DE68925403D1 - Kühlungsstruktur für elektronische Bauelemente - Google Patents
Kühlungsstruktur für elektronische BauelementeInfo
- Publication number
- DE68925403D1 DE68925403D1 DE68925403T DE68925403T DE68925403D1 DE 68925403 D1 DE68925403 D1 DE 68925403D1 DE 68925403 T DE68925403 T DE 68925403T DE 68925403 T DE68925403 T DE 68925403T DE 68925403 D1 DE68925403 D1 DE 68925403D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- cooling structure
- cooling
- electronic
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63237026A JP2615909B2 (ja) | 1988-09-20 | 1988-09-20 | Lsiケースの冷却構造 |
JP63322333A JPH02166755A (ja) | 1988-12-21 | 1988-12-21 | 伝熱シート |
JP1019003A JPH07114247B2 (ja) | 1989-01-26 | 1989-01-26 | Lsiケースの冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68925403D1 true DE68925403D1 (de) | 1996-02-22 |
DE68925403T2 DE68925403T2 (de) | 1996-05-30 |
Family
ID=27282454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68925403T Expired - Fee Related DE68925403T2 (de) | 1988-09-20 | 1989-09-19 | Kühlungsstruktur für elektronische Bauelemente |
Country Status (4)
Country | Link |
---|---|
US (1) | US5014777A (de) |
EP (1) | EP0363687B1 (de) |
CA (1) | CA1304830C (de) |
DE (1) | DE68925403T2 (de) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
DE4019091A1 (de) * | 1990-06-15 | 1991-12-19 | Battelle Institut E V | Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung |
US5132875A (en) * | 1990-10-29 | 1992-07-21 | Compaq Computer Corporation | Removable protective heat sink for electronic components |
DE4111247C3 (de) * | 1991-04-08 | 1996-11-21 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US6152377A (en) * | 1992-06-30 | 2000-11-28 | Fiedrich; Joachim | Radiant floor and wall hydronic heating system tubing attachment to radiant plate |
JP3067399B2 (ja) * | 1992-07-03 | 2000-07-17 | 株式会社日立製作所 | 半導体冷却装置 |
JP3003452B2 (ja) * | 1993-04-08 | 2000-01-31 | 富士電機株式会社 | 二つの導体の導通接触構造 |
DE4339786C5 (de) * | 1993-11-18 | 2004-02-05 | Emi-Tec Elektronische Materialien Gmbh | Verfahren zur Herstellung einer Anordung zur Wärmeableitung |
US5881453A (en) * | 1994-05-17 | 1999-03-16 | Tandem Computers, Incorporated | Method for mounting surface mount devices to a circuit board |
US5662163A (en) * | 1995-11-29 | 1997-09-02 | Silicon Graphics, Inc. | Readily removable heat sink assembly |
US5831824A (en) * | 1996-01-31 | 1998-11-03 | Motorola, Inc. | Apparatus for spray-cooling multiple electronic modules |
US5675473A (en) * | 1996-02-23 | 1997-10-07 | Motorola, Inc. | Apparatus and method for shielding an electronic module from electromagnetic radiation |
US5802707A (en) * | 1996-03-28 | 1998-09-08 | Intel Corporation | Controlled bondline thickness attachment mechanism |
US5687577A (en) * | 1996-04-10 | 1997-11-18 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
US5718117A (en) * | 1996-04-10 | 1998-02-17 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
EP0805618B1 (de) * | 1996-04-30 | 2002-01-23 | Denki Kagaku Kogyo Kabushiki Kaisha | Wärmeableitende Abstandhalter für elektronische Einrichtungen |
US5731542A (en) * | 1996-05-23 | 1998-03-24 | Motorola, Inc. | Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate |
US6037659A (en) * | 1997-04-28 | 2000-03-14 | Hewlett-Packard Company | Composite thermal interface pad |
US6284363B1 (en) | 1998-03-23 | 2001-09-04 | Fuji Polymer Industries Co., Ltd. | Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same |
US6037660A (en) * | 1998-05-06 | 2000-03-14 | Liu; Yen-Wen | Device for securing a finned radiating structure to a computer chip |
KR100310099B1 (ko) | 1998-08-20 | 2001-12-17 | 윤종용 | 반도체집적회로장치용방열장치및그것을구비하는휴대용컴퓨터 |
DE19924289A1 (de) * | 1999-05-27 | 2000-12-07 | Siemens Ag | Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper |
JP2001085877A (ja) * | 1999-09-10 | 2001-03-30 | Furukawa Electric Co Ltd:The | 突起部を有する受熱面を備えたヒートシンク |
US6496373B1 (en) | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
CN100375276C (zh) * | 2002-06-06 | 2008-03-12 | 富士高分子工业株式会社 | 导热片材及其制造方法 |
US20060238984A1 (en) * | 2005-04-20 | 2006-10-26 | Belady Christian L | Thermal dissipation device with thermal compound recesses |
US9179579B2 (en) * | 2006-06-08 | 2015-11-03 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
CN100580362C (zh) * | 2006-12-29 | 2010-01-13 | 财团法人工业技术研究院 | 改良型热导管散热*** |
US7961469B2 (en) * | 2009-03-31 | 2011-06-14 | Apple Inc. | Method and apparatus for distributing a thermal interface material |
JP6226724B2 (ja) * | 2012-12-21 | 2017-11-08 | ポリプラスチックス株式会社 | 複合成形体の製造方法及び放熱性を向上させる方法 |
JP6398708B2 (ja) * | 2014-12-26 | 2018-10-03 | 株式会社デンソー | 電子装置、及びそれを用いた駆動装置 |
RU173874U1 (ru) * | 2016-08-05 | 2017-09-15 | Егор Александрович Колмаков | Термостатированный корпус для измерительных приборов |
US11911790B2 (en) | 2022-02-25 | 2024-02-27 | Saudi Arabian Oil Company | Applying corrosion inhibitor within tubulars |
Family Cites Families (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2357706A (en) * | 1942-06-29 | 1944-09-05 | Rca Corp | Heating and cooling system |
NL198115A (de) * | 1954-06-22 | |||
US2999034A (en) * | 1960-10-21 | 1961-09-05 | Wenczler & Heidenhain | Method of manufacture of line plates, scales, and the like |
US3205469A (en) * | 1961-07-12 | 1965-09-07 | Gen Precision Inc | Pin board |
US3211969A (en) * | 1961-11-15 | 1965-10-12 | Westinghouse Electric Corp | High voltage rectifier |
US3651865A (en) * | 1970-08-21 | 1972-03-28 | Us Air Force | Cooled electronic equipment mounting plate |
US3694182A (en) * | 1971-04-20 | 1972-09-26 | Ford Motor Co | Glass tempering die construction |
US3777220A (en) * | 1972-06-30 | 1973-12-04 | Ibm | Circuit panel and method of construction |
US3881181A (en) * | 1973-02-22 | 1975-04-29 | Rca Corp | Semiconductor temperature sensor |
US3827457A (en) * | 1973-06-22 | 1974-08-06 | Westinghouse Air Brake Co | Fluid pressure system for converting digital signals to analog signals |
US3912001A (en) * | 1974-03-11 | 1975-10-14 | Gen Electric | Water cooled heat sink assembly |
US3908188A (en) * | 1974-08-14 | 1975-09-23 | Us Air Force | Heat sink for microstrip circuit |
SU572951A1 (ru) * | 1974-10-24 | 1977-09-15 | Предприятие П/Я А-3162 | Устройство дл охлаждени элементов радиоаппаратуры |
US4110549A (en) * | 1974-11-30 | 1978-08-29 | Robert Bosch Gmbh | Environmentally protected electronic housing and heat sink structure, particularly for automotive use |
US4072188A (en) * | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
US4204246A (en) * | 1976-02-14 | 1980-05-20 | Sony Corporation | Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block |
US4037270A (en) * | 1976-05-24 | 1977-07-19 | Control Data Corporation | Circuit packaging and cooling |
US4093971A (en) * | 1976-12-10 | 1978-06-06 | Burroughs Corporation | D-I-P On island |
US4115836A (en) * | 1977-04-25 | 1978-09-19 | Burroughs Corporation | Cooling system for dual-in-line packages |
JPS6011830B2 (ja) * | 1977-05-24 | 1985-03-28 | 日本電気株式会社 | 電子部品の冷却装置 |
US4151547A (en) * | 1977-09-07 | 1979-04-24 | General Electric Company | Arrangement for heat transfer between a heat source and a heat sink |
US4196775A (en) * | 1977-09-19 | 1980-04-08 | The Unites States Of America As Represented By The Secretary Of The Navy | Shock-mounted, liquid cooled cold plate assembly |
JPS5586130A (en) * | 1978-12-25 | 1980-06-28 | Hitachi Ltd | Connection of semiconductor element |
US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
US4282924A (en) * | 1979-03-16 | 1981-08-11 | Varian Associates, Inc. | Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface |
US4245273A (en) * | 1979-06-29 | 1981-01-13 | International Business Machines Corporation | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
JPS5612760A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Multi chip lsi package |
JPS5670655A (en) * | 1979-11-15 | 1981-06-12 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit mounting device |
US4588023A (en) * | 1980-06-16 | 1986-05-13 | Showa Aluminum Corporation | Device for releasing heat |
JPS57106062A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Package for integrated circuit |
FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
IT1218271B (it) * | 1981-04-13 | 1990-04-12 | Ates Componenti Elettron | Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento |
US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
JPS57211761A (en) * | 1981-06-23 | 1982-12-25 | Nec Corp | Semiconductor device |
JPS58114445A (ja) * | 1981-12-28 | 1983-07-07 | Fujitsu Ltd | 液冷モジユ−ル |
DE3215192A1 (de) * | 1982-04-23 | 1983-10-27 | Siemens AG, 1000 Berlin und 8000 München | Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente |
US4468717A (en) * | 1982-06-09 | 1984-08-28 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
US4493010A (en) * | 1982-11-05 | 1985-01-08 | Lockheed Corporation | Electronic packaging module utilizing phase-change conductive cooling |
US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
JPS59130450A (ja) * | 1983-01-17 | 1984-07-27 | Nec Corp | Icパツケ−ジの冷却構造 |
GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
JPS59155156A (ja) * | 1983-02-24 | 1984-09-04 | Toshiba Corp | Icモジユ−ル |
US4536824A (en) * | 1983-03-28 | 1985-08-20 | Goodyear Aerospace Corporation | Indirect cooling of electronic circuits |
EP0120500B1 (de) * | 1983-03-29 | 1989-08-16 | Nec Corporation | LSI Verpackung hoher Dichte für logische Schaltungen |
US4535385A (en) * | 1983-04-22 | 1985-08-13 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
US4602678A (en) * | 1983-09-02 | 1986-07-29 | The Bergquist Company | Interfacing of heat sinks with electrical devices, and the like |
JPH0673364B2 (ja) * | 1983-10-28 | 1994-09-14 | 株式会社日立製作所 | 集積回路チップ冷却装置 |
US4546410A (en) * | 1983-10-31 | 1985-10-08 | Kaufman Lance R | Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink |
