DE60212664D1 - Verbesserte zusammensetzungen, verfahren und vorrichtungen für ein bleifreies hochtemperaturlot - Google Patents

Verbesserte zusammensetzungen, verfahren und vorrichtungen für ein bleifreies hochtemperaturlot

Info

Publication number
DE60212664D1
DE60212664D1 DE60212664T DE60212664T DE60212664D1 DE 60212664 D1 DE60212664 D1 DE 60212664D1 DE 60212664 T DE60212664 T DE 60212664T DE 60212664 T DE60212664 T DE 60212664T DE 60212664 D1 DE60212664 D1 DE 60212664D1
Authority
DE
Germany
Prior art keywords
lead
methods
devices
free high
improved compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60212664T
Other languages
English (en)
Other versions
DE60212664T2 (de
Inventor
Nancy Dean
John Lalena
Martin Weiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Application granted granted Critical
Publication of DE60212664D1 publication Critical patent/DE60212664D1/de
Publication of DE60212664T2 publication Critical patent/DE60212664T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
DE60212664T 2001-09-25 2002-09-25 Verbesserte zusammensetzungen, verfahren und vorrichtungen für ein bleifreies hochtemperaturlot Expired - Lifetime DE60212664T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32489101P 2001-09-25 2001-09-25
US324891P 2001-09-25
PCT/US2002/030608 WO2003026828A2 (en) 2001-09-25 2002-09-25 Improved compositions, methods and devices for high temperature lead-free solder

Publications (2)

Publication Number Publication Date
DE60212664D1 true DE60212664D1 (de) 2006-08-03
DE60212664T2 DE60212664T2 (de) 2007-06-21

Family

ID=23265546

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60212664T Expired - Lifetime DE60212664T2 (de) 2001-09-25 2002-09-25 Verbesserte zusammensetzungen, verfahren und vorrichtungen für ein bleifreies hochtemperaturlot

Country Status (8)

Country Link
EP (1) EP1429884B1 (de)
JP (1) JP2005503926A (de)
KR (1) KR100700232B1 (de)
CN (1) CN1558960A (de)
AU (1) AU2002334686A1 (de)
DE (1) DE60212664T2 (de)
TW (2) TW504427B (de)
WO (1) WO2003026828A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639791B2 (ja) * 2004-12-20 2011-02-23 パナソニック株式会社 はんだ材料の生産方法
JP5067163B2 (ja) * 2005-11-11 2012-11-07 千住金属工業株式会社 ソルダペーストとはんだ継手
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
CH696344A5 (fr) * 2006-02-22 2007-04-30 Ses Soc En Solaire Sa Film support et procédé de couplage de cellules photovoltaïques.
JP4822526B2 (ja) * 2006-09-15 2011-11-24 株式会社豊田中央研究所 接合体
JP5383795B2 (ja) 2009-04-22 2014-01-08 パナソニック株式会社 半導体装置
US9211614B2 (en) * 2010-06-16 2015-12-15 Sumitomo Metal Mining Co., Ltd. Bi—Al—Zn—based Pb-free solder alloy
JP5464113B2 (ja) * 2010-10-04 2014-04-09 住友金属鉱山株式会社 Ｇｅを含有するＰｂフリーはんだ合金
US10137536B2 (en) 2011-12-27 2018-11-27 Senju Metal Industry Co., Ltd. Sn-Cu-based lead-free solder alloy
JP6038187B2 (ja) 2013-01-28 2016-12-07 ニホンハンダ株式会社 ダイボンド接合用はんだ合金
WO2014179108A1 (en) 2013-05-03 2014-11-06 Honeywell International Inc. Lead frame construct for lead-free solder connections
JP6020433B2 (ja) * 2013-12-09 2016-11-02 富士通株式会社 電子装置
CN107151748B (zh) * 2016-03-02 2019-08-06 广州先艺电子科技有限公司 一种金锗合金焊料的熔炼方法
JP7010099B2 (ja) * 2018-03-20 2022-01-26 株式会社Ｇｓユアサ 負極活物質、負極及び非水電解質蓄電素子
FR3087369B1 (fr) * 2018-10-19 2021-06-04 Dehon Sa Alliage de brasure et utilisation d'un tel alliage
WO2021123896A1 (en) * 2019-12-20 2021-06-24 Arcelormittal Metal powder for additive manufacturing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4709849A (en) * 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
JP3249774B2 (ja) * 1997-06-05 2002-01-21 トヨタ自動車株式会社 摺動部材
JP3829475B2 (ja) * 1998-05-13 2006-10-04 株式会社村田製作所 Ｃｕ系母材接合用のはんだ組成物
AU4974500A (en) * 1999-04-22 2000-11-10 International Rectifier Corporation Chip scale package
JP4338854B2 (ja) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 スズ−ビスマス系無鉛はんだ
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品

Also Published As

Publication number Publication date
EP1429884A2 (de) 2004-06-23
CN1558960A (zh) 2004-12-29
KR100700232B1 (ko) 2007-03-26
TW504427B (en) 2002-10-01
JP2005503926A (ja) 2005-02-10
WO2003026828A3 (en) 2003-06-19
TW586982B (en) 2004-05-11
DE60212664T2 (de) 2007-06-21
AU2002334686A1 (en) 2003-04-07
EP1429884A4 (de) 2004-10-20
EP1429884B1 (de) 2006-06-21
KR20040035863A (ko) 2004-04-29
WO2003026828A2 (en) 2003-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition