DE69112272D1 - Verfahren und Gerät zur Laserbearbeitung. - Google Patents

Verfahren und Gerät zur Laserbearbeitung.

Info

Publication number
DE69112272D1
DE69112272D1 DE69112272T DE69112272T DE69112272D1 DE 69112272 D1 DE69112272 D1 DE 69112272D1 DE 69112272 T DE69112272 T DE 69112272T DE 69112272 T DE69112272 T DE 69112272T DE 69112272 D1 DE69112272 D1 DE 69112272D1
Authority
DE
Germany
Prior art keywords
laser processing
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69112272T
Other languages
English (en)
Other versions
DE69112272T2 (de
Inventor
Masahiro Saruta
Tetsuji Sagisaka
Kazunari Maeda
Takumi Yashiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTN Corp
Original Assignee
NTN Corp
NTN Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2132205A external-priority patent/JP2648883B2/ja
Priority claimed from JP2132204A external-priority patent/JPH0832369B2/ja
Priority claimed from JP2173361A external-priority patent/JPH0461356A/ja
Application filed by NTN Corp, NTN Toyo Bearing Co Ltd filed Critical NTN Corp
Application granted granted Critical
Publication of DE69112272D1 publication Critical patent/DE69112272D1/de
Publication of DE69112272T2 publication Critical patent/DE69112272T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/103—Scanning by mechanical motion of stage
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45165—Laser machining
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50064—Camera inspects workpiece for errors, correction of workpiece at desired position

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Biochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69112272T 1990-05-21 1991-05-16 Verfahren und Gerät zur Laserbearbeitung. Expired - Fee Related DE69112272T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2132205A JP2648883B2 (ja) 1990-05-21 1990-05-21 レーザ加工装置
JP2132204A JPH0832369B2 (ja) 1990-05-21 1990-05-21 レーザ加工装置
JP2173361A JPH0461356A (ja) 1990-06-29 1990-06-29 Ｘｙステージのコントロール回路

Publications (2)

Publication Number Publication Date
DE69112272D1 true DE69112272D1 (de) 1995-09-28
DE69112272T2 DE69112272T2 (de) 1996-02-01

Family

ID=27316455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69112272T Expired - Fee Related DE69112272T2 (de) 1990-05-21 1991-05-16 Verfahren und Gerät zur Laserbearbeitung.

Country Status (4)

Country Link
US (1) US5171963A (de)
EP (1) EP0458199B1 (de)
KR (1) KR930008664B1 (de)
DE (1) DE69112272T2 (de)

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CA2090936C (en) * 1992-03-04 1998-12-01 Tani Electronics Industry Co., Ltd. Visual inspection support system for printed-circuit board
JPH06110069A (ja) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd 電子部品の欠陥修復方法および欠陥修復装置
WO1994014567A1 (en) * 1992-12-18 1994-07-07 Firebird Traders Ltd. Process and apparatus for etching an image within a solid article
US5637244A (en) * 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
JP3399590B2 (ja) * 1993-08-04 2003-04-21 富士通株式会社 配線の切断装置
US5400132A (en) * 1993-10-12 1995-03-21 General Scanning Rectification of a laser pointing device
US5864114A (en) * 1994-03-10 1999-01-26 Toshiharu Ishikawa Coating removal apparatus using coordinate-controlled laser beam
US6163010A (en) * 1996-10-25 2000-12-19 E. I. Du Pont De Nemours And Company Method and apparatus for laser cutting materials
WO1997015417A1 (en) * 1995-10-27 1997-05-01 E.I. Du Pont De Nemours And Company Method and apparatus for laser cutting materials
US5748691A (en) * 1996-03-11 1998-05-05 General Electric Company Apparatus and methods for sealing end plugs for nuclear fuel rods
US6000801A (en) * 1997-05-02 1999-12-14 General Scanning, Inc. Multi-color laser projector for optical layup template and the like
JP4166340B2 (ja) * 1997-09-24 2008-10-15 オリンパス株式会社 基板検査装置
US6671041B2 (en) 1997-09-24 2003-12-30 Olympus Optical Co., Ltd. Apparatus for inspecting a substrate
KR100273659B1 (ko) * 1998-05-08 2000-12-15 김덕중 2차원 테일러드블랭크 용접시스템
TWI286623B (en) * 2000-09-06 2007-09-11 Hannstar Display Corp Process for repairing defect applied in liquid crystal display
KR100495329B1 (ko) * 2002-09-19 2005-06-13 주식회사 서울레이저발형시스템 슬릿 가공용 레이저 가공기
JP4073372B2 (ja) * 2003-07-24 2008-04-09 シャープ株式会社 表示モジュールの検査装置
JP4551071B2 (ja) * 2003-09-19 2010-09-22 オリンパス株式会社 顕微鏡用電動ステージ制御システム、該制御装置、及び該制御方法
US7241981B2 (en) * 2004-03-05 2007-07-10 Lap Laser Llc Systems and methods for displaying images and processing work pieces
JP2005334922A (ja) * 2004-05-26 2005-12-08 Yamazaki Mazak Corp レーザ加工機におけるノズルチェック装置
CN100360998C (zh) * 2004-11-03 2008-01-09 均豪精密工业股份有限公司 面板裂片后缺陷检测装置以及检测方法
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
JP4123271B2 (ja) * 2005-11-28 2008-07-23 船井電機株式会社 液晶モジュール輝度測定装置
JP6199585B2 (ja) * 2013-03-21 2017-09-20 住友化学株式会社 レーザー光照射装置及び光学部材貼合体の製造装置
CN103885216A (zh) * 2014-02-10 2014-06-25 北京京东方显示技术有限公司 一种基板检测装置及方法
CN105364976A (zh) * 2014-08-25 2016-03-02 深圳市韵腾激光科技有限公司 双sd卡切割定位装置及方法
CN104819986B (zh) * 2015-04-01 2018-05-18 广东韦达尔科技有限公司 一种全景式自动修补的银浆线检测机
CN104792801A (zh) * 2015-04-01 2015-07-22 广东韦达尔科技有限公司 一种银浆线的自动检测机
TW201707839A (zh) * 2015-08-24 2017-03-01 Marketech Int Corp 垂直式修補機及其修補方法
CN106583273A (zh) * 2015-10-19 2017-04-26 昆山金群力精密组件有限公司 全自动ccd检测排除设备
CN105892108A (zh) * 2016-04-22 2016-08-24 深圳市卓茂科技有限公司 半自动液晶屏修复机
CN105945422B (zh) * 2016-06-12 2018-01-05 西安中科微精光子制造科技有限公司 一种超快激光微细加工***
CN112534331B (zh) * 2018-04-17 2023-10-31 图腾定位有限责任公司 用于放置部件的设备和方法
CN109141239A (zh) * 2018-08-29 2019-01-04 浙江霖研精密科技有限公司 一种具有多种放大倍率的检测装置
CN109521585A (zh) * 2018-12-28 2019-03-26 深圳眼千里科技有限公司 一种激光修复机
CN109940270A (zh) * 2019-04-08 2019-06-28 西安交通大学 一种七轴五联动超快激光加工***
CN110026676B (zh) * 2019-04-12 2020-12-25 大族激光科技产业集团股份有限公司 激光加工方法
JP7230722B2 (ja) * 2019-07-24 2023-03-01 富士通株式会社 画像処理装置及び画像処理方法
CN110987957A (zh) * 2019-11-04 2020-04-10 江苏大学 基于机器视觉和激光加工的智能化去缺陷方法
CN111589732A (zh) * 2020-05-13 2020-08-28 武汉精立电子技术有限公司 一种笔记本显示屏及外观检测***及方法
JP2023525724A (ja) * 2020-05-14 2023-06-19 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工されたワークピースの指示された検査を容易にするレーザ加工装置及びこれを動作させる方法
CN113399784B (zh) * 2021-07-09 2022-08-12 武汉武重机床有限公司 工件加工控制方法、装置、设备及存储介质

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US5017755A (en) * 1988-10-26 1991-05-21 Kabushiki Kaisha Toshiba Method of repairing liquid crystal display and apparatus using the method
US5059764A (en) * 1988-10-31 1991-10-22 Spectra-Physics, Inc. Diode-pumped, solid state laser-based workstation for precision materials processing and machining
FR2639567B1 (fr) * 1988-11-25 1991-01-25 France Etat Machine a microfaisceau laser d'intervention sur des objets a couche mince, en particulier pour la gravure ou le depot de matiere par voie chimique en presence d'un gaz reactif
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US4943732A (en) * 1989-08-16 1990-07-24 Micrion Corporation Method and apparatus for defect detection and location

Also Published As

Publication number Publication date
KR910019724A (ko) 1991-12-19
EP0458199A3 (en) 1992-09-16
DE69112272T2 (de) 1996-02-01
KR930008664B1 (ko) 1993-09-11
EP0458199B1 (de) 1995-08-23
EP0458199A2 (de) 1991-11-27
US5171963A (en) 1992-12-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, SCHUMACHER, KNAUER, VON HIRSCHHAUSEN, 8033

8339 Ceased/non-payment of the annual fee