DE60140093D1 - Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem Teil - Google Patents
Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem TeilInfo
- Publication number
- DE60140093D1 DE60140093D1 DE60140093T DE60140093T DE60140093D1 DE 60140093 D1 DE60140093 D1 DE 60140093D1 DE 60140093 T DE60140093 T DE 60140093T DE 60140093 T DE60140093 T DE 60140093T DE 60140093 D1 DE60140093 D1 DE 60140093D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- carbon fiber
- fiber reinforced
- cooling plate
- concave part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000014809A JP2001210761A (ja) | 2000-01-24 | 2000-01-24 | 半導体装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60140093D1 true DE60140093D1 (de) | 2009-11-19 |
Family
ID=18542206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60140093T Expired - Lifetime DE60140093D1 (de) | 2000-01-24 | 2001-01-18 | Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem Teil |
Country Status (5)
Country | Link |
---|---|
US (2) | US6713863B2 (de) |
EP (1) | EP1120830B1 (de) |
JP (1) | JP2001210761A (de) |
KR (1) | KR20010076329A (de) |
DE (1) | DE60140093D1 (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3446826B2 (ja) * | 2000-04-06 | 2003-09-16 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
US6737298B2 (en) * | 2002-01-23 | 2004-05-18 | St Assembly Test Services Ltd | Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same |
DE10215654A1 (de) * | 2002-04-09 | 2003-11-06 | Infineon Technologies Ag | Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung |
JP2003309228A (ja) * | 2002-04-18 | 2003-10-31 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US6750552B1 (en) * | 2002-12-18 | 2004-06-15 | Netlogic Microsystems, Inc. | Integrated circuit package with solder bumps |
TWI233190B (en) * | 2003-02-11 | 2005-05-21 | Via Tech Inc | Structure of chip package and process thereof |
US7239024B2 (en) * | 2003-04-04 | 2007-07-03 | Thomas Joel Massingill | Semiconductor package with recess for die |
TWI315094B (en) * | 2003-04-25 | 2009-09-21 | Advanced Semiconductor Eng | Flip chip package |
JP3786103B2 (ja) * | 2003-05-02 | 2006-06-14 | セイコーエプソン株式会社 | 半導体装置、電子デバイス、電子機器および半導体装置の製造方法 |
US6821816B1 (en) * | 2003-06-13 | 2004-11-23 | Delphi Technologies, Inc. | Relaxed tolerance flip chip assembly |
US6875636B2 (en) * | 2003-07-14 | 2005-04-05 | Delphi Technologies, Inc. | Wafer applied thermally conductive interposer |
TWI376756B (en) * | 2003-07-30 | 2012-11-11 | Taiwan Semiconductor Mfg | Ground arch for wirebond ball grid arrays |
US7012326B1 (en) | 2003-08-25 | 2006-03-14 | Xilinx, Inc. | Lid and method of employing a lid on an integrated circuit |
JP3929966B2 (ja) * | 2003-11-25 | 2007-06-13 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP4641423B2 (ja) | 2004-02-18 | 2011-03-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN1998077B (zh) * | 2004-05-20 | 2010-06-16 | 斯班逊有限公司 | 半导体装置的制造方法及半导体装置 |
TWI259566B (en) * | 2004-08-31 | 2006-08-01 | Via Tech Inc | Exposed heatsink type semiconductor package and manufacture process thereof |
TW200636954A (en) * | 2005-04-15 | 2006-10-16 | Siliconware Precision Industries Co Ltd | Thermally enhanced semiconductor package and fabrication method thereof |
JP4208863B2 (ja) * | 2005-06-30 | 2009-01-14 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2007042719A (ja) | 2005-08-01 | 2007-02-15 | Nec Electronics Corp | 半導体装置 |
KR100824250B1 (ko) * | 2005-08-01 | 2008-04-24 | 엔이씨 일렉트로닉스 가부시키가이샤 | 금속 리드 부재를 피쳐링하는 반도체 패키지 |
KR100765478B1 (ko) | 2005-08-12 | 2007-10-09 | 삼성전자주식회사 | 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치 |
US7388284B1 (en) | 2005-10-14 | 2008-06-17 | Xilinx, Inc. | Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit |
US7416923B2 (en) * | 2005-12-09 | 2008-08-26 | International Business Machines Corporation | Underfill film having thermally conductive sheet |
JP2007184351A (ja) | 2006-01-05 | 2007-07-19 | Nec Electronics Corp | 半導体装置及びその製造方法 |
US20080001277A1 (en) * | 2006-06-30 | 2008-01-03 | Tsrong Yi Wen | Semiconductor package system and method of improving heat dissipation of a semiconductor package |
JP2008153305A (ja) * | 2006-12-14 | 2008-07-03 | Nec Electronics Corp | 半導体装置 |
TWI379363B (en) * | 2007-04-24 | 2012-12-11 | United Test & Assembly Ct Lt | Bump on via-packaging and methodologies |
US7906857B1 (en) | 2008-03-13 | 2011-03-15 | Xilinx, Inc. | Molded integrated circuit package and method of forming a molded integrated circuit package |
JP2009290118A (ja) * | 2008-05-30 | 2009-12-10 | Toshiba Corp | 電子機器 |
US20100052156A1 (en) * | 2008-08-27 | 2010-03-04 | Advanced Semiconductor Engineering, Inc. | Chip scale package structure and fabrication method thereof |
US8097944B2 (en) * | 2009-04-30 | 2012-01-17 | Infineon Technologies Ag | Semiconductor device |
US8362607B2 (en) * | 2009-06-03 | 2013-01-29 | Honeywell International Inc. | Integrated circuit package including a thermally and electrically conductive package lid |
US8362609B1 (en) | 2009-10-27 | 2013-01-29 | Xilinx, Inc. | Integrated circuit package and method of forming an integrated circuit package |
FR2957192B1 (fr) * | 2010-03-03 | 2013-10-25 | Hispano Suiza Sa | Module electronique de puissance pour un actionneur pour aeronef |
JP5572890B2 (ja) * | 2010-06-08 | 2014-08-20 | ミヨシ電子株式会社 | 半導体モジュールおよび半導体装置 |
US8810028B1 (en) | 2010-06-30 | 2014-08-19 | Xilinx, Inc. | Integrated circuit packaging devices and methods |
JP2012033559A (ja) | 2010-07-28 | 2012-02-16 | J Devices:Kk | 半導体装置 |
JP5955500B2 (ja) * | 2010-10-25 | 2016-07-20 | 稔之 新井 | 放熱構造 |
US9072199B2 (en) | 2010-12-27 | 2015-06-30 | Src, Inc. | Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug |
JP2012164846A (ja) * | 2011-02-08 | 2012-08-30 | Renesas Electronics Corp | 半導体装置、半導体装置の製造方法、及び表示装置 |
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CN104576568A (zh) * | 2013-10-15 | 2015-04-29 | 日月光半导体制造股份有限公司 | 半导体封装件及其制造方法 |
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JP2016092300A (ja) * | 2014-11-07 | 2016-05-23 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
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US6727422B2 (en) * | 2000-09-18 | 2004-04-27 | Chris Macris | Heat sink/heat spreader structures and methods of manufacture |
US6512295B2 (en) * | 2001-03-01 | 2003-01-28 | International Business Machines Corporation | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses |
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2000
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- 2001-01-12 US US09/760,396 patent/US6713863B2/en not_active Expired - Lifetime
- 2001-01-18 DE DE60140093T patent/DE60140093D1/de not_active Expired - Lifetime
- 2001-01-18 EP EP01300405A patent/EP1120830B1/de not_active Expired - Lifetime
- 2001-01-18 KR KR1020010002822A patent/KR20010076329A/ko not_active Application Discontinuation
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2004
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KR20010076329A (ko) | 2001-08-11 |
US20010009302A1 (en) | 2001-07-26 |
US6864120B2 (en) | 2005-03-08 |
JP2001210761A (ja) | 2001-08-03 |
US20040166609A1 (en) | 2004-08-26 |
EP1120830B1 (de) | 2009-10-07 |
EP1120830A3 (de) | 2002-05-22 |
EP1120830A2 (de) | 2001-08-01 |
US6713863B2 (en) | 2004-03-30 |
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