DE68925403D1 - Kühlungsstruktur für elektronische Bauelemente - Google Patents

Kühlungsstruktur für elektronische Bauelemente

Info

Publication number
DE68925403D1
DE68925403D1 DE68925403T DE68925403T DE68925403D1 DE 68925403 D1 DE68925403 D1 DE 68925403D1 DE 68925403 T DE68925403 T DE 68925403T DE 68925403 T DE68925403 T DE 68925403T DE 68925403 D1 DE68925403 D1 DE 68925403D1
Authority
DE
Germany
Prior art keywords
electronic components
cooling structure
cooling
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68925403T
Other languages
English (en)
Other versions
DE68925403T2 (de
Inventor
Toshifumi Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63237026A external-priority patent/JP2615909B2/ja
Priority claimed from JP63322333A external-priority patent/JPH02166755A/ja
Priority claimed from JP1019003A external-priority patent/JPH07114247B2/ja
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE68925403D1 publication Critical patent/DE68925403D1/de
Publication of DE68925403T2 publication Critical patent/DE68925403T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE68925403T 1988-09-20 1989-09-19 Kühlungsstruktur für elektronische Bauelemente Expired - Fee Related DE68925403T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63237026A JP2615909B2 (ja) 1988-09-20 1988-09-20 Ｌｓｉケースの冷却構造
JP63322333A JPH02166755A (ja) 1988-12-21 1988-12-21 伝熱シート
JP1019003A JPH07114247B2 (ja) 1989-01-26 1989-01-26 Ｌｓｉケースの冷却構造

Publications (2)

Publication Number Publication Date
DE68925403D1 true DE68925403D1 (de) 1996-02-22
DE68925403T2 DE68925403T2 (de) 1996-05-30

Family

ID=27282454

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68925403T Expired - Fee Related DE68925403T2 (de) 1988-09-20 1989-09-19 Kühlungsstruktur für elektronische Bauelemente

Country Status (4)

Country Link
US (1) US5014777A (de)
EP (1) EP0363687B1 (de)
CA (1) CA1304830C (de)
DE (1) DE68925403T2 (de)

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DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US6152377A (en) * 1992-06-30 2000-11-28 Fiedrich; Joachim Radiant floor and wall hydronic heating system tubing attachment to radiant plate
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
JP3003452B2 (ja) * 1993-04-08 2000-01-31 富士電機株式会社 二つの導体の導通接触構造
DE4339786C5 (de) * 1993-11-18 2004-02-05 Emi-Tec Elektronische Materialien Gmbh Verfahren zur Herstellung einer Anordung zur Wärmeableitung
US5881453A (en) * 1994-05-17 1999-03-16 Tandem Computers, Incorporated Method for mounting surface mount devices to a circuit board
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
US5831824A (en) * 1996-01-31 1998-11-03 Motorola, Inc. Apparatus for spray-cooling multiple electronic modules
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5802707A (en) * 1996-03-28 1998-09-08 Intel Corporation Controlled bondline thickness attachment mechanism
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
EP0805618B1 (de) * 1996-04-30 2002-01-23 Denki Kagaku Kogyo Kabushiki Kaisha Wärmeableitende Abstandhalter für elektronische Einrichtungen
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
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US6284363B1 (en) 1998-03-23 2001-09-04 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same
US6037660A (en) * 1998-05-06 2000-03-14 Liu; Yen-Wen Device for securing a finned radiating structure to a computer chip
KR100310099B1 (ko) 1998-08-20 2001-12-17 윤종용 반도체집적회로장치용방열장치및그것을구비하는휴대용컴퓨터
DE19924289A1 (de) * 1999-05-27 2000-12-07 Siemens Ag Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper
JP2001085877A (ja) * 1999-09-10 2001-03-30 Furukawa Electric Co Ltd:The 突起部を有する受熱面を備えたヒートシンク
US6496373B1 (en) 1999-11-04 2002-12-17 Amerasia International Technology, Inc. Compressible thermally-conductive interface
CN100375276C (zh) * 2002-06-06 2008-03-12 富士高分子工业株式会社 导热片材及其制造方法
US20060238984A1 (en) * 2005-04-20 2006-10-26 Belady Christian L Thermal dissipation device with thermal compound recesses
US9179579B2 (en) * 2006-06-08 2015-11-03 International Business Machines Corporation Sheet having high thermal conductivity and flexibility
CN100580362C (zh) * 2006-12-29 2010-01-13 财团法人工业技术研究院 改良型热导管散热***
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
JP6226724B2 (ja) * 2012-12-21 2017-11-08 ポリプラスチックス株式会社 複合成形体の製造方法及び放熱性を向上させる方法
JP6398708B2 (ja) * 2014-12-26 2018-10-03 株式会社デンソー 電子装置、及びそれを用いた駆動装置
RU173874U1 (ru) * 2016-08-05 2017-09-15 Егор Александрович Колмаков Термостатированный корпус для измерительных приборов
US11911790B2 (en) 2022-02-25 2024-02-27 Saudi Arabian Oil Company Applying corrosion inhibitor within tubulars

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Also Published As

Publication number Publication date
US5014777A (en) 1991-05-14
EP0363687A2 (de) 1990-04-18
DE68925403T2 (de) 1996-05-30
CA1304830C (en) 1992-07-07
EP0363687B1 (de) 1996-01-10
EP0363687A3 (de) 1991-04-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee