DE60143328D1 - Inspektionssystem für Halbleiter - Google Patents
Inspektionssystem für HalbleiterInfo
- Publication number
- DE60143328D1 DE60143328D1 DE60143328T DE60143328T DE60143328D1 DE 60143328 D1 DE60143328 D1 DE 60143328D1 DE 60143328 T DE60143328 T DE 60143328T DE 60143328 T DE60143328 T DE 60143328T DE 60143328 D1 DE60143328 D1 DE 60143328D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductors
- inspection system
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4185—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication
- G05B19/41855—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication by local area network [LAN], network structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L67/00—Network arrangements or protocols for supporting network services or applications
- H04L67/01—Protocols
- H04L67/10—Protocols in which an application is distributed across nodes in the network
- H04L67/1097—Protocols in which an application is distributed across nodes in the network for distributed storage of data in networks, e.g. transport arrangements for network file system [NFS], storage area networks [SAN] or network attached storage [NAS]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31323—Database for CIM
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31326—Database to manage communication networks
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Networks & Wireless Communication (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Signal Processing (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001048932A JP2002252161A (ja) | 2001-02-23 | 2001-02-23 | 半導体製造システム |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60143328D1 true DE60143328D1 (de) | 2010-12-02 |
Family
ID=18910116
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60143328T Expired - Lifetime DE60143328D1 (de) | 2001-02-23 | 2001-08-20 | Inspektionssystem für Halbleiter |
DE60134954T Expired - Lifetime DE60134954D1 (de) | 2001-02-23 | 2001-08-20 | Produktionanordnung für Halbleiter |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60134954T Expired - Lifetime DE60134954D1 (de) | 2001-02-23 | 2001-08-20 | Produktionanordnung für Halbleiter |
Country Status (6)
Country | Link |
---|---|
US (5) | US6591207B2 (de) |
EP (3) | EP1983551B1 (de) |
JP (1) | JP2002252161A (de) |
KR (1) | KR100455992B1 (de) |
DE (2) | DE60143328D1 (de) |
TW (1) | TW514977B (de) |
Families Citing this family (56)
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JP2002252161A (ja) * | 2001-02-23 | 2002-09-06 | Hitachi Ltd | 半導体製造システム |
JP3873696B2 (ja) | 2001-09-18 | 2007-01-24 | 株式会社日立製作所 | 電力半導体モジュール及び電力変換装置 |
US6973633B2 (en) * | 2002-07-24 | 2005-12-06 | George Lippincott | Caching of lithography and etch simulation results |
US6959251B2 (en) * | 2002-08-23 | 2005-10-25 | Kla-Tencor Technologies, Corporation | Inspection system setup techniques |
US20050038554A1 (en) * | 2003-07-14 | 2005-02-17 | Cory Watkins | Inspection and metrology module cluster tool |
JP4414690B2 (ja) * | 2003-07-14 | 2010-02-10 | 株式会社日立ハイテクノロジーズ | 半導体製造システム |
KR100524472B1 (ko) * | 2003-07-18 | 2005-10-31 | 삼성전자주식회사 | 반도체공정장치 및 공정진단방법 |
JP2005209850A (ja) * | 2004-01-22 | 2005-08-04 | Toshiba Corp | 半導体装置の設計システムと製造システム |
GB0406663D0 (en) * | 2004-03-24 | 2004-04-28 | Cavendish Kinetics Ltd | Information management and tracking system (IMTS) |
JP4645174B2 (ja) * | 2004-11-29 | 2011-03-09 | 横河電機株式会社 | 固体撮像素子検査システム |
JP2006171113A (ja) * | 2004-12-13 | 2006-06-29 | Toshiba Corp | マスクデータ作成装置、マスクデータ作成方法、露光マスク、半導体装置の製造方法及びマスクデータ作成プログラム |
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US7343581B2 (en) * | 2005-06-27 | 2008-03-11 | Tela Innovations, Inc. | Methods for creating primitive constructed standard cells |
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US9009641B2 (en) | 2006-03-09 | 2015-04-14 | Tela Innovations, Inc. | Circuits with linear finfet structures |
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US8247846B2 (en) | 2006-03-09 | 2012-08-21 | Tela Innovations, Inc. | Oversized contacts and vias in semiconductor chip defined by linearly constrained topology |
US8658542B2 (en) | 2006-03-09 | 2014-02-25 | Tela Innovations, Inc. | Coarse grid design methods and structures |
US7932545B2 (en) | 2006-03-09 | 2011-04-26 | Tela Innovations, Inc. | Semiconductor device and associated layouts including gate electrode level region having arrangement of six linear conductive segments with side-to-side spacing less than 360 nanometers |
US9230910B2 (en) | 2006-03-09 | 2016-01-05 | Tela Innovations, Inc. | Oversized contacts and vias in layout defined by linearly constrained topology |
US9035359B2 (en) | 2006-03-09 | 2015-05-19 | Tela Innovations, Inc. | Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods |
US8245180B2 (en) | 2006-03-09 | 2012-08-14 | Tela Innovations, Inc. | Methods for defining and using co-optimized nanopatterns for integrated circuit design and apparatus implementing same |
US8448102B2 (en) | 2006-03-09 | 2013-05-21 | Tela Innovations, Inc. | Optimizing layout of irregular structures in regular layout context |
US8839175B2 (en) | 2006-03-09 | 2014-09-16 | Tela Innovations, Inc. | Scalable meta-data objects |
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US8541879B2 (en) | 2007-12-13 | 2013-09-24 | Tela Innovations, Inc. | Super-self-aligned contacts and method for making the same |
US9563733B2 (en) | 2009-05-06 | 2017-02-07 | Tela Innovations, Inc. | Cell circuit and layout with linear finfet structures |
US8225239B2 (en) | 2006-03-09 | 2012-07-17 | Tela Innovations, Inc. | Methods for defining and utilizing sub-resolution features in linear topology |
US7548824B2 (en) * | 2006-06-27 | 2009-06-16 | Intel Corporation | Automated analysis system for semiconductor manufacturing fabrication |
JP4814716B2 (ja) * | 2006-07-26 | 2011-11-16 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
US7577049B1 (en) | 2006-08-08 | 2009-08-18 | Tela Innovations, Inc. | Speculative sense enable tuning apparatus and associated methods |
JP2008076169A (ja) * | 2006-09-20 | 2008-04-03 | Olympus Corp | 基板検査システム |
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US20040081350A1 (en) * | 1999-08-26 | 2004-04-29 | Tadashi Kitamura | Pattern inspection apparatus and method |
JP4545252B2 (ja) * | 1999-09-01 | 2010-09-15 | 東京エレクトロン株式会社 | 半導体製造装置 |
US6621571B1 (en) * | 1999-10-29 | 2003-09-16 | Hitachi, Ltd. | Method and apparatus for inspecting defects in a patterned specimen |
JP4585649B2 (ja) * | 2000-05-19 | 2010-11-24 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
JP3595756B2 (ja) * | 2000-06-01 | 2004-12-02 | キヤノン株式会社 | 露光装置、リソグラフィ装置、ロードロック装置、デバイス製造方法およびリソグラフィ方法 |
US6622286B1 (en) * | 2000-06-30 | 2003-09-16 | Lam Research Corporation | Integrated electronic hardware for wafer processing control and diagnostic |
US6898305B2 (en) * | 2001-02-22 | 2005-05-24 | Hitachi, Ltd. | Circuit pattern inspection method and apparatus |
JP3559766B2 (ja) * | 2001-02-21 | 2004-09-02 | キヤノン株式会社 | 走査露光装置及び走査露光方法並びにデバイスの製造方法 |
JP2002252161A (ja) * | 2001-02-23 | 2002-09-06 | Hitachi Ltd | 半導体製造システム |
US7248716B2 (en) * | 2001-07-06 | 2007-07-24 | Palantyr Research, Llc | Imaging system, methodology, and applications employing reciprocal space optical design |
-
2001
- 2001-02-23 JP JP2001048932A patent/JP2002252161A/ja active Pending
- 2001-08-20 EP EP08012854A patent/EP1983551B1/de not_active Expired - Lifetime
- 2001-08-20 DE DE60143328T patent/DE60143328D1/de not_active Expired - Lifetime
- 2001-08-20 EP EP08012855A patent/EP1983552A1/de not_active Withdrawn
- 2001-08-20 EP EP01119623A patent/EP1246229B1/de not_active Expired - Lifetime
- 2001-08-20 DE DE60134954T patent/DE60134954D1/de not_active Expired - Lifetime
- 2001-08-23 TW TW090120761A patent/TW514977B/zh not_active IP Right Cessation
- 2001-08-29 KR KR10-2001-0052401A patent/KR100455992B1/ko not_active IP Right Cessation
- 2001-08-29 US US09/942,425 patent/US6591207B2/en not_active Expired - Lifetime
-
2003
- 2003-05-27 US US10/444,981 patent/US6850854B2/en not_active Expired - Fee Related
-
2004
- 2004-12-22 US US11/017,795 patent/US20050119843A1/en not_active Abandoned
-
2006
- 2006-10-05 US US11/543,204 patent/US20070027569A1/en not_active Abandoned
-
2008
- 2008-01-23 US US12/010,279 patent/US7526352B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20020069088A (ko) | 2002-08-29 |
EP1246229A2 (de) | 2002-10-02 |
US20080125903A1 (en) | 2008-05-29 |
EP1983551B1 (de) | 2010-10-20 |
US6591207B2 (en) | 2003-07-08 |
US7526352B2 (en) | 2009-04-28 |
US6850854B2 (en) | 2005-02-01 |
US20020120417A1 (en) | 2002-08-29 |
EP1246229B1 (de) | 2008-07-23 |
US20070027569A1 (en) | 2007-02-01 |
JP2002252161A (ja) | 2002-09-06 |
TW514977B (en) | 2002-12-21 |
DE60134954D1 (de) | 2008-09-04 |
EP1983552A1 (de) | 2008-10-22 |
US20030220754A1 (en) | 2003-11-27 |
US20050119843A1 (en) | 2005-06-02 |
EP1246229A3 (de) | 2006-02-01 |
EP1983551A1 (de) | 2008-10-22 |
KR100455992B1 (ko) | 2004-11-15 |
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