonding electronic device
SE9400077D0 (en) * 1994-01-10 1994-01-14 Mytronic Ab Machine Concept
KR100204098B1 (en) * 1995-10-25 1999-06-15 이해규 Lead frame taping equipment and taping method
DE19823938C1 (en) * 1998-05-28 2000-02-10 Siemens Ag Linear positioning and position detection method for substrate
DE10034690C2 (en) * 2000-07-17 2002-06-27 Siemens Ag Device for linear positioning of a circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182898A (en) * 1982-04-20 1983-10-25 三洋電機株式会社 Board carrying device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110831348A (en) * 2019-11-24 2020-02-21 湖南凯通电子有限公司 Thermistor bonding machine
CN110831348B (en) * 2019-11-24 2021-10-08 湖南凯通电子有限公司 Thermistor bonding machine

Also Published As

Publication number Publication date
GB2150098A (en) 1985-06-26
JPS60197000A (en) 1985-10-05
GB2150098B (en) 1986-10-08

Similar Documents

Publication Publication Date Title
GB2151411B (en) A case for an electronic device
DE3379820D1 (en) Substrate for integrated circuit packages
DE3275789D1 (en) Substrate for mounting integrated circuit chips
GB2140716B (en) Mounting apparatus for chip type electronic parts on circuit boards
EP0242626A3 (en) Method for mounting electronic components on a substrate
GB2076703B (en) Apparatus for mounting a chip-type electronic component on a substrate
GB8304890D0 (en) Chip-carrier substrates
GB2149512B (en) Electronic weighing machine
GB2139597B (en) Apparatus for automatically mounting chip type circuit elements on printed circuit boards
GB8425780D0 (en) Housing for electronic component
DE3476628D1 (en) Substrate material for printed circuits
GB8302216D0 (en) Coating for electronic substrate
GB2149511B (en) Electronic weighing machine
DE3571546D1 (en) Apparatus for placing electronic and/or electrical components on a substrate
GB8331348D0 (en) Machine for placing electronic components on substrate
GB8403143D0 (en) Electronic apparatus
GB8404217D0 (en) Chip-carrier substrates
GB2123316B (en) Substrates for electronic devices
GB2145571B (en) Electronic component module
GB2166983B (en) Apparatus for automatically mounting chip-type circuit elements on a substrate
EP0154652A4 (en) Electronic part mounting apparatus.
GB2137818B (en) Clamp arrangements particularly for printed circuit boards
EP0170767A3 (en) Substrate for printed circuits
JPS57184294A (en) Device for mounting electronic part
DE3472358D1 (en) Device for mounting components on circuit boards

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19931124