DE602009001198D1 - Elektronisches Modul mit Wärme-/Kühleinsatz - Google Patents

Elektronisches Modul mit Wärme-/Kühleinsatz

Info

Publication number
DE602009001198D1
DE602009001198D1 DE200960001198 DE602009001198T DE602009001198D1 DE 602009001198 D1 DE602009001198 D1 DE 602009001198D1 DE 200960001198 DE200960001198 DE 200960001198 DE 602009001198 T DE602009001198 T DE 602009001198T DE 602009001198 D1 DE602009001198 D1 DE 602009001198D1
Authority
DE
Germany
Prior art keywords
chamber
housing
electronic module
heat
projections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200960001198
Other languages
English (en)
Inventor
Roy A Visser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of DE602009001198D1 publication Critical patent/DE602009001198D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87265—Dividing into parallel flow paths with recombining

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE200960001198 2008-03-04 2009-02-25 Elektronisches Modul mit Wärme-/Kühleinsatz Active DE602009001198D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/074,424 US7876562B2 (en) 2008-03-04 2008-03-04 Electronic module having thermal cooling insert

Publications (1)

Publication Number Publication Date
DE602009001198D1 true DE602009001198D1 (de) 2011-06-16

Family

ID=40802014

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200960001198 Active DE602009001198D1 (de) 2008-03-04 2009-02-25 Elektronisches Modul mit Wärme-/Kühleinsatz

Country Status (4)

Country Link
US (1) US7876562B2 (de)
EP (1) EP2099275B1 (de)
AT (1) ATE508622T1 (de)
DE (1) DE602009001198D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7881059B2 (en) * 2008-01-29 2011-02-01 Finisar Corporation Heat management in an electronic module
US9119327B2 (en) * 2010-10-26 2015-08-25 Tdk-Lambda Corporation Thermal management system and method
TW201443383A (zh) * 2013-05-08 2014-11-16 Hon Hai Prec Ind Co Ltd 導風罩
US9674990B2 (en) * 2015-01-23 2017-06-06 Rockwell Automation Technoloies, Inc. Devices and methods for cooling bus capacitors
CA2978795A1 (en) 2015-03-16 2016-09-22 Dana Canada Corporation Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same
TWI624640B (zh) * 2017-01-25 2018-05-21 雙鴻科技股份有限公司 液冷式散熱裝置
US10508632B1 (en) 2019-08-22 2019-12-17 Stephen M. Constable Engine rail pressure system
US11672106B2 (en) * 2021-06-28 2023-06-06 Hamilton Sundstrand Corporation Chassis with thermal transfer fluid path

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1506722A (en) * 1919-10-16 1924-08-26 Allis Chalmers Mfg Co Method of producing spray nozzles
US2895508A (en) * 1955-11-23 1959-07-21 Patterson Kelley Company Inc Heat exchange conduit
US5841634A (en) * 1997-03-12 1998-11-24 Delco Electronics Corporation Liquid-cooled baffle series/parallel heat sink
US6604494B2 (en) * 1998-11-24 2003-08-12 Bombardier Motor Corporation Of America Water-cooled engine control
US6396692B1 (en) * 2000-07-27 2002-05-28 Motorola, Inc. Electronic control unit with integrated cooling module
DE10317705A1 (de) * 2003-04-17 2004-10-28 Robert Bosch Gmbh Gehäuse mit Kühlung für elektronische Steuergeräte, insbesondere in Kfz
DE102005025381A1 (de) * 2005-05-31 2006-12-07 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung von elekronischen Bauelementen
US8757246B2 (en) * 2006-06-06 2014-06-24 Raytheon Company Heat sink and method of making same

Also Published As

Publication number Publication date
ATE508622T1 (de) 2011-05-15
US7876562B2 (en) 2011-01-25
EP2099275A1 (de) 2009-09-09
EP2099275B1 (de) 2011-05-04
US20090225512A1 (en) 2009-09-10

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