ATE539449T1 - Chipkühler - Google Patents

Chipkühler

Info

Publication number
ATE539449T1
ATE539449T1 AT06076682T AT06076682T ATE539449T1 AT E539449 T1 ATE539449 T1 AT E539449T1 AT 06076682 T AT06076682 T AT 06076682T AT 06076682 T AT06076682 T AT 06076682T AT E539449 T1 ATE539449 T1 AT E539449T1
Authority
AT
Austria
Prior art keywords
fluid
channel
outlet
inlet
bulk region
Prior art date
Application number
AT06076682T
Other languages
English (en)
Inventor
Peter J Schubert
Bruce A Myers
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE539449T1 publication Critical patent/ATE539449T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT06076682T 2005-09-22 2006-09-08 Chipkühler ATE539449T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/232,499 US7294926B2 (en) 2005-09-22 2005-09-22 Chip cooling system

Publications (1)

Publication Number Publication Date
ATE539449T1 true ATE539449T1 (de) 2012-01-15

Family

ID=37663747

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06076682T ATE539449T1 (de) 2005-09-22 2006-09-08 Chipkühler

Country Status (3)

Country Link
US (1) US7294926B2 (de)
EP (1) EP1768179B1 (de)
AT (1) ATE539449T1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070126103A1 (en) * 2005-12-01 2007-06-07 Intel Corporation Microelectronic 3-D package defining thermal through vias and method of making same
US7999375B2 (en) * 2006-10-11 2011-08-16 Formfactor, Inc. Electronic device with integrated micromechanical contacts and cooling system
US7608924B2 (en) * 2007-05-03 2009-10-27 Delphi Technologies, Inc. Liquid cooled power electronic circuit comprising stacked direct die cooled packages
US7795726B2 (en) * 2007-05-03 2010-09-14 Delphi Technologies, Inc. Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
US7592697B2 (en) * 2007-08-27 2009-09-22 Intel Corporation Microelectronic package and method of cooling same
US8035223B2 (en) * 2007-08-28 2011-10-11 Research Triangle Institute Structure and process for electrical interconnect and thermal management
NL1034420C2 (nl) 2007-09-24 2009-03-26 Thales Nederland Bv Rechtstreeks geïnjecteerde gedwongen convectiekoeling voor elektronica.
US20100052157A1 (en) * 2008-08-29 2010-03-04 Micron Technology, Inc. Channel for a semiconductor die and methods of formation
US8624360B2 (en) * 2008-11-13 2014-01-07 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling channels in 3DIC stacks
US7782616B1 (en) 2009-04-23 2010-08-24 Delphi Technologies, Inc. Heat-dissipating component having stair-stepped coolant channels
US8198174B2 (en) * 2009-08-05 2012-06-12 International Business Machines Corporation Air channel interconnects for 3-D integration
US8563365B2 (en) * 2011-03-09 2013-10-22 Georgia Tech Research Corporation Air-gap C4 fluidic I/O interconnects and methods of fabricating same
US8730673B2 (en) 2011-05-27 2014-05-20 Lockheed Martin Corporation Fluid-cooled module for integrated circuit devices
US9035452B2 (en) * 2012-08-07 2015-05-19 General Electric Company Electronic device cooling with autonomous fluid routing and method of assembly
US8987892B2 (en) * 2013-05-10 2015-03-24 Raytheon Company Method for creating a selective solder seal interface for an integrated circuit cooling system
US9041193B2 (en) 2013-09-17 2015-05-26 Hamilton Sundstrand Corporation Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel
US20160025423A1 (en) * 2014-07-22 2016-01-28 Hamilton Sundstrand Space Systems International, Inc. Heat transfer plate
US9837254B2 (en) 2014-08-12 2017-12-05 Lam Research Corporation Differentially pumped reactive gas injector
US10825652B2 (en) 2014-08-29 2020-11-03 Lam Research Corporation Ion beam etch without need for wafer tilt or rotation
US9406535B2 (en) 2014-08-29 2016-08-02 Lam Research Corporation Ion injector and lens system for ion beam milling
US9536748B2 (en) * 2014-10-21 2017-01-03 Lam Research Corporation Use of ion beam etching to generate gate-all-around structure
US9373561B1 (en) 2014-12-18 2016-06-21 International Business Machines Corporation Integrated circuit barrierless microfluidic channel
CN107429976B (zh) 2015-03-16 2021-02-09 达纳加拿大公司 带有具有用于提高平坦度的表面图案的板的换热器和制造该换热器的方法
US9779955B2 (en) 2016-02-25 2017-10-03 Lam Research Corporation Ion beam etching utilizing cryogenic wafer temperatures
US10020243B2 (en) 2016-03-08 2018-07-10 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system
US10020242B2 (en) * 2016-04-14 2018-07-10 Hamilton Sundstrand Corporation Immersion cooling arrangements for electronic devices
US10121729B2 (en) * 2016-07-25 2018-11-06 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having a semiconductor device with metallized embedded cooling channels
US10615100B2 (en) * 2016-12-08 2020-04-07 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies and cooling structures having metalized exterior surface
US10847374B2 (en) 2017-10-31 2020-11-24 Lam Research Corporation Method for etching features in a stack
US10361092B1 (en) 2018-02-23 2019-07-23 Lam Research Corporation Etching features using metal passivation
CN110167252B (zh) * 2018-03-26 2020-05-05 扬宣电子(清远)有限公司 一种多层电路板及其制造方法
CN113519071A (zh) 2019-02-28 2021-10-19 朗姆研究公司 利用侧壁清洁的离子束蚀刻
US11406010B2 (en) * 2019-05-21 2022-08-02 Benchmark Electronics, Inc. Thermal management system and method therefor
US11387164B2 (en) * 2019-08-28 2022-07-12 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and manufacturing method thereof
US11996349B2 (en) * 2020-05-11 2024-05-28 Dr. Ing. H. C. F. Porsche Ag Power electronics for an electrical machine, drivetrain, motor vehicle
WO2023129092A1 (en) 2021-12-31 2023-07-06 Sabanci Üniversitesi Integrated circuit systems cooled by embedded microtubes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3236137B2 (ja) * 1993-07-30 2001-12-10 富士通株式会社 半導体素子冷却装置
US6018192A (en) * 1998-07-30 2000-01-25 Motorola, Inc. Electronic device with a thermal control capability
US20040132166A1 (en) * 2001-04-10 2004-07-08 Bioprocessors Corp. Determination and/or control of reactor environmental conditions
US20050032204A1 (en) * 2001-04-10 2005-02-10 Bioprocessors Corp. Microreactor architecture and methods
US6521516B2 (en) * 2001-06-29 2003-02-18 Intel Corporation Process for local on-chip cooling of semiconductor devices using buried microchannels
US7032392B2 (en) * 2001-12-19 2006-04-25 Intel Corporation Method and apparatus for cooling an integrated circuit package using a cooling fluid
US6710442B1 (en) * 2002-08-27 2004-03-23 Micron Technology, Inc. Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
JP4034173B2 (ja) * 2002-11-28 2008-01-16 株式会社日立製作所 半導体集積回路装置及びその半導体集積回路チップ
EP1642335B1 (de) * 2003-07-08 2008-08-13 Infineon Technologies AG Integrierte kühl-schaltungsanordnung, betriebsverfahren und herstellungsverfahren
US7029951B2 (en) 2003-09-12 2006-04-18 International Business Machines Corporation Cooling system for a semiconductor device and method of fabricating same
US20050168947A1 (en) * 2003-12-11 2005-08-04 Mok Lawrence S. Chip packaging module with active cooling mechanisms
US7434308B2 (en) * 2004-09-02 2008-10-14 International Business Machines Corporation Cooling of substrate using interposer channels

Also Published As

Publication number Publication date
US20070063337A1 (en) 2007-03-22
EP1768179A3 (de) 2008-09-03
EP1768179B1 (de) 2011-12-28
EP1768179A2 (de) 2007-03-28
US7294926B2 (en) 2007-11-13

Similar Documents

Publication Publication Date Title
ATE539449T1 (de) Chipkühler
WO2006028992A8 (en) Apparatus and method for enhanced heat transfer
DE502004011659D1 (de) Wärmeübertrager, insbesondere luft/luft-kühler
TW200642578A (en) Liquid cooling apparatus
ATE536736T1 (de) Endoskop mit einer kühleinrichtung
NO20060034L (no) Trykkokningsventil
TW200601954A (en) Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit
WO2006086217A3 (en) Vacuum muffle quench furnace
DE50213919D1 (de) Kühlvorrichtung
WO2009038124A1 (ja) 衣類用乾燥装置およびヒートポンプユニット
ATE353313T1 (de) Bauteil eines mikrofluidischen ventils
ITTO20011206A0 (it) Dispositivo regolatore del flusso di un fluido, in particolare per elettrovalvole.
WO2007082676A3 (de) Vorrichtung zur abgaskühlung
DE502007001559D1 (de) Kühlvorrichtung
MX2010005630A (es) Infrabase de valvula de flujo optimizado.
SE0500372L (sv) Laddluftkylare
FI20055029A0 (fi) Elektroniikkalaitteen jäähdytyslaitteisto
WO2008063372A8 (en) Heat sink
DE50303554D1 (de) Klimatisierungseinrichtung fuer eine Arbeitsmaschine insbesondere fuer eine Werkzeugmaschine
MY138510A (en) Using external radiators with electroosmotic pumps for cooling integrated circuits
SE0202764D0 (sv) Kylaranordning för ett motorfordon
ATE555358T1 (de) Kühlvorrichtung
TW200626828A (en) Illumination device with at least one luminous diode and headlight of a vehicle
ATE498763T1 (de) Kühlwasserkanal in einem zylinderkopf
TW200640353A (en) Liquid cooling apparatus