JPS60145647A (ja) * | 1984-01-10 | 1985-08-01 | Fujitsu Ltd | 発熱体モジユ−ルの放熱取付方法 |
JPS60160150A (ja) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | 集積回路の冷却装置 |
US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
JPS60257156A (ja) * | 1984-06-01 | 1985-12-18 | Hitachi Ltd | 熱伝導冷却モジユ−ル装置 |
US4666545A (en) * | 1984-06-27 | 1987-05-19 | The Bergquist Company | Method of making a mounting base pad for semiconductor devices |
US4628990A (en) * | 1984-08-17 | 1986-12-16 | Nec Corporation | Cooling equipment for an integrated circuit chip |
JPS61168946A (ja) * | 1985-01-23 | 1986-07-30 | Hitachi Ltd | 半導体チツプの冷却装置 |
JPS61171157A (ja) * | 1985-01-25 | 1986-08-01 | Nec Corp | 集積回路パツケ−ジ |
JPS61189658A (ja) * | 1985-02-18 | 1986-08-23 | Fuji Photo Film Co Ltd | 半導体素子温度制御装置 |
JPS61189657A (ja) * | 1985-02-18 | 1986-08-23 | Fuji Photo Film Co Ltd | 半導体素子温度制御装置 |
JPH06101523B2 (ja) * | 1985-03-04 | 1994-12-12 | 株式会社日立製作所 | 集積回路チツプ冷却装置 |
JPS61222242A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 冷却装置 |
JPS61226946A (ja) * | 1985-04-01 | 1986-10-08 | Hitachi Ltd | 集積回路チツプ冷却装置 |
FR2580060B1 (de) * | 1985-04-05 | 1989-06-09 | Nec Corp | |
US4602125A (en) * | 1985-05-10 | 1986-07-22 | The Bergquist Company | Mounting pad with tubular projections for solid-state devices |
JPS61276242A (ja) * | 1985-05-30 | 1986-12-06 | Hitachi Ltd | 半導体モジユ−ル |
US4748495A (en) * | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
US4724611A (en) * | 1985-08-23 | 1988-02-16 | Nec Corporation | Method for producing semiconductor module |
US4879632A (en) * | 1985-10-04 | 1989-11-07 | Fujitsu Limited | Cooling system for an electronic circuit device |
US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
EP0236065B1 (de) * | 1986-02-25 | 1990-11-28 | Nec Corporation | Flüssigkeitskühlungssystem für integrierte Schaltungschips |
JPS62238653A (ja) * | 1986-04-09 | 1987-10-19 | Nec Corp | 冷却構造 |
JPS62281456A (ja) * | 1986-05-30 | 1987-12-07 | Hitachi Ltd | 半導体チツプの冷却装置 |
JPS6381959A (ja) * | 1986-09-26 | 1988-04-12 | Hitachi Ltd | 半導体装置 |
US4721996A (en) * | 1986-10-14 | 1988-01-26 | Unisys Corporation | Spring loaded module for cooling integrated circuit packages directly with a liquid |
JPS63157449A (ja) * | 1986-12-22 | 1988-06-30 | Nec Corp | 集積回路の冷却構造 |
JPH07112033B2 (ja) * | 1987-03-16 | 1995-11-29 | 富士通株式会社 | 冷却モジユ−ル構造 |
JPS63308943A (ja) * | 1987-06-10 | 1988-12-16 | Mitsubishi Electric Corp | 半導体装置 |
US4838347A (en) * | 1987-07-02 | 1989-06-13 | American Telephone And Telegraph Company At&T Bell Laboratories | Thermal conductor assembly |
US4791983A (en) * | 1987-10-13 | 1988-12-20 | Unisys Corporation | Self-aligning liquid-cooling assembly |
CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
-
1989
- 1989-09-19 DE DE68925403T patent/DE68925403T2/de not_active Expired - Fee Related
- 1989-09-19 CA CA000612004A patent/CA1304830C/en not_active Expired - Fee Related
- 1989-09-19 US US07/409,426 patent/US5014777A/en not_active Expired - Fee Related
- 1989-09-19 EP EP89117304A patent/EP0363687B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5014777A (en) | 1991-05-14 |
EP0363687A2 (de) | 1990-04-18 |
DE68925403T2 (de) | 1996-05-30 |
CA1304830C (en) | 1992-07-07 |
EP0363687B1 (de) | 1996-01-10 |
EP0363687A3 (de) | 1991-04-10 |
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