DE68921687D1 - Belichtungseinrichtung. - Google Patents
Belichtungseinrichtung.Info
- Publication number
- DE68921687D1 DE68921687D1 DE68921687T DE68921687T DE68921687D1 DE 68921687 D1 DE68921687 D1 DE 68921687D1 DE 68921687 T DE68921687 T DE 68921687T DE 68921687 T DE68921687 T DE 68921687T DE 68921687 D1 DE68921687 D1 DE 68921687D1
- Authority
- DE
- Germany
- Prior art keywords
- exposure device
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63218520A JP2745413B2 (ja) | 1988-09-02 | 1988-09-02 | 露光装置 |
JP1138809A JP2774574B2 (ja) | 1989-05-30 | 1989-05-30 | 露光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68921687D1 true DE68921687D1 (de) | 1995-04-20 |
DE68921687T2 DE68921687T2 (de) | 1995-08-03 |
Family
ID=26471763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68921687T Expired - Fee Related DE68921687T2 (de) | 1988-09-02 | 1989-08-31 | Belichtungseinrichtung. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5063582A (de) |
EP (1) | EP0357423B1 (de) |
DE (1) | DE68921687T2 (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01284793A (ja) * | 1988-05-11 | 1989-11-16 | Canon Inc | 基板支持装置 |
DE68922061T2 (de) * | 1988-10-03 | 1995-08-31 | Canon Kk | Vorrichtung zum Regeln der Temperatur. |
US5231291A (en) * | 1989-08-01 | 1993-07-27 | Canon Kabushiki Kaisha | Wafer table and exposure apparatus with the same |
JP2737010B2 (ja) * | 1989-08-01 | 1998-04-08 | キヤノン株式会社 | 露光装置 |
US5138643A (en) * | 1989-10-02 | 1992-08-11 | Canon Kabushiki Kaisha | Exposure apparatus |
US5001423A (en) * | 1990-01-24 | 1991-03-19 | International Business Machines Corporation | Dry interface thermal chuck temperature control system for semiconductor wafer testing |
JP3168018B2 (ja) * | 1991-03-22 | 2001-05-21 | キヤノン株式会社 | 基板吸着保持方法 |
US5154661A (en) * | 1991-07-10 | 1992-10-13 | Noah Precision, Inc. | Thermal electric cooling system and method |
EP0532236B1 (de) * | 1991-09-07 | 1997-07-16 | Canon Kabushiki Kaisha | System zur Stabilisierung der Formen von optischen Elementen, Belichtungsvorrichtung unter Verwendung dieses Systems und Verfahren zur Herstellung von Halbleitervorrichtungen |
JP3224157B2 (ja) * | 1992-03-31 | 2001-10-29 | キヤノン株式会社 | X線マスクとその製造方法、並びに該x線マスクを用いたデバイス製造方法とx線露光装置 |
US5333035A (en) * | 1992-05-15 | 1994-07-26 | Nikon Corporation | Exposing method |
KR0139039B1 (ko) * | 1993-06-30 | 1998-06-01 | 미타라이 하지메 | 노광장치와 이것을 이용한 디바이스 제조방법 |
JP3210145B2 (ja) | 1993-07-14 | 2001-09-17 | キヤノン株式会社 | 走査型露光装置及び該装置を用いてデバイスを製造する方法 |
US5450726A (en) * | 1993-07-16 | 1995-09-19 | Noah Precision, Inc. | Thermal electric air cooling apparatus and method |
US5696623A (en) * | 1993-08-05 | 1997-12-09 | Fujitsu Limited | UV exposure with elongated service lifetime |
US5593800A (en) * | 1994-01-06 | 1997-01-14 | Canon Kabushiki Kaisha | Mask manufacturing method and apparatus and device manufacturing method using a mask manufactured by the method or apparatus |
EP0715215B1 (de) * | 1994-11-29 | 2001-05-30 | Canon Kabushiki Kaisha | Ausrichtverfahren und Halbleiterbelichtungsverfahren |
US5679502A (en) * | 1995-03-15 | 1997-10-21 | Wisconsin Alumni Research Foundation | Method and apparatus for micromachining using hard X-rays |
JP3391940B2 (ja) * | 1995-06-26 | 2003-03-31 | キヤノン株式会社 | 照明装置及び露光装置 |
JP3487383B2 (ja) * | 1995-07-06 | 2004-01-19 | 株式会社ニコン | 露光装置及びそれを用いる素子製造方法 |
US5877843A (en) * | 1995-09-12 | 1999-03-02 | Nikon Corporation | Exposure apparatus |
US6645701B1 (en) | 1995-11-22 | 2003-11-11 | Nikon Corporation | Exposure method and exposure apparatus |
JP4011643B2 (ja) * | 1996-01-05 | 2007-11-21 | キヤノン株式会社 | 半導体製造装置 |
US5854819A (en) * | 1996-02-07 | 1998-12-29 | Canon Kabushiki Kaisha | Mask supporting device and correction method therefor, and exposure apparatus and device producing method utilizing the same |
TW341719B (en) * | 1996-03-01 | 1998-10-01 | Canon Kk | Surface position detecting method and scanning exposure method using the same |
JP3814359B2 (ja) * | 1996-03-12 | 2006-08-30 | キヤノン株式会社 | X線投影露光装置及びデバイス製造方法 |
JP3695000B2 (ja) * | 1996-08-08 | 2005-09-14 | 株式会社ニコン | 露光方法及び露光装置 |
JP3337921B2 (ja) | 1996-08-23 | 2002-10-28 | キヤノン株式会社 | 投影露光装置および位置合せ方法 |
JP3372782B2 (ja) * | 1996-10-04 | 2003-02-04 | キヤノン株式会社 | 走査ステージ装置および走査型露光装置 |
JP3352354B2 (ja) * | 1997-04-28 | 2002-12-03 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
JPH11307430A (ja) * | 1998-04-23 | 1999-11-05 | Canon Inc | 露光装置およびデバイス製造方法ならびに駆動装置 |
KR100805142B1 (ko) * | 1999-07-16 | 2008-02-21 | 가부시키가이샤 니콘 | 노광방법 및 노광장치 |
US6445439B1 (en) * | 1999-12-27 | 2002-09-03 | Svg Lithography Systems, Inc. | EUV reticle thermal management |
TWI238292B (en) * | 2000-02-10 | 2005-08-21 | Asml Netherlands Bv | Lithographic projection apparatus having a temperature controlled heat shield |
JP3869999B2 (ja) | 2000-03-30 | 2007-01-17 | キヤノン株式会社 | 露光装置および半導体デバイス製造方法 |
US6967177B1 (en) * | 2000-09-27 | 2005-11-22 | Lsi Logic Corporation | Temperature control system |
US6954255B2 (en) * | 2001-06-15 | 2005-10-11 | Canon Kabushiki Kaisha | Exposure apparatus |
DE60232568D1 (de) * | 2001-07-09 | 2009-07-23 | Canon Kk | Belichtungsapparat |
US6934003B2 (en) | 2002-01-07 | 2005-08-23 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
JP4371822B2 (ja) * | 2004-01-06 | 2009-11-25 | キヤノン株式会社 | 露光装置 |
CN1938646B (zh) | 2004-01-20 | 2010-12-15 | 卡尔蔡司Smt股份公司 | 曝光装置和用于投影透镜的测量装置 |
EP3252533B1 (de) | 2004-02-04 | 2019-04-10 | Nikon Corporation | Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung eines artikels |
US8749762B2 (en) * | 2004-05-11 | 2014-06-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7304715B2 (en) | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7656506B2 (en) * | 2004-12-23 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing a substrate handler |
JP2006245157A (ja) * | 2005-03-02 | 2006-09-14 | Canon Inc | 露光方法及び露光装置 |
JP4872916B2 (ja) | 2005-04-18 | 2012-02-08 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
JP4708876B2 (ja) * | 2005-06-21 | 2011-06-22 | キヤノン株式会社 | 液浸露光装置 |
US20070000441A1 (en) * | 2005-07-01 | 2007-01-04 | Applied Materials, Inc. | Scalable uniform thermal plate |
US7746447B2 (en) * | 2005-12-22 | 2010-06-29 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and method of calibrating a lithographic apparatus |
EP1843206B1 (de) * | 2006-04-06 | 2012-09-05 | ASML Netherlands B.V. | Lithografisches Gerät und Verfahren zur Herstellung einer Vorrichtung |
DE102006021797A1 (de) | 2006-05-09 | 2007-11-15 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung mit thermischer Dämpfung |
US7916267B2 (en) * | 2006-08-29 | 2011-03-29 | Asml Netherlands B.V. | Lithographic apparatus, and motor cooling device |
US8767174B2 (en) * | 2010-02-18 | 2014-07-01 | Nikon Corporation | Temperature-controlled holding devices for planar articles |
JP2014086701A (ja) * | 2012-10-26 | 2014-05-12 | Canon Inc | 保持装置、リソグラフィ装置及び物品の製造方法 |
US9541846B2 (en) * | 2013-09-06 | 2017-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Homogeneous thermal equalization with active device |
JP2018531410A (ja) | 2015-10-06 | 2018-10-25 | エーエスエムエル ホールディング エヌ.ブイ. | リソグラフィ装置のオブジェクトを保持するためのチャック及びクランプ、並びにリソグラフィ装置のクランプによって保持されるオブジェクトの温度を制御する方法 |
WO2020242611A1 (en) * | 2019-05-24 | 2020-12-03 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH586464A5 (de) * | 1974-12-06 | 1977-03-31 | Bbc Brown Boveri & Cie | |
US4072188A (en) * | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
DD127137B1 (de) * | 1976-08-17 | 1979-11-28 | Elektromat Veb | Vorrichtung zum kompensieren der waermeeinwirkung an justier- und belichtungseinrichtungen |
US4194233A (en) * | 1978-01-30 | 1980-03-18 | Rockwell International Corporation | Mask apparatus for fine-line lithography |
DE2837353C2 (de) * | 1978-08-26 | 1986-01-02 | Brown, Boveri & Cie Ag, 6800 Mannheim | Kühleinrichtung zur Kühlung verlustwärmeerzeugender elektronischer Leistungshalbleiterbauelemente mit einem Kühlmittelkreislauf |
US4514636A (en) * | 1979-09-14 | 1985-04-30 | Eaton Corporation | Ion treatment apparatus |
US4376581A (en) * | 1979-12-20 | 1983-03-15 | Censor Patent- Und Versuchs-Anstalt | Method of positioning disk-shaped workpieces, preferably semiconductor wafers |
JPS57169244A (en) * | 1981-04-13 | 1982-10-18 | Canon Inc | Temperature controller for mask and wafer |
DD160756A3 (de) * | 1981-04-24 | 1984-02-29 | Gudrun Dietz | Anordnung zur verbesserung fotochemischer umsetzungsprozesse in fotoresistschichten |
US4516253A (en) * | 1983-03-15 | 1985-05-07 | Micronix Partners | Lithography system |
JPS60158626A (ja) * | 1984-01-30 | 1985-08-20 | Canon Inc | 半導体露光装置 |
JPS6119129A (ja) * | 1984-07-05 | 1986-01-28 | Nippon Kogaku Kk <Nikon> | 投影光学装置 |
JPS61160934A (ja) * | 1985-01-10 | 1986-07-21 | Canon Inc | 投影光学装置 |
US4843563A (en) * | 1985-03-25 | 1989-06-27 | Canon Kabushiki Kaisha | Step-and-repeat alignment and exposure method and apparatus |
-
1989
- 1989-08-31 DE DE68921687T patent/DE68921687T2/de not_active Expired - Fee Related
- 1989-08-31 EP EP89308821A patent/EP0357423B1/de not_active Expired - Lifetime
-
1991
- 1991-02-20 US US07/658,434 patent/US5063582A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0357423B1 (de) | 1995-03-15 |
EP0357423A2 (de) | 1990-03-07 |
DE68921687T2 (de) | 1995-08-03 |
US5063582A (en) | 1991-11-05 |
EP0357423A3 (de) | 1991-02-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8381 | Inventor (new situation) |
Free format text: MORI, TETSUZO, ATSUGI-SHI KANAGAWA-KEN, JP SAKAMOTO, EIJI, UTSUNOMIYA-SHI TOCHIGI-KEN, JP HARA, SHINICHI, SAITAMA-KEN, JP UDA, KOJI, YOKOHAMA-SHI KANAGAWA-KEN, JP SHIMODA, ISAMU, ZAMA-SHI KANAGAWA-KEN, JP UZAWA, SHINICHI, TOKYO, JP OZAWA, KUNITAKA, UTSUNOMIYA-SHI TOCHIGI-KEN, JP |
|
8339 | Ceased/non-payment of the annual fee |