DE60327695D1 - Klebharz und damit hergestellte filmklebstoffe - Google Patents

Klebharz und damit hergestellte filmklebstoffe

Info

Publication number
DE60327695D1
DE60327695D1 DE60327695T DE60327695T DE60327695D1 DE 60327695 D1 DE60327695 D1 DE 60327695D1 DE 60327695 T DE60327695 T DE 60327695T DE 60327695 T DE60327695 T DE 60327695T DE 60327695 D1 DE60327695 D1 DE 60327695D1
Authority
DE
Germany
Prior art keywords
adhesive resin
produced film
film adhesives
adhesives
produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60327695T
Other languages
English (en)
Inventor
Jin Kinoshita
Moritsugu Morita
Minehiro Mori
Yoichi Kodama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002170216A external-priority patent/JP4118089B2/ja
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Application granted granted Critical
Publication of DE60327695D1 publication Critical patent/DE60327695D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE60327695T 2002-05-30 2003-05-29 Klebharz und damit hergestellte filmklebstoffe Expired - Lifetime DE60327695D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002156705 2002-05-30
JP2002170216A JP4118089B2 (ja) 2002-06-11 2002-06-11 接着性ポリイミド樹脂組成物及びそれを用いたフィルム状接着剤
PCT/JP2003/006776 WO2003102049A1 (fr) 2002-05-30 2003-05-29 Resine adhesive et adhesifs sous forme de films la contenant

Publications (1)

Publication Number Publication Date
DE60327695D1 true DE60327695D1 (de) 2009-07-02

Family

ID=29714290

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60327695T Expired - Lifetime DE60327695D1 (de) 2002-05-30 2003-05-29 Klebharz und damit hergestellte filmklebstoffe

Country Status (6)

Country Link
US (1) US20050165196A1 (de)
EP (1) EP1508584B1 (de)
KR (1) KR100621939B1 (de)
CN (1) CN1309761C (de)
DE (1) DE60327695D1 (de)
WO (1) WO2003102049A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7816487B2 (en) * 2004-09-30 2010-10-19 Intel Corporation Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
TWI286828B (en) 2004-11-12 2007-09-11 Mitsui Chemicals Inc Film-shaped adhesive and semiconductor package using the same
US20100243303A1 (en) * 2006-08-22 2010-09-30 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
JP2009242605A (ja) * 2008-03-31 2009-10-22 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP4806815B2 (ja) * 2008-03-31 2011-11-02 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
CN101684181B (zh) * 2008-09-26 2011-12-14 比亚迪股份有限公司 一种光敏聚酰亚胺及其柔性线路板
CN101914357A (zh) * 2010-08-06 2010-12-15 东华大学 环氧-有机硅聚酰亚胺粘合剂及其制备方法
KR101786085B1 (ko) 2011-04-05 2017-10-17 도레이첨단소재 주식회사 반도체 장치용 접착제 조성물 및 이를 이용한 접착 필름
JP5777944B2 (ja) * 2011-06-13 2015-09-09 新日鉄住金化学株式会社 架橋ポリイミド樹脂、接着剤樹脂組成物及びその硬化物、カバーレイフィルム並びに回路基板
CN104064480A (zh) * 2013-03-22 2014-09-24 江西创成半导体有限责任公司 聚酰亚胺喷涂
JP6796253B2 (ja) 2016-04-04 2020-12-09 日立金属株式会社 接着フィルム及びフラット配線材
CN106190006A (zh) * 2016-08-23 2016-12-07 苏州盛达胶粘制品有限公司 一种加强型聚酰亚胺胶粘剂
TWI658936B (zh) * 2018-02-07 2019-05-11 台虹科技股份有限公司 覆蓋膜及其應用
CN108753245A (zh) * 2018-06-29 2018-11-06 合肥帧讯低温科技有限公司 一种耐低温环保型密封胶及其制备方法
KR102224438B1 (ko) * 2018-12-19 2021-03-09 율촌화학 주식회사 저유전 접착제 조성물 및 이를 포함하는 커버레이 필름
WO2022138160A1 (ja) * 2020-12-24 2022-06-30 東レ株式会社 樹脂組成物、シート状組成物、シート硬化物、積層体、積層部材、ウエハ保持体および半導体製造装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5739263A (en) * 1992-06-04 1998-04-14 Sumitomo Bakelite Company Limited Film adhesive and process for production thereof
TW294702B (de) * 1994-03-08 1997-01-01 Sumitomo Bakelite Co
JP3014578B2 (ja) * 1994-03-08 2000-02-28 住友ベークライト株式会社 高温時の物性が改良された樹脂組成物
JPH0834852A (ja) * 1994-07-21 1996-02-06 Toray Dow Corning Silicone Co Ltd シリコーン変性ポリアミド溶液組成物
JPH08127656A (ja) * 1994-11-01 1996-05-21 Mitsui Toatsu Chem Inc ポリイミド及びそれよりなる耐熱性接着剤
JPH08134213A (ja) * 1994-11-16 1996-05-28 Mitsui Toatsu Chem Inc ポリイミド及びそれよりなる耐熱性の接着剤
JPH08259924A (ja) * 1995-03-23 1996-10-08 Mitsui Toatsu Chem Inc 耐熱性接着剤
JP2992462B2 (ja) * 1995-08-31 1999-12-20 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
JP2000143981A (ja) * 1998-11-12 2000-05-26 Kanegafuchi Chem Ind Co Ltd 樹脂組成物
US6156820A (en) * 1998-12-28 2000-12-05 Occidental Chemical Corporation Polyamideimidesiloxane hot melt adhesive

Also Published As

Publication number Publication date
KR20040086321A (ko) 2004-10-08
KR100621939B1 (ko) 2006-09-14
EP1508584A4 (de) 2007-04-25
WO2003102049A1 (fr) 2003-12-11
CN1309761C (zh) 2007-04-11
EP1508584A1 (de) 2005-02-23
EP1508584B1 (de) 2009-05-20
US20050165196A1 (en) 2005-07-28
CN1649936A (zh) 2005-08-03

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Legal Events

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8364 No opposition during term of opposition