DE602007001504D1 - Verfahren zur Bestimmung der Anzahl aktiver Schleifkörner auf einer Abrichtscheibe - Google Patents

Verfahren zur Bestimmung der Anzahl aktiver Schleifkörner auf einer Abrichtscheibe

Info

Publication number
DE602007001504D1
DE602007001504D1 DE602007001504T DE602007001504T DE602007001504D1 DE 602007001504 D1 DE602007001504 D1 DE 602007001504D1 DE 602007001504 T DE602007001504 T DE 602007001504T DE 602007001504 T DE602007001504 T DE 602007001504T DE 602007001504 D1 DE602007001504 D1 DE 602007001504D1
Authority
DE
Germany
Prior art keywords
diamond
determining
active
abrasive grains
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007001504T
Other languages
English (en)
Inventor
Leonard Borucki
Naoki S Rikita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Araca Inc
Original Assignee
Mitsubishi Materials Corp
Araca Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp, Araca Inc filed Critical Mitsubishi Materials Corp
Publication of DE602007001504D1 publication Critical patent/DE602007001504D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B11/00Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE602007001504T 2006-09-28 2007-09-06 Verfahren zur Bestimmung der Anzahl aktiver Schleifkörner auf einer Abrichtscheibe Active DE602007001504D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/528,835 US7410411B2 (en) 2006-09-28 2006-09-28 Method of determining the number of active diamonds on a conditioning disk

Publications (1)

Publication Number Publication Date
DE602007001504D1 true DE602007001504D1 (de) 2009-08-20

Family

ID=38664400

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007001504T Active DE602007001504D1 (de) 2006-09-28 2007-09-06 Verfahren zur Bestimmung der Anzahl aktiver Schleifkörner auf einer Abrichtscheibe

Country Status (8)

Country Link
US (1) US7410411B2 (de)
EP (1) EP1905542B1 (de)
JP (1) JP5055053B2 (de)
KR (1) KR100969723B1 (de)
CN (1) CN101153838B (de)
AT (1) ATE435719T1 (de)
DE (1) DE602007001504D1 (de)
TW (1) TW200823010A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100107726A1 (en) 2008-10-31 2010-05-06 Mitsubishi Materials Corporation Device for determining the coefficient of friction of diamond conditioner discs and a method of use thereof
US20100186479A1 (en) * 2009-01-26 2010-07-29 Araca, Inc. Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
US20100203811A1 (en) * 2009-02-09 2010-08-12 Araca Incorporated Method and apparatus for accelerated wear testing of aggressive diamonds on diamond conditioning discs in cmp
KR101674058B1 (ko) 2010-10-05 2016-11-09 삼성전자 주식회사 패드 컨디셔닝 디스크, 및 프리 컨디셔너 유닛을 포함하는 cmp 장치
JP5886001B2 (ja) * 2011-11-08 2016-03-16 ニッタ・ハース株式会社 コンディショナの評価方法およびコンディショニング方法
TWI583496B (zh) * 2013-05-09 2017-05-21 中國砂輪企業股份有限公司 化學機械研磨修整器之尖點檢測方法及裝置
DE102013111793B4 (de) * 2013-10-25 2018-06-21 Hochschule Furtwangen Verfahren zur Beurteilung der Schneideigenschaften abrasiver Werkzeuge und Einrichtung hierzu
DE102016106796A1 (de) * 2016-04-13 2017-10-19 Hochschule Furtwangen Verfahren und Vorrichtung zur Beurteilung der Oberfläche von Schleifwerkzeugen mit geometrisch unbestimmter Schneide
CN111257319B (zh) * 2020-02-27 2020-10-02 崇左南方水泥有限公司 流体脂磨粒自动检测装置
CN111198146B (zh) * 2020-03-16 2020-12-15 方腾飞 一种rca纸带摩擦机

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5894967A (ja) * 1981-11-30 1983-06-06 Toyota Motor Corp 研削砥石における砥粒の突き出し量測定方法
JPS5894966A (ja) * 1981-11-30 1983-06-06 Toyota Motor Corp 研削砥石における砥粒の突き出し量測定方法
JPH0767669B2 (ja) * 1988-10-20 1995-07-26 株式会社新潟鐵工所 数値制御研削盤における自動砥石寸法測定装置
JP3363587B2 (ja) * 1993-07-13 2003-01-08 キヤノン株式会社 脆性材料の加工方法及びその装置
JPH081512A (ja) * 1994-06-15 1996-01-09 Nikon Corp 微粒砥石のドレッシング状態評価方法
CN1055885C (zh) * 1994-09-16 2000-08-30 清华大学 中凹或中凸廓形超硬磨粒砂轮的修整方法
JPH10557A (ja) * 1996-06-12 1998-01-06 Nippon Steel Corp 研削ホイールの砥粒突出し評価方法
JPH10292055A (ja) * 1997-04-17 1998-11-04 Kuraray Co Ltd 微粒子分散性に優れた成形物および微粒子分散性の評価方法
JP3052896B2 (ja) 1997-06-13 2000-06-19 日本電気株式会社 研磨布表面のドレス治具及びその製造方法
US6551176B1 (en) * 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
JP2002283244A (ja) * 2001-03-27 2002-10-03 Ando Michihiro 仕上げ用砥石及びその製造方法
JP4570286B2 (ja) 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
WO2003055642A1 (fr) * 2001-12-26 2003-07-10 Koyo Machine Industries Co., Ltd. Procede et dispositif permettant de dresser une meule, ainsi que dispositif de meulage
JP2003260642A (ja) * 2002-03-04 2003-09-16 Japan Science & Technology Corp 鏡面研削方法およびその装置
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US7081037B2 (en) * 2003-09-22 2006-07-25 Lsi Logic Corporation Pad conditioner setup
US7097542B2 (en) * 2004-07-26 2006-08-29 Intel Corporation Method and apparatus for conditioning a polishing pad
JP2007030118A (ja) * 2005-07-28 2007-02-08 Renesas Technology Corp ドレッサ検査装置、ドレッサの検査方法、cmp装置およびcmp装置の検査方法

Also Published As

Publication number Publication date
TWI353284B (de) 2011-12-01
KR20080030485A (ko) 2008-04-04
JP2008080480A (ja) 2008-04-10
US20080078231A1 (en) 2008-04-03
ATE435719T1 (de) 2009-07-15
CN101153838B (zh) 2011-04-13
TW200823010A (en) 2008-06-01
EP1905542A1 (de) 2008-04-02
KR100969723B1 (ko) 2010-07-12
CN101153838A (zh) 2008-04-02
JP5055053B2 (ja) 2012-10-24
US7410411B2 (en) 2008-08-12
EP1905542B1 (de) 2009-07-08

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Legal Events

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