DE69016564D1 - Antistatisches Klebeband. - Google Patents

Antistatisches Klebeband.

Info

Publication number
DE69016564D1
DE69016564D1 DE69016564T DE69016564T DE69016564D1 DE 69016564 D1 DE69016564 D1 DE 69016564D1 DE 69016564 T DE69016564 T DE 69016564T DE 69016564 T DE69016564 T DE 69016564T DE 69016564 D1 DE69016564 D1 DE 69016564D1
Authority
DE
Germany
Prior art keywords
layer
adhesive
pathways
containing relatively
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69016564T
Other languages
English (en)
Inventor
Lutz R Weinhold
John D Mcdonough
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WATERFORD RESEARCH AND DEV Ltd
Original Assignee
WATERFORD RESEARCH AND DEV Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WATERFORD RESEARCH AND DEV Ltd filed Critical WATERFORD RESEARCH AND DEV Ltd
Application granted granted Critical
Publication of DE69016564D1 publication Critical patent/DE69016564D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/31—Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
DE69016564T 1989-10-11 1990-10-10 Antistatisches Klebeband. Expired - Lifetime DE69016564D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IE327889A IE67319B1 (en) 1989-10-11 1989-10-11 Antistatic adhesive tape

Publications (1)

Publication Number Publication Date
DE69016564D1 true DE69016564D1 (de) 1995-03-16

Family

ID=11038275

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69016564T Expired - Lifetime DE69016564D1 (de) 1989-10-11 1990-10-10 Antistatisches Klebeband.

Country Status (4)

Country Link
EP (1) EP0422919B1 (de)
AT (1) ATE118028T1 (de)
DE (1) DE69016564D1 (de)
IE (1) IE67319B1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5427835A (en) * 1992-06-04 1995-06-27 Minnesota Mining And Manufacturing Company Sulfopolymer/vanadium oxide antistatic compositions
US5637368A (en) * 1992-06-04 1997-06-10 Minnesota Mining And Manufacturing Company Adhesive tape having antistatic properties
US5378405A (en) * 1993-07-28 1995-01-03 Minnesota Mining And Manufacturing Company Conductive microparticles and pressure-sensitive adhesive tapes made therefrom
US5508107A (en) * 1993-07-28 1996-04-16 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive tapes for electronics applications
US5441809A (en) * 1993-10-28 1995-08-15 Brady U.S.A., Inc. Dissipative cover tape surface mount device packaging
DE4413663A1 (de) * 1994-04-20 1995-10-26 Wifag Maschf Klebemittel zum Verbinden von auf angetriebenen Rollen gewickelten Materialbahnen
US5914186A (en) * 1994-05-06 1999-06-22 Minnesota Mining And Manufacturing Company High temperature resistant antistatic pressure-sensitive adhesive tape
WO1995030720A1 (en) * 1994-05-06 1995-11-16 Minnesota Mining And Manufacturing Company High temperature resistant antistatic pressure-sensitive adhesive tape
US5626774A (en) * 1995-12-11 1997-05-06 Alliedsignal Inc. Solder mask for manufacture of printed circuit boards
US5885708A (en) * 1997-02-14 1999-03-23 Minnesota Mining And Manufacturing Company Antistatic latex adhesives
DE10231065A1 (de) * 2002-03-22 2003-10-23 Tesa Ag Haftklebeband und Verfahren zur Herstellung
US20030180531A1 (en) * 2002-03-22 2003-09-25 Tesa Ag PSA tape and its production
MXPA06010596A (es) * 2005-12-23 2007-06-22 3M Innovative Properties Co Pelicula adhesiva con resistencia a altas temperaturas y baja generacion de electrostatica, construida con un polimero de polieterimida.
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
CN101775259A (zh) 2009-01-09 2010-07-14 3M创新有限公司 一种防静电的耐高温聚酰亚胺胶带
JP5248460B2 (ja) * 2009-10-22 2013-07-31 日東電工株式会社 導電性粘着テープ
CN112969357B (zh) * 2021-02-02 2023-02-07 深圳市欣横纵技术股份有限公司 一种核安保***抗强电磁脉冲加固方法及核安保***

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3146882A (en) * 1961-09-12 1964-09-01 Minnesota Mining & Mfg Pressure-sensitive adhesive tape with antistatic primer coating
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
JPS6312681A (ja) * 1986-07-02 1988-01-20 Sekisui Chem Co Ltd 帯電防止粘着テ−プもしくはシ−ト
AU612771B2 (en) * 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape

Also Published As

Publication number Publication date
EP0422919A2 (de) 1991-04-17
IE893278A1 (en) 1991-04-24
EP0422919A3 (en) 1992-05-27
EP0422919B1 (de) 1995-02-01
IE67319B1 (en) 1996-03-20
ATE118028T1 (de) 1995-02-15

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Legal Events

Date Code Title Description
8332 No legal effect for de