DE602005004493D1 - Präzisionsbearbeitungsapparat und Verfahren zur Präzisionsbearbeitung - Google Patents
Präzisionsbearbeitungsapparat und Verfahren zur PräzisionsbearbeitungInfo
- Publication number
- DE602005004493D1 DE602005004493D1 DE602005004493T DE602005004493T DE602005004493D1 DE 602005004493 D1 DE602005004493 D1 DE 602005004493D1 DE 602005004493 T DE602005004493 T DE 602005004493T DE 602005004493 T DE602005004493 T DE 602005004493T DE 602005004493 D1 DE602005004493 D1 DE 602005004493D1
- Authority
- DE
- Germany
- Prior art keywords
- precision machining
- machining apparatus
- precision
- machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004380782A JP4506461B2 (ja) | 2004-12-28 | 2004-12-28 | 精密加工装置および精密加工方法 |
JP2004380782 | 2004-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602005004493D1 true DE602005004493D1 (de) | 2008-03-13 |
DE602005004493T2 DE602005004493T2 (de) | 2009-01-22 |
Family
ID=36013272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005004493T Active DE602005004493T2 (de) | 2004-12-28 | 2005-12-21 | Präzisionsbearbeitungsapparat und Verfahren zur Präzisionsbearbeitung |
Country Status (8)
Country | Link |
---|---|
US (1) | US7247081B2 (de) |
EP (1) | EP1676671B1 (de) |
JP (1) | JP4506461B2 (de) |
KR (1) | KR100748415B1 (de) |
CN (1) | CN100527033C (de) |
DE (1) | DE602005004493T2 (de) |
RU (1) | RU2315391C2 (de) |
TW (1) | TWI308512B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005003013B3 (de) * | 2005-01-21 | 2006-09-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur dynamischen Belastungsprüfung einer Probe |
JP4852868B2 (ja) | 2005-04-04 | 2012-01-11 | トヨタ自動車株式会社 | 精密加工方法 |
JP4839720B2 (ja) * | 2005-08-04 | 2011-12-21 | トヨタ自動車株式会社 | 精密加工装置 |
CN102626899B (zh) * | 2011-04-28 | 2014-09-03 | 北京市电加工研究所 | 一种磁斥力自动恒压进给装置 |
RU2494852C1 (ru) * | 2012-07-17 | 2013-10-10 | Владимир Юрьевич Карасев | Способ обработки поверхности твердого тела |
RU2534854C1 (ru) * | 2013-06-04 | 2014-12-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Владимирский государственный университет имени Александра Григорьевича и Николая Григорьевича Столетовых" (ВлГУ) | Устройство прецизионного механического позиционирования |
CN104493651B (zh) * | 2014-12-10 | 2017-03-08 | 东莞市天合机电开发有限公司 | 一种新型外圆磨装置 |
RU2686826C1 (ru) * | 2018-03-28 | 2019-04-30 | Михаил Леонидович Галкин | Магнитострикционный теплоноситель |
CN109108755B (zh) * | 2018-10-31 | 2023-09-15 | 浙江登亿自动化设备股份有限公司 | 全自动平面磨床的磨削机构 |
IT202000004819A1 (it) * | 2020-03-06 | 2021-09-06 | Bottero Spa | Unita' di molatura o lucidatura di una lastra, in particolare una lastra di vetro, e metodo di lavorazione lastra utilizzante tale unita' |
CN112692700A (zh) * | 2020-12-28 | 2021-04-23 | 柳友香 | 一种冷轧机免更换自给进除锈设备 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4840860B1 (de) * | 1970-08-28 | 1973-12-03 | ||
JPS5016551B1 (de) * | 1970-12-19 | 1975-06-13 | ||
JPS55101369A (en) * | 1979-01-30 | 1980-08-02 | Toyoda Mach Works Ltd | Sizing device corrected at measuring position responsive to boring diameter |
JPS56126574A (en) * | 1980-02-29 | 1981-10-03 | Toyoda Mach Works Ltd | Safety device for feeding movable mount |
US4528743A (en) * | 1982-01-16 | 1985-07-16 | Hauni-Werke Korber & Co. Kg | Grinding machine with magazine for spare grinding wheels |
DE3826277A1 (de) * | 1987-08-04 | 1989-02-16 | Yamazaki Mazak Corp | Werkzeugmaschine mit einer schleiffunktion, umfassend eine elektroerosionsaus-/zurichtvorrichtung, ein schleifwerkzeug und eine spansammelvorrichtung |
JPH01171747A (ja) * | 1987-12-25 | 1989-07-06 | Matsushita Electric Ind Co Ltd | 研削加工装置 |
JPH07270559A (ja) * | 1994-03-31 | 1995-10-20 | Chichibu Onoda Cement Corp | 密封式超精密微動装置 |
JP3052201B2 (ja) * | 1998-11-06 | 2000-06-12 | 茨城県 | 精密平面加工機械 |
JP2001265441A (ja) * | 2000-03-15 | 2001-09-28 | Hirotami Nakano | 微細位置決め装置および微細位置決め方法 |
US6447379B1 (en) * | 2000-03-31 | 2002-09-10 | Speedfam-Ipec Corporation | Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |
JP4530479B2 (ja) * | 2000-05-24 | 2010-08-25 | 弘 江田 | 精密加工装置 |
JP2002127003A (ja) | 2000-10-26 | 2002-05-08 | Hiroshi Eda | 姿勢制御装置付精密加工装置及び姿勢制御方法 |
JP2003165042A (ja) * | 2001-11-29 | 2003-06-10 | Okamoto Machine Tool Works Ltd | 基板用乾式研磨装置および基板の乾式研磨方法 |
JP2004235201A (ja) * | 2003-01-28 | 2004-08-19 | Okamoto Machine Tool Works Ltd | 基板の乾式化学機械研磨方法および乾式化学機械研磨装置 |
-
2004
- 2004-12-28 JP JP2004380782A patent/JP4506461B2/ja not_active Expired - Fee Related
-
2005
- 2005-12-21 EP EP05257932A patent/EP1676671B1/de not_active Not-in-force
- 2005-12-21 DE DE602005004493T patent/DE602005004493T2/de active Active
- 2005-12-27 TW TW094146802A patent/TWI308512B/zh not_active IP Right Cessation
- 2005-12-27 US US11/316,886 patent/US7247081B2/en not_active Expired - Fee Related
- 2005-12-27 KR KR1020050130367A patent/KR100748415B1/ko not_active IP Right Cessation
- 2005-12-27 RU RU2005141119/28A patent/RU2315391C2/ru not_active IP Right Cessation
- 2005-12-28 CN CNB2005100974048A patent/CN100527033C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060194510A1 (en) | 2006-08-31 |
EP1676671B1 (de) | 2008-01-23 |
KR100748415B1 (ko) | 2007-08-10 |
RU2005141119A (ru) | 2007-07-10 |
JP2006181703A (ja) | 2006-07-13 |
RU2315391C2 (ru) | 2008-01-20 |
KR20060076704A (ko) | 2006-07-04 |
TWI308512B (en) | 2009-04-11 |
JP4506461B2 (ja) | 2010-07-21 |
US7247081B2 (en) | 2007-07-24 |
CN100527033C (zh) | 2009-08-12 |
CN1797256A (zh) | 2006-07-05 |
TW200626296A (en) | 2006-08-01 |
DE602005004493T2 (de) | 2009-01-22 |
EP1676671A1 (de) | 2006-07-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |