DE60226512D1 - Kassette zum speichern mehrerer halbleiterwaferlagen - Google Patents

Kassette zum speichern mehrerer halbleiterwaferlagen

Info

Publication number
DE60226512D1
DE60226512D1 DE60226512T DE60226512T DE60226512D1 DE 60226512 D1 DE60226512 D1 DE 60226512D1 DE 60226512 T DE60226512 T DE 60226512T DE 60226512 T DE60226512 T DE 60226512T DE 60226512 D1 DE60226512 D1 DE 60226512D1
Authority
DE
Germany
Prior art keywords
waects
cassette
multiple semiconductor
saving multiple
saving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60226512T
Other languages
English (en)
Inventor
Masatoshi Nanjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Application granted granted Critical
Publication of DE60226512D1 publication Critical patent/DE60226512D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60226512T 2002-11-26 2002-11-26 Kassette zum speichern mehrerer halbleiterwaferlagen Expired - Lifetime DE60226512D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/012313 WO2004049430A1 (ja) 2002-11-26 2002-11-26 複数枚の半導体ウエーハを収容するためのカセット

Publications (1)

Publication Number Publication Date
DE60226512D1 true DE60226512D1 (de) 2008-06-19

Family

ID=32375604

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60226512T Expired - Lifetime DE60226512D1 (de) 2002-11-26 2002-11-26 Kassette zum speichern mehrerer halbleiterwaferlagen

Country Status (6)

Country Link
US (1) US7325692B2 (de)
EP (1) EP1487009B1 (de)
CN (1) CN1316583C (de)
AU (1) AU2002355034A1 (de)
DE (1) DE60226512D1 (de)
WO (1) WO2004049430A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1316583C (zh) 2002-11-26 2007-05-16 株式会社迪斯科 用于储存多个半导体片的盒子
JP4509713B2 (ja) * 2004-09-13 2010-07-21 大日商事株式会社 ウエハキャリア
JP4523513B2 (ja) * 2005-08-05 2010-08-11 東京エレクトロン株式会社 基板受け渡し装置、基板受け渡し方法及び記憶媒体
KR101075512B1 (ko) * 2005-12-06 2011-10-21 후지쯔 세미컨덕터 가부시키가이샤 반도체 웨이퍼의 수납 케이스 및 반도체 웨이퍼의 수납방법
KR20150110207A (ko) * 2014-03-24 2015-10-02 주식회사 테라세미콘 보트
JP6617433B2 (ja) * 2015-04-17 2019-12-11 日本電気硝子株式会社 ガラス基板梱包体
JP6685213B2 (ja) * 2016-09-29 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法
CN108615692B (zh) * 2016-12-12 2021-04-09 北京北方华创微电子装备有限公司 片盒、反应腔室和半导体设备
JP6846993B2 (ja) * 2017-06-19 2021-03-24 東京エレクトロン株式会社 基板保持具及びこれを用いた基板処理装置
JP1624353S (de) * 2018-07-19 2019-02-12
JP7357453B2 (ja) * 2019-03-07 2023-10-06 東京エレクトロン株式会社 基板処理システムおよび基板の搬送方法
CN112477092B (zh) * 2019-09-12 2022-10-14 福州康派克光电科技有限公司 真空自吸附盒成型装置及成型方法
US20220148899A1 (en) * 2020-11-06 2022-05-12 Changxin Memory Technologies, Inc. Wafer boat structure, as well as wafer boat assembly and diffusion furnace with same
JP1700781S (de) * 2021-03-22 2021-11-29

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178541A (ja) * 1987-01-20 1988-07-22 Nec Corp ウエ−ハ収納箱
JPS63195736U (de) * 1987-06-05 1988-12-16
JPH06103720B2 (ja) * 1989-10-09 1994-12-14 株式会社東芝 半導体ウェハ支持キャリア
DE4024973C2 (de) * 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
JPH05102056A (ja) * 1991-10-11 1993-04-23 Rohm Co Ltd ウエハー支持具
US5346518A (en) * 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
JP3233726B2 (ja) 1993-03-30 2001-11-26 川崎製鉄株式会社 熱処理生産性ならびに繰り返し応力負荷によるミクロ組織変化の遅延特性に優れた軸受鋼
US6156121A (en) * 1996-12-19 2000-12-05 Tokyo Electron Limited Wafer boat and film formation method
JP3494554B2 (ja) * 1997-06-26 2004-02-09 東芝セラミックス株式会社 半導体用治具およびその製造方法
JP2937194B1 (ja) * 1998-07-15 1999-08-23 日本電気株式会社 基板加熱装置
JP2000091400A (ja) * 1998-09-08 2000-03-31 Disco Abrasive Syst Ltd ウェーハ収容カセット
US6310328B1 (en) * 1998-12-10 2001-10-30 Mattson Technologies, Inc. Rapid thermal processing chamber for processing multiple wafers
WO2001001828A1 (en) 1999-07-02 2001-01-11 Spi/Semicon Wafer container
EP1091391A1 (de) * 1999-10-05 2001-04-11 SICO Produktions- und Handelsges.m.b.H. Haltevorrichtung für Halbleiterscheiben
CN1316583C (zh) 2002-11-26 2007-05-16 株式会社迪斯科 用于储存多个半导体片的盒子

Also Published As

Publication number Publication date
AU2002355034A1 (en) 2004-06-18
EP1487009A4 (de) 2007-04-11
US20040256284A1 (en) 2004-12-23
EP1487009A1 (de) 2004-12-15
EP1487009B1 (de) 2008-05-07
CN1618125A (zh) 2005-05-18
US7325692B2 (en) 2008-02-05
WO2004049430A1 (ja) 2004-06-10
CN1316583C (zh) 2007-05-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition