ATE539449T1 - Chipkühler - Google Patents
ChipkühlerInfo
- Publication number
- ATE539449T1 ATE539449T1 AT06076682T AT06076682T ATE539449T1 AT E539449 T1 ATE539449 T1 AT E539449T1 AT 06076682 T AT06076682 T AT 06076682T AT 06076682 T AT06076682 T AT 06076682T AT E539449 T1 ATE539449 T1 AT E539449T1
- Authority
- AT
- Austria
- Prior art keywords
- fluid
- channel
- outlet
- inlet
- bulk region
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/232,499 US7294926B2 (en) | 2005-09-22 | 2005-09-22 | Chip cooling system |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE539449T1 true ATE539449T1 (de) | 2012-01-15 |
Family
ID=37663747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06076682T ATE539449T1 (de) | 2005-09-22 | 2006-09-08 | Chipkühler |
Country Status (3)
Country | Link |
---|---|
US (1) | US7294926B2 (de) |
EP (1) | EP1768179B1 (de) |
AT (1) | ATE539449T1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070126103A1 (en) * | 2005-12-01 | 2007-06-07 | Intel Corporation | Microelectronic 3-D package defining thermal through vias and method of making same |
US7999375B2 (en) * | 2006-10-11 | 2011-08-16 | Formfactor, Inc. | Electronic device with integrated micromechanical contacts and cooling system |
US7608924B2 (en) * | 2007-05-03 | 2009-10-27 | Delphi Technologies, Inc. | Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
US7795726B2 (en) * | 2007-05-03 | 2010-09-14 | Delphi Technologies, Inc. | Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips |
US7592697B2 (en) * | 2007-08-27 | 2009-09-22 | Intel Corporation | Microelectronic package and method of cooling same |
US8035223B2 (en) * | 2007-08-28 | 2011-10-11 | Research Triangle Institute | Structure and process for electrical interconnect and thermal management |
NL1034420C2 (nl) | 2007-09-24 | 2009-03-26 | Thales Nederland Bv | Rechtstreeks geïnjecteerde gedwongen convectiekoeling voor elektronica. |
US20100052157A1 (en) * | 2008-08-29 | 2010-03-04 | Micron Technology, Inc. | Channel for a semiconductor die and methods of formation |
US8624360B2 (en) * | 2008-11-13 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cooling channels in 3DIC stacks |
US7782616B1 (en) | 2009-04-23 | 2010-08-24 | Delphi Technologies, Inc. | Heat-dissipating component having stair-stepped coolant channels |
US8198174B2 (en) * | 2009-08-05 | 2012-06-12 | International Business Machines Corporation | Air channel interconnects for 3-D integration |
US8563365B2 (en) * | 2011-03-09 | 2013-10-22 | Georgia Tech Research Corporation | Air-gap C4 fluidic I/O interconnects and methods of fabricating same |
US8730673B2 (en) | 2011-05-27 | 2014-05-20 | Lockheed Martin Corporation | Fluid-cooled module for integrated circuit devices |
US9035452B2 (en) * | 2012-08-07 | 2015-05-19 | General Electric Company | Electronic device cooling with autonomous fluid routing and method of assembly |
US8987892B2 (en) * | 2013-05-10 | 2015-03-24 | Raytheon Company | Method for creating a selective solder seal interface for an integrated circuit cooling system |
US9041193B2 (en) | 2013-09-17 | 2015-05-26 | Hamilton Sundstrand Corporation | Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel |
US20160025423A1 (en) * | 2014-07-22 | 2016-01-28 | Hamilton Sundstrand Space Systems International, Inc. | Heat transfer plate |
US9837254B2 (en) | 2014-08-12 | 2017-12-05 | Lam Research Corporation | Differentially pumped reactive gas injector |
US10825652B2 (en) | 2014-08-29 | 2020-11-03 | Lam Research Corporation | Ion beam etch without need for wafer tilt or rotation |
US9406535B2 (en) | 2014-08-29 | 2016-08-02 | Lam Research Corporation | Ion injector and lens system for ion beam milling |
US9536748B2 (en) * | 2014-10-21 | 2017-01-03 | Lam Research Corporation | Use of ion beam etching to generate gate-all-around structure |
US9373561B1 (en) | 2014-12-18 | 2016-06-21 | International Business Machines Corporation | Integrated circuit barrierless microfluidic channel |
CN107429976B (zh) | 2015-03-16 | 2021-02-09 | 达纳加拿大公司 | 带有具有用于提高平坦度的表面图案的板的换热器和制造该换热器的方法 |
US9779955B2 (en) | 2016-02-25 | 2017-10-03 | Lam Research Corporation | Ion beam etching utilizing cryogenic wafer temperatures |
US10020243B2 (en) | 2016-03-08 | 2018-07-10 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system |
US10020242B2 (en) * | 2016-04-14 | 2018-07-10 | Hamilton Sundstrand Corporation | Immersion cooling arrangements for electronic devices |
US10121729B2 (en) * | 2016-07-25 | 2018-11-06 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics assemblies having a semiconductor device with metallized embedded cooling channels |
US10615100B2 (en) * | 2016-12-08 | 2020-04-07 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronics assemblies and cooling structures having metalized exterior surface |
US10847374B2 (en) | 2017-10-31 | 2020-11-24 | Lam Research Corporation | Method for etching features in a stack |
US10361092B1 (en) | 2018-02-23 | 2019-07-23 | Lam Research Corporation | Etching features using metal passivation |
CN110167252B (zh) * | 2018-03-26 | 2020-05-05 | 扬宣电子(清远)有限公司 | 一种多层电路板及其制造方法 |
CN113519071A (zh) | 2019-02-28 | 2021-10-19 | 朗姆研究公司 | 利用侧壁清洁的离子束蚀刻 |
US11406010B2 (en) * | 2019-05-21 | 2022-08-02 | Benchmark Electronics, Inc. | Thermal management system and method therefor |
US11387164B2 (en) * | 2019-08-28 | 2022-07-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and manufacturing method thereof |
US11996349B2 (en) * | 2020-05-11 | 2024-05-28 | Dr. Ing. H. C. F. Porsche Ag | Power electronics for an electrical machine, drivetrain, motor vehicle |
WO2023129092A1 (en) | 2021-12-31 | 2023-07-06 | Sabanci Üniversitesi | Integrated circuit systems cooled by embedded microtubes |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3236137B2 (ja) * | 1993-07-30 | 2001-12-10 | 富士通株式会社 | 半導体素子冷却装置 |
US6018192A (en) * | 1998-07-30 | 2000-01-25 | Motorola, Inc. | Electronic device with a thermal control capability |
US20040132166A1 (en) * | 2001-04-10 | 2004-07-08 | Bioprocessors Corp. | Determination and/or control of reactor environmental conditions |
US20050032204A1 (en) * | 2001-04-10 | 2005-02-10 | Bioprocessors Corp. | Microreactor architecture and methods |
US6521516B2 (en) * | 2001-06-29 | 2003-02-18 | Intel Corporation | Process for local on-chip cooling of semiconductor devices using buried microchannels |
US7032392B2 (en) * | 2001-12-19 | 2006-04-25 | Intel Corporation | Method and apparatus for cooling an integrated circuit package using a cooling fluid |
US6710442B1 (en) * | 2002-08-27 | 2004-03-23 | Micron Technology, Inc. | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
JP4034173B2 (ja) * | 2002-11-28 | 2008-01-16 | 株式会社日立製作所 | 半導体集積回路装置及びその半導体集積回路チップ |
EP1642335B1 (de) * | 2003-07-08 | 2008-08-13 | Infineon Technologies AG | Integrierte kühl-schaltungsanordnung, betriebsverfahren und herstellungsverfahren |
US7029951B2 (en) | 2003-09-12 | 2006-04-18 | International Business Machines Corporation | Cooling system for a semiconductor device and method of fabricating same |
US20050168947A1 (en) * | 2003-12-11 | 2005-08-04 | Mok Lawrence S. | Chip packaging module with active cooling mechanisms |
US7434308B2 (en) * | 2004-09-02 | 2008-10-14 | International Business Machines Corporation | Cooling of substrate using interposer channels |
-
2005
- 2005-09-22 US US11/232,499 patent/US7294926B2/en active Active
-
2006
- 2006-09-08 EP EP06076682A patent/EP1768179B1/de active Active
- 2006-09-08 AT AT06076682T patent/ATE539449T1/de active
Also Published As
Publication number | Publication date |
---|---|
US20070063337A1 (en) | 2007-03-22 |
EP1768179A3 (de) | 2008-09-03 |
EP1768179B1 (de) | 2011-12-28 |
EP1768179A2 (de) | 2007-03-28 |
US7294926B2 (en) | 2007-11-13 |
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