DE60311765D1 - Leiterplatte für Hochgeschwindigkeitskommunikation - Google Patents

Leiterplatte für Hochgeschwindigkeitskommunikation

Info

Publication number
DE60311765D1
DE60311765D1 DE60311765T DE60311765T DE60311765D1 DE 60311765 D1 DE60311765 D1 DE 60311765D1 DE 60311765 T DE60311765 T DE 60311765T DE 60311765 T DE60311765 T DE 60311765T DE 60311765 D1 DE60311765 D1 DE 60311765D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
high speed
speed communication
communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60311765T
Other languages
English (en)
Other versions
DE60311765T2 (de
Inventor
Yuichiro Murata
Naoki Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE60311765D1 publication Critical patent/DE60311765D1/de
Publication of DE60311765T2 publication Critical patent/DE60311765T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
DE60311765T 2003-03-07 2003-12-11 Leiterplatte für Hochgeschwindigkeitskommunikation Expired - Lifetime DE60311765T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003061818A JP4233360B2 (ja) 2003-03-07 2003-03-07 高速通信用プリント配線基板
JP2003061818 2003-03-07

Publications (2)

Publication Number Publication Date
DE60311765D1 true DE60311765D1 (de) 2007-03-29
DE60311765T2 DE60311765T2 (de) 2007-10-31

Family

ID=32767880

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60311765T Expired - Lifetime DE60311765T2 (de) 2003-03-07 2003-12-11 Leiterplatte für Hochgeschwindigkeitskommunikation

Country Status (5)

Country Link
US (1) US7151675B2 (de)
EP (1) EP1458225B1 (de)
JP (1) JP4233360B2 (de)
CN (1) CN1271898C (de)
DE (1) DE60311765T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9013450B1 (en) * 2003-11-03 2015-04-21 Imaging Systems Technology, Inc. IR touch
JP4186972B2 (ja) * 2005-09-28 2008-11-26 松下電器産業株式会社 基板間接続用シート状デバイスおよび接続構造体
JP4860990B2 (ja) * 2005-11-29 2012-01-25 キヤノン株式会社 回路接続構造およびプリント回路板
JPWO2009022374A1 (ja) * 2007-08-10 2010-11-04 富士通テレコムネットワークス株式会社 ｘＤＳＬ通信システム
JP2020178967A (ja) * 2019-04-26 2020-11-05 株式会社三共 遊技機

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3237968B2 (ja) * 1993-08-18 2001-12-10 富士通株式会社 半導体素子モジュール
US5530623A (en) * 1993-11-19 1996-06-25 Ncr Corporation High speed memory packaging scheme
JP2882266B2 (ja) * 1993-12-28 1999-04-12 株式会社日立製作所 信号伝送装置及び回路ブロック
JP3407469B2 (ja) * 1995-04-17 2003-05-19 株式会社日立製作所 情報処置装置
US5734208A (en) * 1996-06-14 1998-03-31 Dell Usa, L.P. Dynamic termination for signal buses going to a connector
US6219733B1 (en) 1998-08-26 2001-04-17 International Business Machines Corporation Transmission line loop
US6115278A (en) * 1999-02-09 2000-09-05 Silicon Graphics, Inc. Memory system with switching for data isolation
JP3621608B2 (ja) 1999-07-28 2005-02-16 ケル株式会社 マザーボード
US6308232B1 (en) * 1999-09-01 2001-10-23 Rambus Inc. Electronically moveable terminator and method for using same in a memory system
US6496380B1 (en) 2000-08-24 2002-12-17 High Connection Density, Inc. High capacity memory module with high electrical design margins
US6674648B2 (en) * 2001-07-23 2004-01-06 Intel Corporation Termination cards and systems therefore

Also Published As

Publication number Publication date
DE60311765T2 (de) 2007-10-31
EP1458225A2 (de) 2004-09-15
US20050174747A1 (en) 2005-08-11
CN1271898C (zh) 2006-08-23
EP1458225B1 (de) 2007-02-14
EP1458225A3 (de) 2005-10-26
CN1527652A (zh) 2004-09-08
US7151675B2 (en) 2006-12-19
JP4233360B2 (ja) 2009-03-04
JP2004273725A (ja) 2004-09-30

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