DE68913318D1 - Elastomerische Verbinder für elektronische Bausteine und für Prüfungen. - Google Patents
Elastomerische Verbinder für elektronische Bausteine und für Prüfungen.Info
- Publication number
- DE68913318D1 DE68913318D1 DE89480017T DE68913318T DE68913318D1 DE 68913318 D1 DE68913318 D1 DE 68913318D1 DE 89480017 T DE89480017 T DE 89480017T DE 68913318 T DE68913318 T DE 68913318T DE 68913318 D1 DE68913318 D1 DE 68913318D1
- Authority
- DE
- Germany
- Prior art keywords
- tests
- electronic components
- elastomeric connectors
- elastomeric
- connectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Wire Bonding (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16721388A | 1988-03-11 | 1988-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68913318D1 true DE68913318D1 (de) | 1994-04-07 |
DE68913318T2 DE68913318T2 (de) | 1994-09-15 |
Family
ID=22606420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68913318T Expired - Fee Related DE68913318T2 (de) | 1988-03-11 | 1989-01-31 | Elastomerische Verbinder für elektronische Bausteine und für Prüfungen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4932883A (de) |
EP (1) | EP0332560B1 (de) |
JP (1) | JPH0610999B2 (de) |
DE (1) | DE68913318T2 (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5245751A (en) | 1990-04-27 | 1993-09-21 | Circuit Components, Incorporated | Array connector |
US5071359A (en) | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5336649A (en) * | 1991-06-04 | 1994-08-09 | Micron Technology, Inc. | Removable adhesives for attachment of semiconductor dies |
US5342807A (en) * | 1991-06-04 | 1994-08-30 | Micron Technology, Inc. | Soft bond for semiconductor dies |
US5259781A (en) * | 1992-11-18 | 1993-11-09 | International Business Machines Corporation | Electrical connector alignment and actuation assembly |
US5442852A (en) * | 1993-10-26 | 1995-08-22 | Pacific Microelectronics Corporation | Method of fabricating solder ball array |
US5434452A (en) * | 1993-11-01 | 1995-07-18 | Motorola, Inc. | Z-axis compliant mechanical IC wiring substrate and method for making the same |
US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US6741085B1 (en) * | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US5800184A (en) * | 1994-03-08 | 1998-09-01 | International Business Machines Corporation | High density electrical interconnect apparatus and method |
US5563470A (en) * | 1994-08-31 | 1996-10-08 | Cornell Research Foundation, Inc. | Tiled panel display assembly |
US6028364A (en) * | 1994-09-20 | 2000-02-22 | Hitachi, Ltd. | Semiconductor device having a stress relieving mechanism |
AU5937096A (en) * | 1995-07-07 | 1997-02-10 | Minnesota Mining And Manufacturing Company | Separable electrical connector assembly having a planar array of conductive protrusions |
US5691041A (en) * | 1995-09-29 | 1997-11-25 | International Business Machines Corporation | Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer |
US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
US5874319A (en) * | 1996-05-21 | 1999-02-23 | Honeywell Inc. | Vacuum die bond for known good die assembly |
SG71046A1 (en) | 1996-10-10 | 2000-03-21 | Connector Systems Tech Nv | High density connector and method of manufacture |
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
US6018584A (en) * | 1996-11-06 | 2000-01-25 | Motorola, Inc. | Electronic component assembly for an electronic device and method of assembling the same |
US5966022A (en) * | 1996-11-08 | 1999-10-12 | W. L. Gore & Associates, Inc. | Wafer level burn-in system |
US5909123A (en) * | 1996-11-08 | 1999-06-01 | W. L. Gore & Associates, Inc. | Method for performing reliability screening and burn-in of semi-conductor wafers |
JP4085186B2 (ja) * | 1997-10-17 | 2008-05-14 | モレックス インコーポレーテッド | Bgaソケット |
DE19752834A1 (de) * | 1997-11-28 | 1999-06-02 | Bosch Gmbh Robert | Kraftstoffeinspritzeinrichtung für Brennkraftmaschinen |
JPH11329648A (ja) * | 1998-05-19 | 1999-11-30 | Molex Inc | Icデバイスソケット |
US6027346A (en) * | 1998-06-29 | 2000-02-22 | Xandex, Inc. | Membrane-supported contactor for semiconductor test |
US6227901B1 (en) | 1998-07-10 | 2001-05-08 | Thomas & Betts International, Inc. | Motor boot for a circuit board |
US6595408B1 (en) * | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
US6268275B1 (en) * | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
US6137297A (en) * | 1999-01-06 | 2000-10-24 | Vertest Systemsn Corp. | Electronic test probe interface assembly and method of manufacture |
US6559388B1 (en) | 1999-06-08 | 2003-05-06 | International Business Machines Corporation | Strain relief for substrates having a low coefficient of thermal expansion |
US6628136B2 (en) * | 1999-09-02 | 2003-09-30 | Micron Technology, Inc. | Method and apparatus for testing a semiconductor package |
US6734688B1 (en) | 2000-05-15 | 2004-05-11 | Teradyne, Inc. | Low compliance tester interface |
DE10028184A1 (de) * | 2000-06-09 | 2002-03-07 | Hirschmann Austria Gmbh Rankwe | Vorrichtung zum Verbindung von elektrischen Leitern |
US6570396B1 (en) | 2000-11-24 | 2003-05-27 | Kulicke & Soffa Investment, Inc. | Interface structure for contacting probe beams |
TW525273B (en) * | 2002-02-07 | 2003-03-21 | Via Tech Inc | Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof |
US7503768B2 (en) * | 2003-11-05 | 2009-03-17 | Tensolite Company | High frequency connector assembly |
US7074047B2 (en) * | 2003-11-05 | 2006-07-11 | Tensolite Company | Zero insertion force high frequency connector |
US7404718B2 (en) * | 2003-11-05 | 2008-07-29 | Tensolite Company | High frequency connector assembly |
KR100674440B1 (ko) * | 2005-08-12 | 2007-01-25 | 주식회사 파이컴 | 프로브 카드 제조 방법 및 장치 |
US7452214B2 (en) * | 2006-12-08 | 2008-11-18 | Verigy (Singapore) Pte. Ltd. | Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads |
US8092246B1 (en) | 2008-04-18 | 2012-01-10 | Lockheed Martin Corporation | Self-locking micro-D connector |
TWI368743B (en) * | 2008-11-04 | 2012-07-21 | King Yuan Electronics Co Ltd | Probe card assembly and probes therein |
DE102009028391A1 (de) * | 2009-08-10 | 2011-02-17 | Robert Bosch Gmbh | Verbindungsvorrichtung |
JP5943742B2 (ja) * | 2012-07-04 | 2016-07-05 | 三菱電機株式会社 | 半導体試験治具およびそれを用いた半導体試験方法 |
TWI490508B (zh) * | 2012-12-17 | 2015-07-01 | Princo Corp | 軟性測試裝置及其測試方法 |
TWI680847B (zh) | 2016-02-24 | 2020-01-01 | 荷蘭商耐克創新有限合夥公司 | 真空輔助切割工具,使用其的焊接系統以及使用真空輔助切割工具進行製造的方法 |
US10120020B2 (en) | 2016-06-16 | 2018-11-06 | Formfactor Beaverton, Inc. | Probe head assemblies and probe systems for testing integrated circuit devices |
JP2018067483A (ja) * | 2016-10-20 | 2018-04-26 | ヤマハ株式会社 | 異方導電性シート、電気検査ヘッド、電気検査装置及び異方導電性シートの製造方法 |
EP3659055A4 (de) | 2017-07-24 | 2021-04-28 | Cerebras Systems Inc. | Vorrichtung und verfahren für mehrchip-verbindung |
US10468369B2 (en) | 2017-07-24 | 2019-11-05 | Cerebras Systems Inc. | Apparatus and method for securing substrates with varying coefficients of thermal expansion |
US10242891B2 (en) | 2017-08-24 | 2019-03-26 | Cerebras Systems Inc. | Apparatus and method for securing components of an integrated circuit |
US10840216B2 (en) | 2019-03-05 | 2020-11-17 | Cerebras Systems Inc. | Systems and methods for powering an integrated circuit having multiple interconnected die |
US11145530B2 (en) | 2019-11-08 | 2021-10-12 | Cerebras Systems Inc. | System and method for alignment of an integrated circuit |
US20240036102A1 (en) * | 2020-12-11 | 2024-02-01 | Mitsui Chemicals, Inc. | Anisotropic conductive sheet and electrical inspection method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3683105A (en) * | 1970-10-13 | 1972-08-08 | Westinghouse Electric Corp | Microcircuit modular package |
US3904934A (en) * | 1973-03-26 | 1975-09-09 | Massachusetts Inst Technology | Interconnection of planar electronic structures |
US3967162A (en) * | 1974-07-24 | 1976-06-29 | Amp Incorporated | Interconnection of oppositely disposed circuit devices |
US4008300A (en) * | 1974-10-15 | 1977-02-15 | A & P Products Incorporated | Multi-conductor element and method of making same |
US4038599A (en) * | 1974-12-30 | 1977-07-26 | International Business Machines Corporation | High density wafer contacting and test system |
US4003621A (en) * | 1975-06-16 | 1977-01-18 | Technical Wire Products, Inc. | Electrical connector employing conductive rectilinear elements |
US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
JPS5555985U (de) * | 1978-10-12 | 1980-04-16 | ||
US4249302A (en) * | 1978-12-28 | 1981-02-10 | Ncr Corporation | Multilayer printed circuit board |
JPS568081U (de) * | 1979-06-29 | 1981-01-23 | ||
US4443756A (en) * | 1980-11-25 | 1984-04-17 | Lightbody James D | Apparatus and method for testing circuit boards |
US4373778A (en) * | 1980-12-30 | 1983-02-15 | International Business Machines Corporation | Connector implemented with fiber optic means and site therein for integrated circuit chips |
US4548451A (en) * | 1984-04-27 | 1985-10-22 | International Business Machines Corporation | Pinless connector interposer and method for making the same |
JPS6139468A (ja) * | 1984-07-31 | 1986-02-25 | 日本黒鉛工業株式会社 | 可撓性スルホ−ル両面ヒ−トシ−ルコネクタ及びその製造方法 |
JPS61133586A (ja) * | 1984-11-30 | 1986-06-20 | 信越ポリマ−株式会社 | コネクタ− |
US4778950A (en) * | 1985-07-22 | 1988-10-18 | Digital Equipment Corporation | Anisotropic elastomeric interconnecting system |
JPS6230367U (de) * | 1985-08-07 | 1987-02-24 |
-
1989
- 1989-01-31 DE DE68913318T patent/DE68913318T2/de not_active Expired - Fee Related
- 1989-01-31 EP EP89480017A patent/EP0332560B1/de not_active Expired - Lifetime
- 1989-02-20 JP JP1038542A patent/JPH0610999B2/ja not_active Expired - Lifetime
- 1989-07-20 US US07/384,089 patent/US4932883A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4932883A (en) | 1990-06-12 |
JPH01255176A (ja) | 1989-10-12 |
DE68913318T2 (de) | 1994-09-15 |
JPH0610999B2 (ja) | 1994-02-09 |
EP0332560B1 (de) | 1994-03-02 |
EP0332560A3 (en) | 1990-05-02 |
EP0332560A2 (de) | 1989-09-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |