DE60314355D1 - Einschnappbarer Kühlkörper für Halbleiterbauelemente - Google Patents

Einschnappbarer Kühlkörper für Halbleiterbauelemente

Info

Publication number
DE60314355D1
DE60314355D1 DE60314355T DE60314355T DE60314355D1 DE 60314355 D1 DE60314355 D1 DE 60314355D1 DE 60314355 T DE60314355 T DE 60314355T DE 60314355 T DE60314355 T DE 60314355T DE 60314355 D1 DE60314355 D1 DE 60314355D1
Authority
DE
Germany
Prior art keywords
snap
heat sink
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60314355T
Other languages
English (en)
Other versions
DE60314355T2 (de
Inventor
Dennis R Sigl
Richard Mark Achtner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of DE60314355D1 publication Critical patent/DE60314355D1/de
Application granted granted Critical
Publication of DE60314355T2 publication Critical patent/DE60314355T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE60314355T 2002-11-20 2003-10-10 Einschnappbarer Kühlkörper für Halbleiterbauelemente Expired - Lifetime DE60314355T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65794 2002-11-20
US10/065,794 US6633485B1 (en) 2002-11-20 2002-11-20 Snap-in heat sink for semiconductor mounting

Publications (2)

Publication Number Publication Date
DE60314355D1 true DE60314355D1 (de) 2007-07-26
DE60314355T2 DE60314355T2 (de) 2008-02-07

Family

ID=28789706

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60314355T Expired - Lifetime DE60314355T2 (de) 2002-11-20 2003-10-10 Einschnappbarer Kühlkörper für Halbleiterbauelemente

Country Status (4)

Country Link
US (2) US6633485B1 (de)
EP (1) EP1422982B1 (de)
JP (1) JP4202895B2 (de)
DE (1) DE60314355T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6870131B2 (en) * 2002-10-31 2005-03-22 Illinois Tool Works Inc. Mounting receptacle for welding apparatus component
US7360586B2 (en) * 2003-07-31 2008-04-22 Fujitsu Limited Wrap around heat sink apparatus and method
US20060273824A1 (en) * 2005-06-06 2006-12-07 Sauer-Danfoss Inc. High current switching circuit for a motor drive three phase inverter for mobile equipment
US7324342B2 (en) * 2005-10-19 2008-01-29 Delphi Technologies, Inc. Electronics assembly and electronics package carrier therefor
US8857195B2 (en) * 2006-12-26 2014-10-14 Nkk Co., Ltd. Absorbent for spray can, process for producing absorbent sheet for spray can, and spray can product
DE102007014789B3 (de) * 2007-03-28 2008-11-06 Ixys Ch Gmbh Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul
CN101730445B (zh) * 2008-10-20 2012-11-21 富准精密工业(深圳)有限公司 散热装置
CN102026522A (zh) * 2009-09-17 2011-04-20 富准精密工业(深圳)有限公司 散热模组
CN102639932B (zh) 2009-09-24 2014-05-28 莫列斯公司 发光模块***
CN104075294B (zh) 2009-10-12 2017-04-12 莫列斯公司 发光模块***
JP5236771B2 (ja) * 2011-04-18 2013-07-17 株式会社ソニー・コンピュータエンタテインメント 電子機器
KR101228841B1 (ko) * 2011-10-04 2013-02-04 엘에스산전 주식회사 일체형 탄성클립을 이용한 전력용반도체 고정장치
US9289844B2 (en) 2013-06-24 2016-03-22 Illinois Tool Works Inc. Power supply chassis
US9592565B2 (en) 2013-06-24 2017-03-14 Illinois Tool Works Inc. Integrated electrical components of a welding power supply
JP6146364B2 (ja) * 2014-03-31 2017-06-14 富士電機株式会社 電力変換装置
US10955881B2 (en) * 2017-05-02 2021-03-23 Seagate Technology Llc Memory module cooling assembly
US10721840B2 (en) 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly
US11678444B2 (en) 2019-05-15 2023-06-13 Intel Corporation Loading mechanism with integrated heatsink
CN112787118A (zh) * 2019-11-08 2021-05-11 泰科电子(上海)有限公司 背板组件和电子装置
KR20210128775A (ko) * 2020-04-17 2021-10-27 엘지이노텍 주식회사 방열판 및 이를 포함하는 컨버터
US11800687B2 (en) 2021-08-26 2023-10-24 Dish Network L.L.C. Heat transfer assembly

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USD260388S (en) 1979-10-22 1981-08-25 Thermalloy Incorporated Heat sink or similar apparatus
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US4388967A (en) 1980-09-02 1983-06-21 Thermalloy Incorporated Solderable mounting stakes for heat sinks
USD267942S (en) 1980-11-21 1983-02-15 Aavid Engineering, Inc. Heat-sink for electronic semiconductor devices
USD269084S (en) 1981-04-08 1983-05-24 Aavid Engineering, Inc. Dual heat sink for electronic semiconductor devices
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USD268666S (en) 1981-05-18 1983-04-19 Thermalloy Incorporated Heat sink or similar article
USD269606S (en) 1981-05-26 1983-07-05 Thermalloy Incorporated Heat sink or similar article
USD268667S (en) 1981-05-28 1983-04-19 Thermalloy Incorporated Heat sink or similar article
US4446504A (en) 1981-06-08 1984-05-01 Thermalloy Incorporated Mounting means with solderable studs
USD272902S (en) 1981-12-09 1984-03-06 Aavid Engineering, Inc. Self-fastened heat sink
US4471837A (en) 1981-12-28 1984-09-18 Aavid Engineering, Inc. Graphite heat-sink mountings
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USD275648S (en) 1982-09-30 1984-09-25 Aavid Engineering, Inc. Stud-mounted heat sink for electronic devices
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USD275666S (en) 1982-09-30 1984-09-25 Aavid Engineering, Inc. Asymmetric heat sink for electronic devices
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USD280319S (en) 1983-07-29 1985-08-27 Aavid Engineering, Inc. Staggered-fin heat sink for electrical devices
USD283418S (en) * 1983-07-29 1986-04-15 Aavid Engineering, Inc. Clip-on heat sink for electronic devices
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DE3335377A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
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USD287121S (en) * 1984-04-23 1986-12-09 Aavid Engineering, Inc. Sheet-metal heat sink for electronic devices
USD285301S (en) * 1984-04-23 1986-08-26 Aavid Engineering, Inc. Pinned heat-sink extrusion for circuit-board mounting
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USD284851S (en) 1984-07-02 1986-07-29 Thermalloy Incorporated Heat sink or similar article
US4679118A (en) * 1984-08-07 1987-07-07 Aavid Engineering, Inc. Electronic chip-carrier heat sinks
US4625260A (en) 1984-08-24 1986-11-25 Thermalloy Incorporated Fasteners for surface mounting of printed circuit board components
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USD285194S (en) * 1984-10-24 1986-08-19 Aavid Engineering, Inc. Heat sink for integrated-circuit chip carrier
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US4609040A (en) 1985-04-01 1986-09-02 Thermalloy Incorporated Self-securing heat sink
USD295281S (en) * 1985-04-01 1988-04-19 Thermalloy Incorporated Heat sink or similar article
US4588028A (en) 1985-05-06 1986-05-13 Thermalloy Incorporated Heat sink and method of manufacture
USD296323S (en) * 1985-05-09 1988-06-21 Aavid Engineering, Inc. Extruded-heat-sink with spring clip
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Also Published As

Publication number Publication date
JP4202895B2 (ja) 2008-12-24
EP1422982A2 (de) 2004-05-26
JP2004172618A (ja) 2004-06-17
EP1422982B1 (de) 2007-06-13
US20040201964A1 (en) 2004-10-14
DE60314355T2 (de) 2008-02-07
EP1422982A3 (de) 2006-01-11
US6633485B1 (en) 2003-10-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition