DE68929148D1 - Integrierte Halbleiterschaltung - Google Patents

Integrierte Halbleiterschaltung

Info

Publication number
DE68929148D1
DE68929148D1 DE68929148T DE68929148T DE68929148D1 DE 68929148 D1 DE68929148 D1 DE 68929148D1 DE 68929148 T DE68929148 T DE 68929148T DE 68929148 T DE68929148 T DE 68929148T DE 68929148 D1 DE68929148 D1 DE 68929148D1
Authority
DE
Germany
Prior art keywords
semiconductor circuit
integrated semiconductor
integrated
circuit
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68929148T
Other languages
English (en)
Other versions
DE68929148T2 (de
Inventor
Kazuo Tomizuka
Sakae Sugayama
Takao Saeki
Toshiaki Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63153122A external-priority patent/JPH0638452B2/ja
Priority claimed from JP63173009A external-priority patent/JP2675338B2/ja
Priority claimed from JP63173010A external-priority patent/JPH0666415B2/ja
Priority claimed from JP63173003A external-priority patent/JPH0223659A/ja
Priority claimed from JP63173005A external-priority patent/JPH0648708B2/ja
Priority claimed from JP63173004A external-priority patent/JPH0628285B2/ja
Priority claimed from JP20219688A external-priority patent/JPH0628289B2/ja
Priority claimed from JP63235828A external-priority patent/JPH0719843B2/ja
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of DE68929148D1 publication Critical patent/DE68929148D1/de
Application granted granted Critical
Publication of DE68929148T2 publication Critical patent/DE68929148T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE68929148T 1988-06-21 1989-06-20 Integrierte Halbleiterschaltung Expired - Lifetime DE68929148T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP63153122A JPH0638452B2 (ja) 1988-06-21 1988-06-21 リニア半導体集積回路
JP63173010A JPH0666415B2 (ja) 1988-07-12 1988-07-12 Ｆｍ／ａｍチューナ用半導体集積回路
JP63173003A JPH0223659A (ja) 1988-07-12 1988-07-12 半導体集積回路
JP63173005A JPH0648708B2 (ja) 1988-07-12 1988-07-12 半導体集積回路
JP63173004A JPH0628285B2 (ja) 1988-07-12 1988-07-12 リニア半導体集積回路
JP63173009A JP2675338B2 (ja) 1988-07-12 1988-07-12 半導体集積回路
JP20219688A JPH0628289B2 (ja) 1988-08-12 1988-08-12 半導体集積回路
JP63235828A JPH0719843B2 (ja) 1988-09-20 1988-09-20 半導体集積回路

Publications (2)

Publication Number Publication Date
DE68929148D1 true DE68929148D1 (de) 2000-03-09
DE68929148T2 DE68929148T2 (de) 2000-09-21

Family

ID=27573235

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68929148T Expired - Lifetime DE68929148T2 (de) 1988-06-21 1989-06-20 Integrierte Halbleiterschaltung

Country Status (2)

Country Link
EP (1) EP0347853B1 (de)
DE (1) DE68929148T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3027990B2 (ja) * 1991-03-18 2000-04-04 富士通株式会社 半導体装置の製造方法
US8716834B2 (en) 2004-12-24 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including antenna
US7906424B2 (en) 2007-08-01 2011-03-15 Advanced Micro Devices, Inc. Conductor bump method and apparatus
US8314474B2 (en) 2008-07-25 2012-11-20 Ati Technologies Ulc Under bump metallization for on-die capacitor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492798B1 (de) * 1969-04-16 1974-01-22
JPS5789345A (en) * 1980-11-25 1982-06-03 Hitachi Ltd Semiconductor integrated circuit device
JPS6238046A (ja) * 1985-08-13 1987-02-19 Toshiba Corp 複数ｆｍ信号受信装置
JPS6254950A (ja) * 1985-09-04 1987-03-10 Mitsubishi Electric Corp 半導体集積回路
JPS62293660A (ja) * 1986-06-13 1987-12-21 Hitachi Ltd 半導体集積回路装置

Also Published As

Publication number Publication date
DE68929148T2 (de) 2000-09-21
EP0347853B1 (de) 2000-02-02
EP0347853A3 (de) 1992-04-22
EP0347853A2 (de) 1989-12-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition