DE68913318D1 - Elastomerische Verbinder für elektronische Bausteine und für Prüfungen. - Google Patents

Elastomerische Verbinder für elektronische Bausteine und für Prüfungen.

Info

Publication number
DE68913318D1
DE68913318D1 DE89480017T DE68913318T DE68913318D1 DE 68913318 D1 DE68913318 D1 DE 68913318D1 DE 89480017 T DE89480017 T DE 89480017T DE 68913318 T DE68913318 T DE 68913318T DE 68913318 D1 DE68913318 D1 DE 68913318D1
Authority
DE
Germany
Prior art keywords
tests
electronic components
elastomeric connectors
elastomeric
connectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89480017T
Other languages
English (en)
Other versions
DE68913318T2 (de
Inventor
Liang-Choo Hsia
Thomas Page Mcandrew
Fred Edward Stuebner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68913318D1 publication Critical patent/DE68913318D1/de
Publication of DE68913318T2 publication Critical patent/DE68913318T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE68913318T 1988-03-11 1989-01-31 Elastomerische Verbinder für elektronische Bausteine und für Prüfungen. Expired - Fee Related DE68913318T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16721388A 1988-03-11 1988-03-11

Publications (2)

Publication Number Publication Date
DE68913318D1 true DE68913318D1 (de) 1994-04-07
DE68913318T2 DE68913318T2 (de) 1994-09-15

Family

ID=22606420

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68913318T Expired - Fee Related DE68913318T2 (de) 1988-03-11 1989-01-31 Elastomerische Verbinder für elektronische Bausteine und für Prüfungen.

Country Status (4)

Country Link
US (1) US4932883A (de)
EP (1) EP0332560B1 (de)
JP (1) JPH0610999B2 (de)
DE (1) DE68913318T2 (de)

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US5259781A (en) * 1992-11-18 1993-11-09 International Business Machines Corporation Electrical connector alignment and actuation assembly
US5442852A (en) * 1993-10-26 1995-08-22 Pacific Microelectronics Corporation Method of fabricating solder ball array
US5434452A (en) * 1993-11-01 1995-07-18 Motorola, Inc. Z-axis compliant mechanical IC wiring substrate and method for making the same
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
US5563470A (en) * 1994-08-31 1996-10-08 Cornell Research Foundation, Inc. Tiled panel display assembly
US6028364A (en) * 1994-09-20 2000-02-22 Hitachi, Ltd. Semiconductor device having a stress relieving mechanism
AU5937096A (en) * 1995-07-07 1997-02-10 Minnesota Mining And Manufacturing Company Separable electrical connector assembly having a planar array of conductive protrusions
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6403226B1 (en) 1996-05-17 2002-06-11 3M Innovative Properties Company Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
US5874319A (en) * 1996-05-21 1999-02-23 Honeywell Inc. Vacuum die bond for known good die assembly
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US6018584A (en) * 1996-11-06 2000-01-25 Motorola, Inc. Electronic component assembly for an electronic device and method of assembling the same
US5966022A (en) * 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Wafer level burn-in system
US5909123A (en) * 1996-11-08 1999-06-01 W. L. Gore & Associates, Inc. Method for performing reliability screening and burn-in of semi-conductor wafers
JP4085186B2 (ja) * 1997-10-17 2008-05-14 モレックス インコーポレーテッド Ｂｇａソケット
DE19752834A1 (de) * 1997-11-28 1999-06-02 Bosch Gmbh Robert Kraftstoffeinspritzeinrichtung für Brennkraftmaschinen
JPH11329648A (ja) * 1998-05-19 1999-11-30 Molex Inc Ｉｃデバイスソケット
US6027346A (en) * 1998-06-29 2000-02-22 Xandex, Inc. Membrane-supported contactor for semiconductor test
US6227901B1 (en) 1998-07-10 2001-05-08 Thomas & Betts International, Inc. Motor boot for a circuit board
US6595408B1 (en) * 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
US6268275B1 (en) * 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US6559388B1 (en) 1999-06-08 2003-05-06 International Business Machines Corporation Strain relief for substrates having a low coefficient of thermal expansion
US6628136B2 (en) * 1999-09-02 2003-09-30 Micron Technology, Inc. Method and apparatus for testing a semiconductor package
US6734688B1 (en) 2000-05-15 2004-05-11 Teradyne, Inc. Low compliance tester interface
DE10028184A1 (de) * 2000-06-09 2002-03-07 Hirschmann Austria Gmbh Rankwe Vorrichtung zum Verbindung von elektrischen Leitern
US6570396B1 (en) 2000-11-24 2003-05-27 Kulicke & Soffa Investment, Inc. Interface structure for contacting probe beams
TW525273B (en) * 2002-02-07 2003-03-21 Via Tech Inc Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof
US7503768B2 (en) * 2003-11-05 2009-03-17 Tensolite Company High frequency connector assembly
US7074047B2 (en) * 2003-11-05 2006-07-11 Tensolite Company Zero insertion force high frequency connector
US7404718B2 (en) * 2003-11-05 2008-07-29 Tensolite Company High frequency connector assembly
KR100674440B1 (ko) * 2005-08-12 2007-01-25 주식회사 파이컴 프로브 카드 제조 방법 및 장치
US7452214B2 (en) * 2006-12-08 2008-11-18 Verigy (Singapore) Pte. Ltd. Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads
US8092246B1 (en) 2008-04-18 2012-01-10 Lockheed Martin Corporation Self-locking micro-D connector
TWI368743B (en) * 2008-11-04 2012-07-21 King Yuan Electronics Co Ltd Probe card assembly and probes therein
DE102009028391A1 (de) * 2009-08-10 2011-02-17 Robert Bosch Gmbh Verbindungsvorrichtung
JP5943742B2 (ja) * 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
TWI490508B (zh) * 2012-12-17 2015-07-01 Princo Corp 軟性測試裝置及其測試方法
TWI680847B (zh) 2016-02-24 2020-01-01 荷蘭商耐克創新有限合夥公司 真空輔助切割工具，使用其的焊接系統以及使用真空輔助切割工具進行製造的方法
US10120020B2 (en) 2016-06-16 2018-11-06 Formfactor Beaverton, Inc. Probe head assemblies and probe systems for testing integrated circuit devices
JP2018067483A (ja) * 2016-10-20 2018-04-26 ヤマハ株式会社 異方導電性シート、電気検査ヘッド、電気検査装置及び異方導電性シートの製造方法
EP3659055A4 (de) 2017-07-24 2021-04-28 Cerebras Systems Inc. Vorrichtung und verfahren für mehrchip-verbindung
US10468369B2 (en) 2017-07-24 2019-11-05 Cerebras Systems Inc. Apparatus and method for securing substrates with varying coefficients of thermal expansion
US10242891B2 (en) 2017-08-24 2019-03-26 Cerebras Systems Inc. Apparatus and method for securing components of an integrated circuit
US10840216B2 (en) 2019-03-05 2020-11-17 Cerebras Systems Inc. Systems and methods for powering an integrated circuit having multiple interconnected die
US11145530B2 (en) 2019-11-08 2021-10-12 Cerebras Systems Inc. System and method for alignment of an integrated circuit
US20240036102A1 (en) * 2020-12-11 2024-02-01 Mitsui Chemicals, Inc. Anisotropic conductive sheet and electrical inspection method

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US3683105A (en) * 1970-10-13 1972-08-08 Westinghouse Electric Corp Microcircuit modular package
US3904934A (en) * 1973-03-26 1975-09-09 Massachusetts Inst Technology Interconnection of planar electronic structures
US3967162A (en) * 1974-07-24 1976-06-29 Amp Incorporated Interconnection of oppositely disposed circuit devices
US4008300A (en) * 1974-10-15 1977-02-15 A & P Products Incorporated Multi-conductor element and method of making same
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US4003621A (en) * 1975-06-16 1977-01-18 Technical Wire Products, Inc. Electrical connector employing conductive rectilinear elements
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
JPS5555985U (de) * 1978-10-12 1980-04-16
US4249302A (en) * 1978-12-28 1981-02-10 Ncr Corporation Multilayer printed circuit board
JPS568081U (de) * 1979-06-29 1981-01-23
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
US4373778A (en) * 1980-12-30 1983-02-15 International Business Machines Corporation Connector implemented with fiber optic means and site therein for integrated circuit chips
US4548451A (en) * 1984-04-27 1985-10-22 International Business Machines Corporation Pinless connector interposer and method for making the same
JPS6139468A (ja) * 1984-07-31 1986-02-25 日本黒鉛工業株式会社 可撓性スルホ−ル両面ヒ−トシ−ルコネクタ及びその製造方法
JPS61133586A (ja) * 1984-11-30 1986-06-20 信越ポリマ−株式会社 コネクタ−
US4778950A (en) * 1985-07-22 1988-10-18 Digital Equipment Corporation Anisotropic elastomeric interconnecting system
JPS6230367U (de) * 1985-08-07 1987-02-24

Also Published As

Publication number Publication date
US4932883A (en) 1990-06-12
JPH01255176A (ja) 1989-10-12
DE68913318T2 (de) 1994-09-15
JPH0610999B2 (ja) 1994-02-09
EP0332560B1 (de) 1994-03-02
EP0332560A3 (en) 1990-05-02
EP0332560A2 (de) 1989-09-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee