DE68922798D1 - Montierverfahren. - Google Patents

Montierverfahren.

Info

Publication number
DE68922798D1
DE68922798D1 DE68922798T DE68922798T DE68922798D1 DE 68922798 D1 DE68922798 D1 DE 68922798D1 DE 68922798 T DE68922798 T DE 68922798T DE 68922798 T DE68922798 T DE 68922798T DE 68922798 D1 DE68922798 D1 DE 68922798D1
Authority
DE
Germany
Prior art keywords
assembly process
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68922798T
Other languages
English (en)
Other versions
DE68922798T2 (de
Inventor
Kazunori Iwamoto
Shunichi Uzawa
Takao Kariya
Ryuichi Ebinuma
Hiroshi Chiba
Shinkichi Ohkawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63192193A external-priority patent/JP2660553B2/ja
Priority claimed from JP63246314A external-priority patent/JP2774527B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE68922798D1 publication Critical patent/DE68922798D1/de
Publication of DE68922798T2 publication Critical patent/DE68922798T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B5/00—Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereof; Compensating for the effects of tilting or acceleration, e.g. for optical apparatus

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE68922798T 1988-08-02 1989-07-31 Montierverfahren. Expired - Fee Related DE68922798T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63192193A JP2660553B2 (ja) 1988-08-02 1988-08-02 機器取付方法
JP63246314A JP2774527B2 (ja) 1988-09-30 1988-09-30 減圧装置

Publications (2)

Publication Number Publication Date
DE68922798D1 true DE68922798D1 (de) 1995-06-29
DE68922798T2 DE68922798T2 (de) 1995-11-16

Family

ID=26507168

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68922798T Expired - Fee Related DE68922798T2 (de) 1988-08-02 1989-07-31 Montierverfahren.

Country Status (3)

Country Link
US (1) US5687947A (de)
EP (1) EP0353980B1 (de)
DE (1) DE68922798T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3200282B2 (ja) * 1993-07-21 2001-08-20 キヤノン株式会社 処理システム及びこれを用いたデバイス製造方法
JP3745167B2 (ja) * 1998-07-29 2006-02-15 キヤノン株式会社 ステージ装置、露光装置およびデバイス製造方法ならびにステージ駆動方法
US6754828B1 (en) * 1999-07-13 2004-06-22 Intel Corporation Algorithm for non-volatile memory updates
US7384228B2 (en) * 2004-05-24 2008-06-10 Asml Netherlands B.V. Insertion device, lithographic apparatus with said insertion device and device manufacturing method
JP5315100B2 (ja) * 2009-03-18 2013-10-16 株式会社ニューフレアテクノロジー 描画装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2565807A (en) * 1939-12-04 1951-08-28 Barr & Stroud Ltd Antivibration supporting arrangement for optical instruments of the telescope type
US4106740A (en) * 1977-03-28 1978-08-15 Westinghouse Electric Corp. Airborne vibration isolated sensor apparatus
US4135688A (en) * 1977-05-26 1979-01-23 Westinghouse Electric Corp. Anti-tilting resilient support system for aimed airborne pod-enclosed sensor instruments
US4185202A (en) * 1977-12-05 1980-01-22 Bell Telephone Laboratories, Incorporated X-ray lithography
JPS595179B2 (ja) * 1979-05-18 1984-02-03 富士通株式会社 真空機器の防振構造
DE3070953D1 (en) * 1979-10-11 1985-09-12 Eaton Optimetrix Inc Improved shock and vibration isolation system
JPS58137633A (ja) * 1982-02-12 1983-08-16 Matsushita Electric Ind Co Ltd 圧縮機の支持装置
ATE30960T1 (de) * 1983-08-09 1987-12-15 Siemens Ag Justier- oder positioniertisch und verfahren zu dessen herstellung.
GB2155201B (en) * 1984-02-24 1988-07-13 Canon Kk An x-ray exposure apparatus
US4803712A (en) * 1987-01-20 1989-02-07 Hitachi, Ltd. X-ray exposure system

Also Published As

Publication number Publication date
DE68922798T2 (de) 1995-11-16
EP0353980A3 (en) 1990-03-28
EP0353980B1 (de) 1995-05-24
US5687947A (en) 1997-11-18
EP0353980A2 (de) 1990-02-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee