FR2957192B1 - Module electronique de puissance pour un actionneur pour aeronef - Google Patents

Module electronique de puissance pour un actionneur pour aeronef

Info

Publication number
FR2957192B1
FR2957192B1 FR1000866A FR1000866A FR2957192B1 FR 2957192 B1 FR2957192 B1 FR 2957192B1 FR 1000866 A FR1000866 A FR 1000866A FR 1000866 A FR1000866 A FR 1000866A FR 2957192 B1 FR2957192 B1 FR 2957192B1
Authority
FR
France
Prior art keywords
aircraft
power module
electronic power
actuator
fastened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1000866A
Other languages
English (en)
Other versions
FR2957192A1 (fr
Inventor
Mathieu Charlas
Jean Pierre Habas
Valerie Nassiet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electrical and Power SAS
Original Assignee
Hispano Suiza SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hispano Suiza SA filed Critical Hispano Suiza SA
Priority to FR1000866A priority Critical patent/FR2957192B1/fr
Priority to US13/037,671 priority patent/US20110215194A1/en
Publication of FR2957192A1 publication Critical patent/FR2957192A1/fr
Application granted granted Critical
Publication of FR2957192B1 publication Critical patent/FR2957192B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
FR1000866A 2010-03-03 2010-03-03 Module electronique de puissance pour un actionneur pour aeronef Active FR2957192B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1000866A FR2957192B1 (fr) 2010-03-03 2010-03-03 Module electronique de puissance pour un actionneur pour aeronef
US13/037,671 US20110215194A1 (en) 2010-03-03 2011-03-01 Electronic power module for an aircraft actuator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1000866A FR2957192B1 (fr) 2010-03-03 2010-03-03 Module electronique de puissance pour un actionneur pour aeronef

Publications (2)

Publication Number Publication Date
FR2957192A1 FR2957192A1 (fr) 2011-09-09
FR2957192B1 true FR2957192B1 (fr) 2013-10-25

Family

ID=42667274

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1000866A Active FR2957192B1 (fr) 2010-03-03 2010-03-03 Module electronique de puissance pour un actionneur pour aeronef

Country Status (2)

Country Link
US (1) US20110215194A1 (fr)
FR (1) FR2957192B1 (fr)

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US7180173B2 (en) * 2003-11-20 2007-02-20 Taiwan Semiconductor Manufacturing Co. Ltd. Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)
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Also Published As

Publication number Publication date
US20110215194A1 (en) 2011-09-08
FR2957192A1 (fr) 2011-09-09

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Legal Events

Date Code Title Description
TP Transmission of property

Owner name: LABINAL POWER SYSTEMS, FR

Effective date: 20150312

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

CA Change of address

Effective date: 20171002

CA Change of address

Effective date: 20171218

CD Change of name or company name

Owner name: SAFRAN ELECTRICAL & POWER, FR

Effective date: 20171218

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Year of fee payment: 9

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