DE60317862D1 - Lichtemittierende Halbleitervorrichtung - Google Patents

Lichtemittierende Halbleitervorrichtung

Info

Publication number
DE60317862D1
DE60317862D1 DE60317862T DE60317862T DE60317862D1 DE 60317862 D1 DE60317862 D1 DE 60317862D1 DE 60317862 T DE60317862 T DE 60317862T DE 60317862 T DE60317862 T DE 60317862T DE 60317862 D1 DE60317862 D1 DE 60317862D1
Authority
DE
Germany
Prior art keywords
light
semiconductor device
emitting semiconductor
emitting
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60317862T
Other languages
English (en)
Other versions
DE60317862T2 (de
Inventor
Takashi Matsuoka
Hiroshi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002178531A external-priority patent/JP2004022969A/ja
Priority claimed from JP2002178536A external-priority patent/JP2004022970A/ja
Priority claimed from JP2002252837A external-priority patent/JP4300004B2/ja
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Publication of DE60317862D1 publication Critical patent/DE60317862D1/de
Application granted granted Critical
Publication of DE60317862T2 publication Critical patent/DE60317862T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
DE60317862T 2002-06-19 2003-04-24 Lichtemittierende Halbleitervorrichtung Expired - Lifetime DE60317862T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002178531A JP2004022969A (ja) 2002-06-19 2002-06-19 半導体発光素子
JP2002178536A JP2004022970A (ja) 2002-06-19 2002-06-19 半導体発光素子
JP2002178531 2002-06-19
JP2002178536 2002-06-19
JP2002252837 2002-08-30
JP2002252837A JP4300004B2 (ja) 2002-08-30 2002-08-30 半導体発光素子

Publications (2)

Publication Number Publication Date
DE60317862D1 true DE60317862D1 (de) 2008-01-17
DE60317862T2 DE60317862T2 (de) 2008-12-18

Family

ID=29740559

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60317862T Expired - Lifetime DE60317862T2 (de) 2002-06-19 2003-04-24 Lichtemittierende Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US6927426B2 (de)
EP (1) EP1389814B1 (de)
KR (1) KR100568701B1 (de)
CN (1) CN1324772C (de)
DE (1) DE60317862T2 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4598767B2 (ja) * 2003-07-30 2010-12-15 パナソニック株式会社 半導体発光装置、発光モジュール、および照明装置
ATE467701T1 (de) * 2003-08-08 2010-05-15 Centre Nat Rech Scient Verfahren zur herstellung von quantenpunkten aus indiumnitrid und erzeugnis enthaltend diese quantenpunkten
TWI243489B (en) * 2004-04-14 2005-11-11 Genesis Photonics Inc Single chip light emitting diode with red, blue and green three wavelength light emitting spectra
CN1595670B (zh) * 2004-06-25 2011-12-28 清华大学 宽谱白光led的量子点有源区结构及其外延生长方法
KR100513923B1 (ko) * 2004-08-13 2005-09-08 재단법인서울대학교산학협력재단 질화물 반도체층을 성장시키는 방법 및 이를 이용하는 질화물 반도체 발광소자
US8309843B2 (en) * 2004-08-19 2012-11-13 Banpil Photonics, Inc. Photovoltaic cells based on nanoscale structures
US20090200538A1 (en) * 2004-09-28 2009-08-13 Sumitomo Chemical Company, Limited Group lll-V compound semiconductor and a method for producing the same
EP1670068A1 (de) * 2004-12-09 2006-06-14 SuperNova Optoelectronics Corporation Weiss-Licht emittierende Vorrichtung und Herstelungsverfahren
WO2007011803A2 (en) * 2005-07-18 2007-01-25 Mrv Communications, Inc. Laser wavelength stabilization
US7977703B2 (en) * 2005-11-22 2011-07-12 Rohm Co., Ltd. Nitride semiconductor device having a zinc-based substrate
US9406505B2 (en) * 2006-02-23 2016-08-02 Allos Semiconductors Gmbh Nitride semiconductor component and process for its production
US20070240631A1 (en) * 2006-04-14 2007-10-18 Applied Materials, Inc. Epitaxial growth of compound nitride semiconductor structures
US20070256635A1 (en) * 2006-05-02 2007-11-08 Applied Materials, Inc. A Delaware Corporation UV activation of NH3 for III-N deposition
KR100716648B1 (ko) * 2006-05-12 2007-05-09 서울옵토디바이스주식회사 복수개의 발광셀들을 갖는 발광소자 및 그 제조방법
US20080247430A1 (en) * 2006-07-18 2008-10-09 Shengzhong Zhang Laser wavelength stabilization
EP2074666B1 (de) * 2006-09-08 2012-11-14 Agency for Science, Technology and Research Leuchtdiode mit abstimmbarer wellenlänge
JP2008109084A (ja) 2006-09-26 2008-05-08 Showa Denko Kk Iii族窒化物化合物半導体発光素子の製造方法、及びiii族窒化物化合物半導体発光素子、並びにランプ
WO2008066712A2 (en) * 2006-11-15 2008-06-05 The Regents Of The University Of California High light extraction efficiency light emitting diode (led) with emitters within structured materials
KR100898586B1 (ko) * 2007-03-30 2009-05-20 서울옵토디바이스주식회사 발광 다이오드
US20080314311A1 (en) * 2007-06-24 2008-12-25 Burrows Brian H Hvpe showerhead design
JP2009038239A (ja) * 2007-08-02 2009-02-19 Toshiba Corp 光半導体装置
US20090149008A1 (en) * 2007-10-05 2009-06-11 Applied Materials, Inc. Method for depositing group iii/v compounds
TWI374556B (en) 2007-12-12 2012-10-11 Au Optronics Corp White light emitting device and producing method thereof
GB2460666A (en) * 2008-06-04 2009-12-09 Sharp Kk Exciton spin control in AlGaInN quantum dots
JP4510931B2 (ja) * 2008-09-09 2010-07-28 パナソニック株式会社 窒化物系半導体発光素子およびその製造方法
JP2010232597A (ja) * 2009-03-30 2010-10-14 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子及びその製造方法
US8568529B2 (en) 2009-04-10 2013-10-29 Applied Materials, Inc. HVPE chamber hardware
US8183132B2 (en) * 2009-04-10 2012-05-22 Applied Materials, Inc. Methods for fabricating group III nitride structures with a cluster tool
US8138069B2 (en) * 2009-04-24 2012-03-20 Applied Materials, Inc. Substrate pretreatment for subsequent high temperature group III depositions
US20100273291A1 (en) * 2009-04-28 2010-10-28 Applied Materials, Inc. Decontamination of mocvd chamber using nh3 purge after in-situ cleaning
WO2010127156A2 (en) * 2009-04-29 2010-11-04 Applied Materials, Inc. Method of forming in-situ pre-gan deposition layer in hvpe
JP5529963B2 (ja) 2009-07-20 2014-06-25 ソイテック 半導体構造体または半導体デバイスを形成する方法および光起電力構造体
US20110057213A1 (en) * 2009-09-08 2011-03-10 Koninklijke Philips Electronics N.V. Iii-nitride light emitting device with curvat1jre control layer
US8580593B2 (en) * 2009-09-10 2013-11-12 Micron Technology, Inc. Epitaxial formation structures and associated methods of manufacturing solid state lighting devices
US20110220945A1 (en) * 2010-03-09 2011-09-15 Dae Sung Kang Light emitting device and light emitting device package having the same
US20110256692A1 (en) 2010-04-14 2011-10-20 Applied Materials, Inc. Multiple precursor concentric delivery showerhead
TWI534291B (zh) 2011-03-18 2016-05-21 應用材料股份有限公司 噴淋頭組件
US8927958B2 (en) * 2011-07-12 2015-01-06 Epistar Corporation Light-emitting element with multiple light-emitting stacked layers
TWI555226B (zh) * 2011-07-12 2016-10-21 晶元光電股份有限公司 具有多層發光疊層的發光元件
US20130015461A1 (en) * 2011-07-13 2013-01-17 Kun Hsin Technology Inc. Light-emitting Device Capable of Producing White Light And Light Mixing Method For Producing White Light With Same
DE102011116232B4 (de) * 2011-10-17 2020-04-09 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
JP6271934B2 (ja) * 2012-11-02 2018-01-31 キヤノン株式会社 窒化物半導体面発光レーザ及びその製造方法
KR102158576B1 (ko) * 2014-02-18 2020-09-22 엘지이노텍 주식회사 자외선 발광소자 및 이를 구비하는 발광소자 패키지
JP6595801B2 (ja) 2014-05-30 2019-10-23 エルジー イノテック カンパニー リミテッド 発光素子
KR102455084B1 (ko) * 2016-02-23 2022-10-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 이를 갖는 표시장치
CN108209941B (zh) * 2018-01-03 2021-06-08 中国科学院半导体研究所 血氧探测器探测单元、探头及其制备方法
CN111128899B (zh) * 2018-10-31 2022-03-22 成都辰显光电有限公司 外延基板及其制造方法
CN112331130A (zh) * 2019-07-31 2021-02-05 Tcl集团股份有限公司 一种量子点发光二极管的驱动方法、驱动装置及显示装置
CN112289897A (zh) * 2020-09-17 2021-01-29 华灿光电(浙江)有限公司 发光二极管外延片的制造方法及发光二极管外延片

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS618981A (ja) * 1984-06-23 1986-01-16 Oki Electric Ind Co Ltd 半導体発光素子
JP2910023B2 (ja) * 1993-12-24 1999-06-23 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
US5656832A (en) * 1994-03-09 1997-08-12 Kabushiki Kaisha Toshiba Semiconductor heterojunction device with ALN buffer layer of 3nm-10nm average film thickness
JPH07254732A (ja) * 1994-03-15 1995-10-03 Toshiba Corp 半導体発光装置
US5777350A (en) * 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
US5798537A (en) * 1995-08-31 1998-08-25 Kabushiki Kaisha Toshiba Blue light-emitting device
JP3905935B2 (ja) * 1995-09-01 2007-04-18 株式会社東芝 半導体素子及び半導体素子の製造方法
US5959307A (en) * 1995-11-06 1999-09-28 Nichia Chemical Industries Ltd. Nitride semiconductor device
US5684309A (en) * 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
US5834331A (en) * 1996-10-17 1998-11-10 Northwestern University Method for making III-Nitride laser and detection device
JP3282174B2 (ja) * 1997-01-29 2002-05-13 日亜化学工業株式会社 窒化物半導体発光素子
EP0881691B1 (de) * 1997-05-30 2004-09-01 Matsushita Electric Industrial Co., Ltd. Anordnung mit Quanten-Schachteln
US6266355B1 (en) * 1997-09-12 2001-07-24 Sdl, Inc. Group III-V nitride laser devices with cladding layers to suppress defects such as cracking
JPH11135838A (ja) * 1997-10-20 1999-05-21 Ind Technol Res Inst 白色発光ダイオード及びその製造方法
JPH11243251A (ja) * 1998-02-26 1999-09-07 Toshiba Corp 半導体レーザ装置
EP0975027A2 (de) * 1998-07-23 2000-01-26 Sony Corporation Licht-emittierende Vorrichtung und Herstellungsverfahren
JP2000244060A (ja) * 1998-12-22 2000-09-08 Sony Corp 半導体発光装置およびその製造方法
US6744800B1 (en) * 1998-12-30 2004-06-01 Xerox Corporation Method and structure for nitride based laser diode arrays on an insulating substrate
US6521917B1 (en) * 1999-03-26 2003-02-18 Matsushita Electric Industrial Co., Ltd. Semiconductor structures using a group III-nitride quaternary material system with reduced phase separation
JP2001077475A (ja) * 1999-09-03 2001-03-23 Rohm Co Ltd 半導体レーザ
US6531719B2 (en) * 1999-09-29 2003-03-11 Toyoda Gosei Co., Ltd. Group III nitride compound semiconductor device
JP2001308374A (ja) * 2000-03-04 2001-11-02 Joryoku Kooria Kk クアンタムホールの形成方法とそのクアンタムホールを用いる半導体発光素子及びその製造方法
JP4063520B2 (ja) * 2000-11-30 2008-03-19 日本碍子株式会社 半導体発光素子
US20030047743A1 (en) * 2001-09-04 2003-03-13 Gang Li Semiconductor light emitting device
TW522534B (en) * 2001-09-11 2003-03-01 Hsiu-Hen Chang Light source of full color LED using die bonding and packaging technology
US6724013B2 (en) * 2001-12-21 2004-04-20 Xerox Corporation Edge-emitting nitride-based laser diode with p-n tunnel junction current injection

Also Published As

Publication number Publication date
EP1389814A2 (de) 2004-02-18
EP1389814A3 (de) 2005-01-26
KR100568701B1 (ko) 2006-04-07
CN1467888A (zh) 2004-01-14
US20030234404A1 (en) 2003-12-25
DE60317862T2 (de) 2008-12-18
EP1389814B1 (de) 2007-12-05
CN1324772C (zh) 2007-07-04
US6927426B2 (en) 2005-08-09
KR20040002471A (ko) 2004-01-07

Similar Documents

Publication Publication Date Title
DE60317862D1 (de) Lichtemittierende Halbleitervorrichtung
DE60331799D1 (de) Halbleitervorrichtung
DE602004005760D1 (de) Halbleitervorrichtung
DE60332500D1 (de) Halbleitervorrichtung
DE60323780D1 (de) Beleuchtungsvorrichtung
NO20032486D0 (no) Analytt-testeanordning
DE10362232B8 (de) Leistungshalbleitervorrichtung
DE60320799D1 (de) Halbleitervorrichtung mit halbleiterchip
DE602004028430D1 (de) Halbleiter
DE60336301D1 (de) Aufzugsvorrichtung
DE10238843B8 (de) Halbleiterbauelement
DE60305807D1 (de) Beleuchtungsvorrichtung
DE60211244D1 (de) Halbleiterbauelement
DE50305428D1 (de) Objekt-selbstschutzvorrichtung
DE50306271D1 (de) Halbleiterlaservorrichtung
SE0203370L (sv) Anordning
DE602004021460D1 (de) Lichtemittierende Halbleitervorrichtung
DE502004000507D1 (de) Spanneinrichtung
DE50307713D1 (de) Leuchtenvorrichtung
DE60216046D1 (de) Halbleiterstruktur
DE60333424D1 (de) Lichtemittierende Vorrichtung
DE50309549D1 (de) Strahlungsemittierendes halbleiterbauelement
DE602004020300D1 (de) Licht emittierendes Halbleiterbauelement
DE60327115D1 (de) Halbleiterbauelement
DE60322459D1 (de) Halbleitervorrichtung

Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition