JP7357453B2 - 基板処理システムおよび基板の搬送方法 - Google Patents
基板処理システムおよび基板の搬送方法 Download PDFInfo
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description
図1は、一実施形態に係る基板処理システムの概略構成図である。基板処理システム1は、複数の真空処理室(プロセスモジュールとも呼ぶ。)PM1~PM8と、真空搬送室10と、常圧搬送室20と、を備える。基板処理システム1はさらに、複数のロードロックモジュールLLM1~LLM2と、複数のロードポートLP1~LP5と、アライナAUと、制御装置30と、を備える。なお、図1に示す真空処理室、ロードロックモジュール、ロードポートは例示であって、各部の数は図1に示す数に限定されない。
図2は、一実施形態に係る保管容器の一例を示す概略構成図である。図2に示す保管容器はER用FOUP100である。ER用FOUP100は、所定の厚みT1を有する使用済みのエッジリングER1~ER6と、未使用のエッジリングER7~ER12と、を収納可能に構成される。ただし、ER用FOUP100は12以外の数のエッジリングERを収納可能に構成してもよい。各エッジリングER1~ER12は、ER用FOUP100の正面に形成された開口105を通して搬入出される。開口105には図示しない開閉可能な蓋が設けられている。エッジリングER1~ER12は、ER用FOUP100の両側面の内壁に一定間隔で設けられたスロットS1~S13のうち、スロットS1~S6およびS8~S13に1枚ずつ収容される。各スロットS1~S6,S8~S13は、たとえば略V字型の断面形状を有し、それぞれエッジリングER1~ER12の周縁部を余裕(遊び)をもって収容する(図5参照)。スロットS1~S13は、収容部の一例である。
図4は、一実施形態に係る基板処理システム1にウエハ用FOUPが設置された状態を示す図である。図5は、ウエハ用FOUPのスロットにウエハが配置された状態を示す図である。ER用FOUPが設置されたときも同様の状態となる。
図8は、一実施形態に係る基板の搬送方法の流れの一例を示すフローチャートである。たとえば、オペレータが手動で第2搬送機構25を操作してウエハWをFOUPに搬入するときに、制御装置30により図8の処理が実行される。
上記のように、一実施形態に係る消耗部品の保管容器は、複数の収容部と、仕切り板と、固定部と、を備える。複数の収容部は、一方向から搬入出される消耗部品を一つずつ収容可能に構成される。仕切り板は、検知部が備える発光部と受光部との間に挟まれるよう構成される第1部分を有し、複数の収容部の一つに収容可能に構成される。固定部は、消耗部品を複数の収容部から搬入出可能に搬送経路上に固定する。このため、保管容器は、検知部に仕切り板の存在を検知させることができる。
10 真空搬送室
15 第1搬送機構
20 常圧搬送室
20a 境界壁
20b 窓部
20c 窓部開閉機構
201 載置台
202a,202b 固定部
25 第2搬送機構
25a アーム
25c ロッド
25d 基台
25p 発光部
25r 受光部
27a 第1のピック
27b 第2のピック
30 制御装置
31 記憶部
32 処理部
33 入出力インタフェース
34 表示部
110 仕切り板
111 封止部
112a 第1の切欠き
112b 第2の切欠き
113 第1部分
ER1~ER12 エッジリング
LLM1,LLM2 ロードロックモジュール
LP1~LP5 ロードポート
MS マッピングセンサ
P1~P7 パッド
PM1~PM8 プロセスモジュール(真空処理室)
GV ゲートバルブ
S1~S13 スロット
W1~W25 ウエハ
Claims (6)
- 消耗部品が配置され基板を処理するための処理空間を提供する真空処理室と、
前記真空処理室と、前記消耗部品および前記基板のいずれか一方を収納する保管容器と、の間の搬送経路上に設けられ、前記消耗部品および前記基板を搬送するアームと、
前記アームの先端に設けられたピックの第1端に配置される発光部と前記ピックの第2端に配置される受光部とを有する検知部と、
前記保管容器内に配置された部品の厚みを前記検知部に検知させ、検知した厚みが前記基板の厚みを超える場合に、前記アームによる前記基板の搬送を停止させる制御部と、
を備え、
前記保管容器は、
一方向から搬入出される消耗部品を一つずつ収容可能に構成される複数の収容部と、
前記検知部が備える前記発光部と前記受光部との間に挟まれるよう構成される第1部分を有し、前記複数の収容部の一つに収容可能に構成される仕切り板と、
前記消耗部品を前記複数の収容部から搬入出可能に搬送経路上に固定する固定部と、
を備える基板処理システム。 - 前記仕切り板は、基板よりも厚い、請求項1に記載の基板処理システム。
- 前記仕切り板は、前記消耗部品と略同一の厚みを有する、請求項1または2に記載の基板処理システム。
- 前記仕切り板は、前記保管容器の壁面に密着し前記複数の収容部を第1空間と第2空間とに分離する、請求項1から3のいずれか1項に記載の基板処理システム。
- 前記第1部分は、前記発光部および前記受光部それぞれの形状に対応した形状を有する二つの切欠き部に挟まれた部分である、請求項1から4のいずれか1項に記載の基板処理システム。
- 真空処理室に配置される消耗部品および真空処理室で処理される基板を搬送するピックの第1端に配置される発光部と前記ピックの第2端に配置される受光部とを備えた検知部により、前記消耗部品および前記基板の搬送経路上に配置され、前記消耗部品または基板のいずれか一方を収納する保管容器内に配置された部品の厚みを検知し、
検知した厚みが前記基板の厚みを超える場合に前記基板の搬送を停止し、
前記保管容器は、
一方向から搬入出される消耗部品を一つずつ収容可能に構成される複数の収容部と、
前記検知部が備える前記発光部と前記受光部との間に挟まれるよう構成される第1部分を有し、前記複数の収容部の一つに収容可能に構成される仕切り板と、
前記消耗部品を前記複数の収容部から搬入出可能に搬送経路上に固定する固定部と、
を備える、
基板の搬送方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2019041408A JP7357453B2 (ja) | 2019-03-07 | 2019-03-07 | 基板処理システムおよび基板の搬送方法 |
TW109105782A TW202043123A (zh) | 2019-03-07 | 2020-02-24 | 保存容器之分隔板、保存容器、基板處理系統及基板之搬運方法 |
CN202010118940.6A CN111668142A (zh) | 2019-03-07 | 2020-02-26 | 分隔板、保管容器、基片处理***和基片的输送方法 |
KR1020200025057A KR20200107810A (ko) | 2019-03-07 | 2020-02-28 | 보관 용기의 칸막이판, 보관 용기, 기판 처리 시스템 및 기판의 반송 방법 |
US16/809,741 US11735448B2 (en) | 2019-03-07 | 2020-03-05 | Container, container partition plate, substrate processing system, and substrate transfer method |
US18/198,928 US20230290660A1 (en) | 2019-03-07 | 2023-05-18 | Container, container partition plate, substrate processing system, and substrate transfer method |
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US11004713B2 (en) * | 2019-05-16 | 2021-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robot arm device and method for transferring wafer |
US20220084854A1 (en) * | 2020-09-16 | 2022-03-17 | Changxin Memory Technologies, Inc. | Wafer transferring device |
TW202232624A (zh) * | 2020-10-26 | 2022-08-16 | 日商東京威力科創股份有限公司 | 處理系統及搬運方法 |
US11996308B2 (en) * | 2021-03-03 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for mapping wafers in a wafer carrier |
KR102496544B1 (ko) * | 2021-08-10 | 2023-02-07 | 권재헌 | 웨이퍼 안착 상태 감지기능을 구비하는 웨이퍼 버퍼 |
CN114823441B (zh) * | 2022-06-28 | 2022-09-02 | 深圳市星国华先进装备科技有限公司 | 一种针测机传输机构晶圆防滑出保护装置 |
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2020
- 2020-02-24 TW TW109105782A patent/TW202043123A/zh unknown
- 2020-02-26 CN CN202010118940.6A patent/CN111668142A/zh active Pending
- 2020-02-28 KR KR1020200025057A patent/KR20200107810A/ko not_active Application Discontinuation
- 2020-03-05 US US16/809,741 patent/US11735448B2/en active Active
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2023
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Also Published As
Publication number | Publication date |
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TW202043123A (zh) | 2020-12-01 |
US20200286752A1 (en) | 2020-09-10 |
US20230290660A1 (en) | 2023-09-14 |
JP2020145333A (ja) | 2020-09-10 |
CN111668142A (zh) | 2020-09-15 |
US11735448B2 (en) | 2023-08-22 |
KR20200107810A (ko) | 2020-09-16 |
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