US5399528A
(en)
*
|
1989-06-01 |
1995-03-21 |
Leibovitz; Jacques |
Multi-layer fabrication in integrated circuit systems
|
US5191738A
(en)
*
|
1989-06-16 |
1993-03-09 |
Shin-Etsu Handotai Co., Ltd. |
Method of polishing semiconductor wafer
|
US5104828A
(en)
*
|
1990-03-01 |
1992-04-14 |
Intel Corporation |
Method of planarizing a dielectric formed over a semiconductor substrate
|
US5094972A
(en)
*
|
1990-06-14 |
1992-03-10 |
National Semiconductor Corp. |
Means of planarizing integrated circuits with fully recessed isolation dielectric
|
US5036015A
(en)
*
|
1990-09-24 |
1991-07-30 |
Micron Technology, Inc. |
Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
|
US5064683A
(en)
*
|
1990-10-29 |
1991-11-12 |
Motorola, Inc. |
Method for polish planarizing a semiconductor substrate by using a boron nitride polish stop
|
US5290396A
(en)
*
|
1991-06-06 |
1994-03-01 |
Lsi Logic Corporation |
Trench planarization techniques
|
US5413966A
(en)
*
|
1990-12-20 |
1995-05-09 |
Lsi Logic Corporation |
Shallow trench etch
|
JP3362397B2
(ja)
*
|
1991-03-28 |
2003-01-07 |
ソニー株式会社 |
ポリッシュによる平坦化工程を含む電子装置の製造方法
|
US5069002A
(en)
*
|
1991-04-17 |
1991-12-03 |
Micron Technology, Inc. |
Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
|
US5128281A
(en)
*
|
1991-06-05 |
1992-07-07 |
Texas Instruments Incorporated |
Method for polishing semiconductor wafer edges
|
US5248625A
(en)
*
|
1991-06-06 |
1993-09-28 |
Lsi Logic Corporation |
Techniques for forming isolation structures
|
US5252503A
(en)
*
|
1991-06-06 |
1993-10-12 |
Lsi Logic Corporation |
Techniques for forming isolation structures
|
US5225358A
(en)
*
|
1991-06-06 |
1993-07-06 |
Lsi Logic Corporation |
Method of forming late isolation with polishing
|
US5320706A
(en)
*
|
1991-10-15 |
1994-06-14 |
Texas Instruments Incorporated |
Removing slurry residue from semiconductor wafer planarization
|
US5308438A
(en)
*
|
1992-01-30 |
1994-05-03 |
International Business Machines Corporation |
Endpoint detection apparatus and method for chemical/mechanical polishing
|
US5245790A
(en)
*
|
1992-02-14 |
1993-09-21 |
Lsi Logic Corporation |
Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers
|
US5422289A
(en)
*
|
1992-04-27 |
1995-06-06 |
National Semiconductor Corporation |
Method of manufacturing a fully planarized MOSFET and resulting structure
|
US5302551A
(en)
*
|
1992-05-11 |
1994-04-12 |
National Semiconductor Corporation |
Method for planarizing the surface of an integrated circuit over a metal interconnect layer
|
US5445996A
(en)
*
|
1992-05-26 |
1995-08-29 |
Kabushiki Kaisha Toshiba |
Method for planarizing a semiconductor device having a amorphous layer
|
JPH0697132A
(ja)
*
|
1992-07-10 |
1994-04-08 |
Lsi Logic Corp |
半導体ウェハの化学機械的研磨装置、同装置のプラテンへの半導体ウェハ研磨用パッドの取付け方法、および同装置の研磨用複合パッド
|
US5310455A
(en)
*
|
1992-07-10 |
1994-05-10 |
Lsi Logic Corporation |
Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
|
US5265378A
(en)
*
|
1992-07-10 |
1993-11-30 |
Lsi Logic Corporation |
Detecting the endpoint of chem-mech polishing and resulting semiconductor device
|
US5299393A
(en)
*
|
1992-07-21 |
1994-04-05 |
International Business Machines Corporation |
Slurry containment device for polishing semiconductor wafers
|
US5466636A
(en)
*
|
1992-09-17 |
1995-11-14 |
International Business Machines Corporation |
Method of forming borderless contacts using a removable mandrel
|
DE69317838T2
(de)
*
|
1992-09-24 |
1998-11-12 |
Ebara Corp |
Poliergerät
|
US5519205A
(en)
*
|
1992-09-30 |
1996-05-21 |
Lsi Logic Corporation |
Color electronic camera including photosensor array having binary diffractive lens elements
|
US5529936A
(en)
*
|
1992-09-30 |
1996-06-25 |
Lsi Logic Corporation |
Method of etching a lens for a semiconductor solid state image sensor
|
US5340978A
(en)
*
|
1992-09-30 |
1994-08-23 |
Lsi Logic Corporation |
Image-sensing display panels with LCD display panel and photosensitive element array
|
US5232875A
(en)
*
|
1992-10-15 |
1993-08-03 |
Micron Technology, Inc. |
Method and apparatus for improving planarity of chemical-mechanical planarization operations
|
EP0624432B1
(de)
*
|
1992-10-30 |
1999-01-20 |
Bbf Yamate Corporation |
Polierverfahren, hierzu bestimmte vorrichtung und schwabbel-/polierscheibe
|
US5300155A
(en)
*
|
1992-12-23 |
1994-04-05 |
Micron Semiconductor, Inc. |
IC chemical mechanical planarization process incorporating slurry temperature control
|
US5324690A
(en)
*
|
1993-02-01 |
1994-06-28 |
Motorola Inc. |
Semiconductor device having a ternary boron nitride film and a method for forming the same
|
US5626715A
(en)
*
|
1993-02-05 |
1997-05-06 |
Lsi Logic Corporation |
Methods of polishing semiconductor substrates
|
US5389194A
(en)
*
|
1993-02-05 |
1995-02-14 |
Lsi Logic Corporation |
Methods of cleaning semiconductor substrates after polishing
|
US5532191A
(en)
*
|
1993-03-26 |
1996-07-02 |
Kawasaki Steel Corporation |
Method of chemical mechanical polishing planarization of an insulating film using an etching stop
|
US5356513A
(en)
*
|
1993-04-22 |
1994-10-18 |
International Business Machines Corporation |
Polishstop planarization method and structure
|
JPH09502836A
(ja)
*
|
1993-09-17 |
1997-03-18 |
ポラロイド コーポレイション |
固体イメージセンサー上のマイクロレンズの形成方法
|
US5395801A
(en)
*
|
1993-09-29 |
1995-03-07 |
Micron Semiconductor, Inc. |
Chemical-mechanical polishing processes of planarizing insulating layers
|
US5643053A
(en)
*
|
1993-12-27 |
1997-07-01 |
Applied Materials, Inc. |
Chemical mechanical polishing apparatus with improved polishing control
|
US5595522A
(en)
*
|
1994-01-04 |
1997-01-21 |
Texas Instruments Incorporated |
Semiconductor wafer edge polishing system and method
|
US5422316A
(en)
*
|
1994-03-18 |
1995-06-06 |
Memc Electronic Materials, Inc. |
Semiconductor wafer polisher and method
|
US5733175A
(en)
|
1994-04-25 |
1998-03-31 |
Leach; Michael A. |
Polishing a workpiece using equal velocity at all points overlapping a polisher
|
US5562530A
(en)
*
|
1994-08-02 |
1996-10-08 |
Sematech, Inc. |
Pulsed-force chemical mechanical polishing
|
US5783497A
(en)
*
|
1994-08-02 |
1998-07-21 |
Sematech, Inc. |
Forced-flow wafer polisher
|
US5607341A
(en)
|
1994-08-08 |
1997-03-04 |
Leach; Michael A. |
Method and structure for polishing a wafer during manufacture of integrated circuits
|
TW274625B
(de)
*
|
1994-09-30 |
1996-04-21 |
Hitachi Seisakusyo Kk |
|
US5527423A
(en)
*
|
1994-10-06 |
1996-06-18 |
Cabot Corporation |
Chemical mechanical polishing slurry for metal layers
|
JP3637977B2
(ja)
*
|
1995-01-19 |
2005-04-13 |
株式会社荏原製作所 |
ポリッシングの終点検知方法
|
US5846122A
(en)
*
|
1995-04-25 |
1998-12-08 |
Lucent Technologies Inc. |
Method and apparatus for polishing metal-soluble materials such as diamond
|
US5665201A
(en)
*
|
1995-06-06 |
1997-09-09 |
Advanced Micro Devices, Inc. |
High removal rate chemical-mechanical polishing
|
EP0751205A3
(de)
|
1995-06-29 |
1997-04-09 |
Shell Int Research |
Verfahren zur Verwandlung von Rückstandskohlenwasserstoffölen
|
KR970018240A
(ko)
*
|
1995-09-08 |
1997-04-30 |
모리시다 요이치 |
반도체 기판의 연마방법 및 그 장치
|
US5672095A
(en)
*
|
1995-09-29 |
1997-09-30 |
Intel Corporation |
Elimination of pad conditioning in a chemical mechanical polishing process
|
US5840623A
(en)
*
|
1995-10-04 |
1998-11-24 |
Advanced Micro Devices, Inc. |
Efficient and economical method of planarization of multilevel metallization structures in integrated circuits using CMP
|
US5709593A
(en)
*
|
1995-10-27 |
1998-01-20 |
Applied Materials, Inc. |
Apparatus and method for distribution of slurry in a chemical mechanical polishing system
|
JP3649493B2
(ja)
*
|
1995-11-02 |
2005-05-18 |
株式会社荏原製作所 |
ポリッシングの終点決定方法及び装置
|
US5726099A
(en)
*
|
1995-11-07 |
1998-03-10 |
International Business Machines Corporation |
Method of chemically mechanically polishing an electronic component using a non-selective ammonium persulfate slurry
|
EP0779655A3
(de)
*
|
1995-12-14 |
1997-07-16 |
International Business Machines Corporation |
Verfahren zum chemisch-mechanischen Polieren eines Halbleitersubstrats eines elektronischen Bauteils
|
US5707492A
(en)
*
|
1995-12-18 |
1998-01-13 |
Motorola, Inc. |
Metallized pad polishing process
|
US5618447A
(en)
*
|
1996-02-13 |
1997-04-08 |
Micron Technology, Inc. |
Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers
|
KR0183826B1
(ko)
*
|
1996-03-04 |
1999-05-01 |
김광호 |
연마공정 후처리용 세정 용액 및 그를 이용하는 세정 방법
|
US5893754A
(en)
*
|
1996-05-21 |
1999-04-13 |
Micron Technology, Inc. |
Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
|
JPH09321001A
(ja)
*
|
1996-05-31 |
1997-12-12 |
Komatsu Electron Metals Co Ltd |
半導体ウェハの研磨方法
|
US5993686A
(en)
*
|
1996-06-06 |
1999-11-30 |
Cabot Corporation |
Fluoride additive containing chemical mechanical polishing slurry and method for use of same
|
US5710069A
(en)
*
|
1996-08-26 |
1998-01-20 |
Motorola, Inc. |
Measuring slurry particle size during substrate polishing
|
US6033596A
(en)
*
|
1996-09-24 |
2000-03-07 |
Cabot Corporation |
Multi-oxidizer slurry for chemical mechanical polishing
|
US5783489A
(en)
*
|
1996-09-24 |
1998-07-21 |
Cabot Corporation |
Multi-oxidizer slurry for chemical mechanical polishing
|
US6039891A
(en)
|
1996-09-24 |
2000-03-21 |
Cabot Corporation |
Multi-oxidizer precursor for chemical mechanical polishing
|
JP3788533B2
(ja)
*
|
1996-09-30 |
2006-06-21 |
東京エレクトロン株式会社 |
研磨装置および研磨方法
|
US5972792A
(en)
*
|
1996-10-18 |
1999-10-26 |
Micron Technology, Inc. |
Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
|
US6043206A
(en)
|
1996-10-19 |
2000-03-28 |
Samsung Electronics Co., Ltd. |
Solutions for cleaning integrated circuit substrates
|
US5958288A
(en)
*
|
1996-11-26 |
1999-09-28 |
Cabot Corporation |
Composition and slurry useful for metal CMP
|
US6068787A
(en)
*
|
1996-11-26 |
2000-05-30 |
Cabot Corporation |
Composition and slurry useful for metal CMP
|
US5954997A
(en)
|
1996-12-09 |
1999-09-21 |
Cabot Corporation |
Chemical mechanical polishing slurry useful for copper substrates
|
US6126853A
(en)
|
1996-12-09 |
2000-10-03 |
Cabot Microelectronics Corporation |
Chemical mechanical polishing slurry useful for copper substrates
|
US6309560B1
(en)
|
1996-12-09 |
2001-10-30 |
Cabot Microelectronics Corporation |
Chemical mechanical polishing slurry useful for copper substrates
|
US6602439B1
(en)
*
|
1997-02-24 |
2003-08-05 |
Superior Micropowders, Llc |
Chemical-mechanical planarization slurries and powders and methods for using same
|
US5885135A
(en)
*
|
1997-04-23 |
1999-03-23 |
International Business Machines Corporation |
CMP wafer carrier for preferential polishing of a wafer
|
US5873769A
(en)
*
|
1997-05-30 |
1999-02-23 |
Industrial Technology Research Institute |
Temperature compensated chemical mechanical polishing to achieve uniform removal rates
|
US6030487A
(en)
*
|
1997-06-19 |
2000-02-29 |
International Business Machines Corporation |
Wafer carrier assembly
|
US6290735B1
(en)
|
1997-10-31 |
2001-09-18 |
Nanogram Corporation |
Abrasive particles for surface polishing
|
US6726990B1
(en)
|
1998-05-27 |
2004-04-27 |
Nanogram Corporation |
Silicon oxide particles
|
US20090255189A1
(en)
*
|
1998-08-19 |
2009-10-15 |
Nanogram Corporation |
Aluminum oxide particles
|
US20090075083A1
(en)
*
|
1997-07-21 |
2009-03-19 |
Nanogram Corporation |
Nanoparticle production and corresponding structures
|
US6099798A
(en)
*
|
1997-10-31 |
2000-08-08 |
Nanogram Corp. |
Ultraviolet light block and photocatalytic materials
|
US7384680B2
(en)
*
|
1997-07-21 |
2008-06-10 |
Nanogram Corporation |
Nanoparticle-based power coatings and corresponding structures
|
US20060147369A1
(en)
*
|
1997-07-21 |
2006-07-06 |
Neophotonics Corporation |
Nanoparticle production and corresponding structures
|
US5997392A
(en)
*
|
1997-07-22 |
1999-12-07 |
International Business Machines Corporation |
Slurry injection technique for chemical-mechanical polishing
|
US6099604A
(en)
*
|
1997-08-21 |
2000-08-08 |
Micron Technology, Inc. |
Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto
|
US6069095A
(en)
*
|
1997-08-22 |
2000-05-30 |
Texas Instruments Incorporated |
Ultra-clean wafer chuck assembly for moisture-sensitive processes conducted in rapid thermal processors
|
US6102784A
(en)
*
|
1997-11-05 |
2000-08-15 |
Speedfam-Ipec Corporation |
Method and apparatus for improved gear cleaning assembly in polishing machines
|
US6146241A
(en)
*
|
1997-11-12 |
2000-11-14 |
Fujitsu Limited |
Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation
|
US6336845B1
(en)
|
1997-11-12 |
2002-01-08 |
Lam Research Corporation |
Method and apparatus for polishing semiconductor wafers
|
US5957750A
(en)
|
1997-12-18 |
1999-09-28 |
Micron Technology, Inc. |
Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
|
KR100286980B1
(ko)
*
|
1998-02-11 |
2001-04-16 |
윤종용 |
웨이퍼 연마 설비 및 웨이퍼 연마 방법
|
US6114249A
(en)
*
|
1998-03-10 |
2000-09-05 |
International Business Machines Corporation |
Chemical mechanical polishing of multiple material substrates and slurry having improved selectivity
|
US6432828B2
(en)
*
|
1998-03-18 |
2002-08-13 |
Cabot Microelectronics Corporation |
Chemical mechanical polishing slurry useful for copper substrates
|
US6019665A
(en)
*
|
1998-04-30 |
2000-02-01 |
Fujitsu Limited |
Controlled retention of slurry in chemical mechanical polishing
|
WO1999056189A1
(en)
*
|
1998-04-30 |
1999-11-04 |
The Boc Group, Inc. |
Conductivity feedback control system for slurry blending
|
US6210257B1
(en)
*
|
1998-05-29 |
2001-04-03 |
Micron Technology, Inc. |
Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
|
US5944588A
(en)
*
|
1998-06-25 |
1999-08-31 |
International Business Machines Corporation |
Chemical mechanical polisher
|
US6063306A
(en)
*
|
1998-06-26 |
2000-05-16 |
Cabot Corporation |
Chemical mechanical polishing slurry useful for copper/tantalum substrate
|
US6217416B1
(en)
|
1998-06-26 |
2001-04-17 |
Cabot Microelectronics Corporation |
Chemical mechanical polishing slurry useful for copper/tantalum substrates
|
US6558570B2
(en)
|
1998-07-01 |
2003-05-06 |
Micron Technology, Inc. |
Polishing slurry and method for chemical-mechanical polishing
|
US6220934B1
(en)
|
1998-07-23 |
2001-04-24 |
Micron Technology, Inc. |
Method for controlling pH during planarization and cleaning of microelectronic substrates
|
US6129610A
(en)
*
|
1998-08-14 |
2000-10-10 |
International Business Machines Corporation |
Polish pressure modulation in CMP to preferentially polish raised features
|
US5972787A
(en)
*
|
1998-08-18 |
1999-10-26 |
International Business Machines Corp. |
CMP process using indicator areas to determine endpoint
|
JP3144635B2
(ja)
*
|
1998-10-13 |
2001-03-12 |
日本電気株式会社 |
半導体装置の製造方法
|
SG99289A1
(en)
*
|
1998-10-23 |
2003-10-27 |
Ibm |
Chemical-mechanical planarization of metallurgy
|
US6261158B1
(en)
|
1998-12-16 |
2001-07-17 |
Speedfam-Ipec |
Multi-step chemical mechanical polishing
|
JP2000216120A
(ja)
*
|
1999-01-27 |
2000-08-04 |
Mitsubishi Electric Corp |
研磨装置およびこれを用いた半導体装置の製造方法
|
US6491570B1
(en)
*
|
1999-02-25 |
2002-12-10 |
Applied Materials, Inc. |
Polishing media stabilizer
|
US6066030A
(en)
*
|
1999-03-04 |
2000-05-23 |
International Business Machines Corporation |
Electroetch and chemical mechanical polishing equipment
|
US6213846B1
(en)
|
1999-07-12 |
2001-04-10 |
International Business Machines Corporation |
Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement
|
US6343975B1
(en)
|
1999-10-05 |
2002-02-05 |
Peter Mok |
Chemical-mechanical polishing apparatus with circular motion pads
|
US6431959B1
(en)
|
1999-12-20 |
2002-08-13 |
Lam Research Corporation |
System and method of defect optimization for chemical mechanical planarization of polysilicon
|
US6186873B1
(en)
|
2000-04-14 |
2001-02-13 |
International Business Machines Corporation |
Wafer edge cleaning
|
US6561884B1
(en)
|
2000-08-29 |
2003-05-13 |
Applied Materials, Inc. |
Web lift system for chemical mechanical planarization
|
US6592439B1
(en)
|
2000-11-10 |
2003-07-15 |
Applied Materials, Inc. |
Platen for retaining polishing material
|
WO2002061810A1
(en)
*
|
2001-01-16 |
2002-08-08 |
Cabot Microelectronics Corporation |
Ammonium oxalate-containing polishing system and method
|
US6383065B1
(en)
|
2001-01-22 |
2002-05-07 |
Cabot Microelectronics Corporation |
Catalytic reactive pad for metal CMP
|
US6799136B2
(en)
*
|
2001-08-09 |
2004-09-28 |
Texas Instruments Incorporated |
Method of estimation of wafer polish rates
|
US6503131B1
(en)
|
2001-08-16 |
2003-01-07 |
Applied Materials, Inc. |
Integrated platen assembly for a chemical mechanical planarization system
|
US6458020B1
(en)
*
|
2001-11-16 |
2002-10-01 |
International Business Machines Corporation |
Slurry recirculation in chemical mechanical polishing
|
KR100444721B1
(ko)
*
|
2001-12-20 |
2004-08-16 |
동부전자 주식회사 |
금속배선 전 절연막의 평탄화 방법
|
US7004819B2
(en)
|
2002-01-18 |
2006-02-28 |
Cabot Microelectronics Corporation |
CMP systems and methods utilizing amine-containing polymers
|
US20030162398A1
(en)
|
2002-02-11 |
2003-08-28 |
Small Robert J. |
Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
|
WO2004090937A2
(en)
*
|
2003-04-10 |
2004-10-21 |
Technion Research & Development Foundation Ltd |
Copper cmp slurry composition
|
US7001827B2
(en)
*
|
2003-04-15 |
2006-02-21 |
International Business Machines Corporation |
Semiconductor wafer front side protection
|
US6939200B2
(en)
*
|
2003-09-16 |
2005-09-06 |
Hitachi Global Storage Technologies Netherlands B.V. |
Method of predicting plate lapping properties to improve slider fabrication yield
|
US6918815B2
(en)
*
|
2003-09-16 |
2005-07-19 |
Hitachi Global Storage Technologies Netherlands B.V. |
System and apparatus for predicting plate lapping properties to improve slider fabrication yield
|
US7255810B2
(en)
*
|
2004-01-09 |
2007-08-14 |
Cabot Microelectronics Corporation |
Polishing system comprising a highly branched polymer
|
US6971945B2
(en)
*
|
2004-02-23 |
2005-12-06 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Multi-step polishing solution for chemical mechanical planarization
|
US20050206007A1
(en)
*
|
2004-03-18 |
2005-09-22 |
Lei Li |
Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
|
US7232363B2
(en)
*
|
2004-07-22 |
2007-06-19 |
Applied Materials, Inc. |
Polishing solution retainer
|
US8038752B2
(en)
|
2004-10-27 |
2011-10-18 |
Cabot Microelectronics Corporation |
Metal ion-containing CMP composition and method for using the same
|
US7803203B2
(en)
|
2005-09-26 |
2010-09-28 |
Cabot Microelectronics Corporation |
Compositions and methods for CMP of semiconductor materials
|
KR100710804B1
(ko)
*
|
2006-02-03 |
2007-04-23 |
삼성전자주식회사 |
반도체 소자의 평탄화 방법
|
JP4814677B2
(ja)
*
|
2006-03-31 |
2011-11-16 |
株式会社荏原製作所 |
基板保持装置および研磨装置
|
US8759216B2
(en)
|
2006-06-07 |
2014-06-24 |
Cabot Microelectronics Corporation |
Compositions and methods for polishing silicon nitride materials
|
US20080220610A1
(en)
*
|
2006-06-29 |
2008-09-11 |
Cabot Microelectronics Corporation |
Silicon oxide polishing method utilizing colloidal silica
|
US8197306B2
(en)
*
|
2008-10-31 |
2012-06-12 |
Araca, Inc. |
Method and device for the injection of CMP slurry
|
US8845395B2
(en)
|
2008-10-31 |
2014-09-30 |
Araca Inc. |
Method and device for the injection of CMP slurry
|
US8740668B2
(en)
*
|
2010-03-12 |
2014-06-03 |
Wayne O. Duescher |
Three-point spindle-supported floating abrasive platen
|
US8602842B2
(en)
*
|
2010-03-12 |
2013-12-10 |
Wayne O. Duescher |
Three-point fixed-spindle floating-platen abrasive system
|
US8500515B2
(en)
*
|
2010-03-12 |
2013-08-06 |
Wayne O. Duescher |
Fixed-spindle and floating-platen abrasive system using spherical mounts
|
US8647171B2
(en)
*
|
2010-03-12 |
2014-02-11 |
Wayne O. Duescher |
Fixed-spindle floating-platen workpiece loader apparatus
|
CN102172885B
(zh)
*
|
2011-01-31 |
2013-05-15 |
北京通美晶体技术有限公司 |
衬底的抛光装置及其抛光的衬底
|
US9960088B2
(en)
|
2011-11-07 |
2018-05-01 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
End point detection in grinding
|
US9358660B2
(en)
|
2011-11-07 |
2016-06-07 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Grinding wheel design with elongated teeth arrangement
|
US9633863B2
(en)
|
2012-07-11 |
2017-04-25 |
Cabot Microelectronics Corporation |
Compositions and methods for selective polishing of silicon nitride materials
|
KR102463341B1
(ko)
|
2015-01-13 |
2022-11-04 |
씨엠씨 머티리얼즈, 인코포레이티드 |
Cmp 후 반도체 웨이퍼 세정용 세정 조성물 및 방법
|
CN113649944A
(zh)
|
2016-06-24 |
2021-11-16 |
应用材料公司 |
用于化学机械抛光的浆料分布设备
|
CN107030589A
(zh)
*
|
2017-03-14 |
2017-08-11 |
黄河科技学院 |
一种化学机械研磨设备
|