DE60227019D1 - Herstellungsverfahren für SOI-MOSFET - Google Patents

Herstellungsverfahren für SOI-MOSFET

Info

Publication number
DE60227019D1
DE60227019D1 DE60227019T DE60227019T DE60227019D1 DE 60227019 D1 DE60227019 D1 DE 60227019D1 DE 60227019 T DE60227019 T DE 60227019T DE 60227019 T DE60227019 T DE 60227019T DE 60227019 D1 DE60227019 D1 DE 60227019D1
Authority
DE
Germany
Prior art keywords
soi
mosfet
production method
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60227019T
Other languages
English (en)
Inventor
Albert Oscar Adan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE60227019D1 publication Critical patent/DE60227019D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78696Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26586Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/66772Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78612Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE60227019T 2001-02-02 2002-02-01 Herstellungsverfahren für SOI-MOSFET Expired - Fee Related DE60227019D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001027117A JP3531671B2 (ja) 2001-02-02 2001-02-02 Soimosfet及びその製造方法

Publications (1)

Publication Number Publication Date
DE60227019D1 true DE60227019D1 (de) 2008-07-24

Family

ID=18891826

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60227019T Expired - Fee Related DE60227019D1 (de) 2001-02-02 2002-02-01 Herstellungsverfahren für SOI-MOSFET

Country Status (7)

Country Link
US (1) US6627505B2 (de)
EP (1) EP1229576B1 (de)
JP (1) JP3531671B2 (de)
KR (1) KR100466061B1 (de)
CN (1) CN1194395C (de)
DE (1) DE60227019D1 (de)
TW (1) TW544844B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270846A (ja) * 2001-03-12 2002-09-20 Oki Electric Ind Co Ltd 半導体装置の製造方法
US6869884B2 (en) * 2002-08-22 2005-03-22 Chartered Semiconductor Manufacturing Ltd. Process to reduce substrate effects by forming channels under inductor devices and around analog blocks
CN1806342A (zh) * 2003-06-11 2006-07-19 皇家飞利浦电子股份有限公司 在集成soi工艺中防止寄生沟道
JP4439358B2 (ja) 2003-09-05 2010-03-24 株式会社東芝 電界効果トランジスタ及びその製造方法
US6830963B1 (en) * 2003-10-09 2004-12-14 Micron Technology, Inc. Fully depleted silicon-on-insulator CMOS logic
US20050195627A1 (en) * 2003-11-18 2005-09-08 Hutchens Chriswell G. High-temperature memory systems
US6949420B1 (en) * 2004-03-12 2005-09-27 Sony Corporation Silicon-on-insulator (SOI) substrate having dual surface crystallographic orientations and method of forming same
US7298008B2 (en) * 2006-01-20 2007-11-20 International Business Machines Corporation Electrostatic discharge protection device and method of fabricating same
JP2007214495A (ja) * 2006-02-13 2007-08-23 Oki Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
JPWO2007136102A1 (ja) * 2006-05-23 2009-10-01 日本電気株式会社 集積回路、及び半導体装置の製造方法
JP5500771B2 (ja) 2006-12-05 2014-05-21 株式会社半導体エネルギー研究所 半導体装置及びマイクロプロセッサ
JP5653586B2 (ja) * 2009-03-05 2015-01-14 セイコーエプソン株式会社 半導体装置及びその製造方法
FR2983635B1 (fr) * 2011-12-05 2014-05-23 Soitec Silicon On Insulator Structure semiconducteur sur isolant avec des caracteristiques electriques ameliorees
US8759916B2 (en) * 2012-01-27 2014-06-24 International Business Machines Corporation Field effect transistor and a method of forming the transistor
KR20160055563A (ko) * 2014-11-10 2016-05-18 삼성디스플레이 주식회사 박막트랜지스터 제조방법, 박막트랜지스터 및 이를 구비한 디스플레이 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521800A (ja) * 1991-07-11 1993-01-29 Victor Co Of Japan Ltd Soimosfet
JPH06268215A (ja) * 1993-03-10 1994-09-22 Hitachi Ltd Mis型半導体装置
JPH08250687A (ja) * 1995-03-08 1996-09-27 Komatsu Electron Metals Co Ltd Soi基板の製造方法およびsoi基板
US5656844A (en) * 1995-07-27 1997-08-12 Motorola, Inc. Semiconductor-on-insulator transistor having a doping profile for fully-depleted operation
US5719081A (en) * 1995-11-03 1998-02-17 Motorola, Inc. Fabrication method for a semiconductor device on a semiconductor on insulator substrate using a two stage threshold adjust implant
JP3222380B2 (ja) * 1996-04-25 2001-10-29 シャープ株式会社 電界効果トランジスタ、および、cmosトランジスタ
JPH11214686A (ja) * 1998-01-27 1999-08-06 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP3531671B2 (ja) 2004-05-31
US6627505B2 (en) 2003-09-30
US20020177286A1 (en) 2002-11-28
CN1194395C (zh) 2005-03-23
EP1229576A2 (de) 2002-08-07
EP1229576B1 (de) 2008-06-11
EP1229576A3 (de) 2004-10-27
KR100466061B1 (ko) 2005-01-13
CN1369903A (zh) 2002-09-18
KR20020064674A (ko) 2002-08-09
TW544844B (en) 2003-08-01
JP2002231960A (ja) 2002-08-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee